Patents by Inventor Kouichi Misumi

Kouichi Misumi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Negative photoresist compositions for the formation of thick films, photoresist films and methods of forming bumps using the same
    Patent number: 7419769
    Abstract: A negative photoresist composition is used for the formation of thick films and includes (A) a novolak resin, (B) a plasticizer, (C) a crosslinking agent and (D) an acid generator. The composition is applied onto a substrate and thereby yields a photoresist film 5 to 100 ?m thick. Likewise, the composition is applied onto a substrate of an electronic part, is patterned, is plated and thereby yields a bump.
    Type: Grant
    Filed: October 26, 2005
    Date of Patent: September 2, 2008
    Assignee: Tokyo Ohka Kogyo Co., Ltd.
    Inventors: Koji Saito, Kouichi Misumi, Toshiki Okui, Hiroshi Komano
  • Negative photoresist compositions for the formation of thick films, photoresist films and methods of forming bumps using the same
    Patent number: 7129018
    Abstract: A negative photoresist composition is used for the formation of thick films and includes (A) a novolak resin, (B) a plasticizer, (C) a crosslinking agent and (D) an acid generator. The composition is applied onto a substrate and thereby yields a photoresist film 5 to 100 ?m thick. Likewise, the composition is applied onto a substrate of an electronic part, is patterned, is plated and thereby yields a bump.
    Type: Grant
    Filed: October 26, 2005
    Date of Patent: October 31, 2006
    Assignee: Toyko Ohka Kogyo Co., Ltd.
    Inventors: Koji Saito, Kouichi Misumi, Toshiki Okui, Hiroshi Komano
  • Negative photoresist compositions for the formation of thick films, photoresist films and methods of forming bumps using the same
    Patent number: 7063934
    Abstract: A negative photoresist composition is used for the formation of thick films and includes (A) a novolak resin, (B) a plasticizer, (C) a crosslinking agent and (D) an acid generator. The composition is applied onto a substrate and thereby yields a photoresist film 5 to 100 ?m thick. Likewise, the composition is applied onto a substrate of an electronic part, is patterned, is plated and thereby yields a bump.
    Type: Grant
    Filed: May 20, 2002
    Date of Patent: June 20, 2006
    Assignee: Toyko Ohka Kogyo Co., Ltd.
    Inventors: Koji Saito, Kouichi Misumi, Toshiki Okui, Hiroshi Komano
  • Negative photoresist compositions for the formation of thick films, photoresist films and methods of forming bumps using the same
    Publication number: 20060035170
    Abstract: A negative photoresist composition is used for the formation of thick films and includes (A) a novolak resin, (B) a plasticizer, (C) a crosslinking agent and (D) an acid generator. The composition is applied onto a substrate and thereby yields a photoresist film 5 to 100 ?m thick. Likewise, the composition is applied onto a substrate of an electronic part, is patterned, is plated and thereby yields a bump.
    Type: Application
    Filed: October 26, 2005
    Publication date: February 16, 2006
    Inventors: Koji Saito, Kouichi Misumi, Toshiki Okui, Hiroshi Komano
  • Negative photoresist compositions for the formation of thick films, photoresist films and methods of forming bumps using the same
    Publication number: 20060035169
    Abstract: A negative photoresist composition is used for the formation of thick films and includes (A) a novolak resin, (B) a plasticizer, (C) a crosslinking agent and (D) an acid generator. The composition is applied onto a substrate and thereby yields a photoresist film 5 to 100 ?m thick. Likewise, the composition is applied onto a substrate of an electronic part, is patterned, is plated and thereby yields a bump.
    Type: Application
    Filed: October 26, 2005
    Publication date: February 16, 2006
    Inventors: Koji Saito, Kouichi Misumi, Toshiki Okui, Hiroshi Komano
  • Positive photoresist composition for the formation of thick films, photoresist film and method of forming bumps using the same
    Patent number: 6641972
    Abstract: A positive photoresist composition includes an alkali-soluble novolak resin (A), an alkali-soluble acrylic resin (B) and a quinonediazido-group-containing compound (C) and is used for the formation of a thick film 5 to 100 &mgr;m thick. The ingredient (B) includes 30% to 90% by weight of a unit (b1) derived from a polymerizable compound having an ether bond and 2% to 50% by weight of a unit (b2) derived from a polymerizable compound having a carboxyl group. The composition is applied on a substrate and thereby yields a photoresist film. Likewise, the composition is applied onto a substrate on an electronic part, is patterned, is plated and thereby yields bumps.
    Type: Grant
    Filed: March 5, 2002
    Date of Patent: November 4, 2003
    Assignee: Tokyo Ohka Kogyo Co., Ltd.
    Inventors: Kouichi Misumi, Koji Saito, Toshiki Okui, Hiroshi Komano
  • Negative photoresist compositions for the formation of thick films, photoresist films and methods of forming bumps using the same
    Publication number: 20030064319
    Abstract: A negative photoresist composition is used for the formation of thick films and includes (A) a novolak resin, (B) a plasticizer, (C) a crosslinking agent and (D) an acid generator. The composition is applied onto a substrate and thereby yields a photoresist film 5 to 100 &mgr;m thick. Likewise, the composition is applied onto a substrate of an electronic part, is patterned, is plated and thereby yields a bump.
    Type: Application
    Filed: May 20, 2002
    Publication date: April 3, 2003
    Applicant: TOKYO OHKA KOGYO CO., LTD.
    Inventors: Koji Saito, Kouichi Misumi, Toshiki Okui, Hiroshi Komano
  • Positive photoresist composition for the formation of thick films, photoresist film and method of forming bumps using the same
    Publication number: 20030059706
    Abstract: A positive photoresist composition includes an alkali-soluble novolak resin(A), an alkali-soluble acrylic resin (B) and a quinonediazido-group-containing compound (C) and is used for the formation of a thick film 5 to 100 &mgr;m thick. The ingredient (B) includes 30% to 90% by weight of a unit (b1) derived from a polymerizable compound having an ether bond and 2% to 50% by weight of a unit (b2) derived from a polymerizable compound having a carboxyl group. The composition is applied on a substrate and thereby yields a photoresist film. Likewise, the composition is applied onto a substrate on an electronic part, is patterned, is plated and thereby yields bumps.
    Type: Application
    Filed: March 5, 2002
    Publication date: March 27, 2003
    Applicant: TOKYO OHKA KOGYO CO., LTD.
    Inventors: Kouichi Misumi, Koji Saito, Toshiki Okui, Hiroshi Komano