Abstract: A phenolic compound which can be obtained by reacting the compound of the formula (1): wherein R1 groups are each independently present and represent a hydrogen atom etc. with the formula (6): wherein R4 groups are each independently present and represent a hydrogen atom etc.; and k represents the number of R4 groups and is an integer of 0 to 4 and an epoxy resin which can be obtained by reacting the phenolic compound with an epihalohydrin are excellent in solvent solubility and also of which cured product has an excellent thermal conductance.

Abstract: In order to offer a cup dispenser which does not require to change cylinders to meet with different cup sizes and allows to change cup sizes easily by adjusting a stopper means in accordance with various sizes of cups to be stored, and the cup dispenser is made to be composed of an outer cylinder where cups are stored, an inner cylinder fitted at the cup-outlet side of the outer cylinder and a single or plural number of springs mounted at the above mentioned outer cylinder. The outer cylinder is made of a metallic material, and the inner cylinder is made of a joint-free synthetic resin. A few cup size grooves are etched along a perimeter of the body of the inner cylinder for a free end of a spring stopper held by the above mentioned outer cylinder with the other end to be hooked and released freely. At the same time, a flange placed at the cup-outlet end of the above mentioned outer cylinder has an indication to indicate a few different cup sizes.

Abstract: A predetermined portion of a wiring substrate having wiring patterns obtained by etching a copper layer formed on an insulating substrated is covered with a plating resistant first insulating film, then a portion of lead patterns is covered by a removable and plating resistance second film. Then overplated coating is applied onto predetermined wiring patterns and thereafter the second film is removed. Thereafter only lead patterns are selectively etched off.