Abstract: Using image data on a plurality of reduced object images to calculate a shift amount in regard to the gap of relative positions between the reduced object images by a correlation calculation between the reduced object images. A conversion equation is obtained from the shift amount for geometric projection process from the object image to each of the reduced object images. Initial image data on a single object image is generated using image data on the plurality of reduced object images. The above are used to estimate images of each of the reduced object images. A difference between the estimated image of the reduced object images and the reduced object images is projected in the reverse process of the geometric projection process, updating the image data on the single object image. The processes are repeated until the difference satisfies a predetermined condition and a high resolution object image is outputted.

Abstract: Using image data on a plurality of reduced object images to calculate a shift amount in regard to the gap of relative positions between the reduced object images by a correlation calculation between the reduced object images. A conversion equation is obtained from the shift amount for geometric projection process from the object image to each of the reduced object images. Initial image data on a single object image is generated using image data on the plurality of reduced object images. This and the aforementioned conversion equation, are used to estimate images of each of the reduced object images. A difference between the estimated image of each of the reduced object images and each of the reduced object images is projected in the reverse process of the aforementioned geometric projection process, to update the image data on the single object image. The processes are repeated until the difference satisfies a predetermined condition and a high resolution object image is outputted.

Abstract: A circuit substrate with a built-in coil has layers comprising respectively a wiring sheet, magnetic material, a flat coil, and magnetic material, which are overlaid. The wiring circuit sheet is made of polyimide, on which a circuit pattern is formed. The magnetic material is formed of a plurality of overlaid amorphous alloy sheets having slits and put together with adhesive. The flat coil may be formed by winding a copper wire covered with insulating film. The coil component, including the magnetic material and the flat coil, and the wiring circuit sheet are adhered to each other with the circuit pattern and the coil component being electrically connected to each other.

Abstract: An electronic component comprising a generally cylindrical body having a pair of terminal caps mounted on respective opposite ends of the body. Each of the terminal caps has layers of solder material formed on inner and outer surface areas thereof. The thickness of the layer of solder material on the outer surface area of each of the terminal caps is made smaller than that on the inner surface area of the same terminal cap.