Abstract: A plasma processing apparatus and method which includes a vacuum processing chamber, a plasma generating unit, a process gas supply unit, a specimen table, and a vacuum pumping unit. The specimen table includes an electrostatic arrangement for holding a specimen on a holding surface of the specimen table, a specimen table cover made of an insulator arranged around the specimen table, and first and second heat transfer gas supply units. The first heat transfer gas supply unit has a main path for supplying a heat transfer gas to the specimen holding surface, and the second heat transfer gas supply unit has a branch path branched from the main path of the first heat transfer gas supply unit for directly supplying a part of the heat transfer gas to a gap between an outer portion of the specimen holding surface and the specimen table cover for cooling the specimen table cover.

Abstract: A plasma processing apparatus and method which includes a vacuum processing chamber, a plasma generating unit, a process gas supply unit, a specimen table, and a vacuum pumping unit. The specimen table includes an electrostatic arrangement for holding a specimen on a holding surface of the specimen table by electrostatic force, a specimen table cover arranged around the specimen table, and first and second heat transfer gas supply units. The first heat transfer gas supply unit has a main path for supplying a heat transfer gas to the specimen holding surface for cooling the specimen, and the second heat transfer gas supply unit has a branch path branched from the main path of the first heat transfer gas supply unit for supplying a part of the heat transfer gas to a gap between an outer portion of the specimen holding surface and the specimen table cover.

Abstract: A plasma processing apparatus having a plasma generating unit, a process chamber including an outer cylinder for withstanding a reduced pressure, and an inner cylinder made of non-magnetic material and being replaceable, arranged inside the outer cylinder, a process gas supply unit for supplying gas to the process chamber, a specimen table for holding a specimen and a vacuum pumping unit. A temperature monitoring unit monitors temperature of the inner cylinder, and a controller controls temperature of the outer cylinder. A desired inner cylinder temperature which is inputted in advance in response to a processing condition of the specimen is compared with the monitored temperature of the inner cylinder, and the controller controls the temperature of the outer cylinder in response to a result of the comparison so as to control the inner cylinder temperature to a predetermined value.

Abstract: A plasma processing method utilizing a plasma processing apparatus having a plasma generating unit, a process chamber including an outer cylinder for withstanding a reduced pressure, and an inner cylinder made of non-magnetic material and being replaceable arranged inside the outer cylinder, a process gas supply unit for supplying gas to the process chamber, a specimen table for holding a specimen and a vacuum pumping unit. A temperature of the inner cylinder is monitored, and a desired inner cylinder temperature which is inputted in advance in response to a processing condition of the specimen is compared with the monitored temperature of the inner cylinder. A temperature of the outer cylinder is controlled in response to a result of the comparison so as to control the inner cylinder temperature to a predetermined value.

Abstract: A plasma processing apparatus and method which includes a vacuum processing chamber, a plasma generating unit, a process gas supply unit, a specimen table, and a vacuum pumping unit. The specimen table includes an electrostatic arrangement for holding a specimen on a holding surface of the specimen table by electrostatic force, a specimen table cover arranged around the specimen table, and first and second heat transfer gas supply units. The first heat transfer gas supply unit has a main path for supplying a heat transfer gas to the specimen holding surface for cooling the specimen, and the second heat transfer gas supply unit has a branch path branched from the main path of the first heat transfer gas supply unit for supplying a part of the heat transfer gas to a gap between an outer portion of the specimen holding surface and the specimen table cover.

Abstract: A plasma processing apparatus having a plasma generating unit, a process chamber including an outer cylinder for withstanding a reduced pressure, and an inner cylinder made of non-magnetic material and being replaceable, arranged inside the outer cylinder, a process gas supply unit for supplying gas to the process chamber, a specimen table for holding a specimen and a vacuum pumping unit. A temperature monitoring unit monitors temperature of the inner cylinder, and a controller controls temperature of the outer cylinder. A desired inner cylinder temperature which is inputted in advance in response to a processing condition of the specimen is compared with the monitored temperature of the inner cylinder, and the controller controls the temperature of the outer cylinder in response to a result of the comparison so as to control the inner cylinder temperature to a predetermined value.

Abstract: A plasma processing method utilizing a plasma processing apparatus having a plasma generating unit, a process chamber including an outer cylinder for withstanding a reduced pressure, and an inner cylinder made of non-magnetic material and being replaceable arranged inside the outer cylinder, a process gas supply unit for supplying gas to the process chamber, a specimen table for holding a specimen and a vacuum pumping unit. A temperature of the inner cylinder is monitored, and a desired inner cylinder temperature which is inputted in advance in response to a processing condition of the specimen is compared with the monitored temperature of the inner cylinder. A temperature of the outer cylinder is controlled in response to a result of the comparison so as to control the inner cylinder temperature to a predetermined value.

Abstract: The present invention is a workpiece holder for polishing comprising at least a workpiece holder body having multiple perforated holes for holding a workpiece by vacuum adsorption and a back plate disposed on the back side of the body, which is provided with temperature controlling means or cooling means for the holder body. Thus, there is provided a workpiece holder for polishing, a polishing apparatus and a polishing method, which can provide a workpiece having good flatness by suppressing thermal deformation of the workpiece holder body and deformation of a resin film coated on the workpiece holding surface without degrading flatness of a workpiece held on the workpiece holder in the polishing of the workpiece, even when the number of polishing operation increases.

Abstract: The present invention is a workpiece holder for polishing comprising at least a workpiece holder body having multiple perforated holes for holding a workpiece by vacuum adsorption and a back plate disposed on the back side of the body, which is provided with temperature controlling means or cooling means for the holder body. Thus, there is provided a workpiece holder for polishing, a polishing apparatus and a polishing method, which can provide a workpiece having good flatness by suppressing thermal deformation of the workpiece holder body and deformation of a resin film coated on the workpiece holding surface without degrading flatness of a workpiece held on the workpiece holder in the polishing of the workpiece, even when the number of polishing operation increases.

Abstract: A workpiece holder for polishing comprising a workpiece holder body which is provided with multiple perforated holes for holding a workpiece by vacuum suction and a holder back plate which is closely contacted with a back face of the holder body and has grooves for vacuum, wherein the holder back plate is composed of a synthetic resin and has an Asker C hardness of 70 or higher but lower than 98, and an apparatus for polishing a workpiece and a method for polishing a workpiece utilizing it. By improving the material of holder back plate of a workpiece holder for polishing that holds a workpiece by vacuum suction to enhance sealing with the holder body, thereby developing such a holder back plate that should not transfer deformation of the holder body to the workpiece surface, even if polishing agent slurry is introduced and solidified, to provide a workpiece holder for polishing having a workpiece holding surface of high precision, an apparatus for polishing a workpiece and a method for polishing a workpiece.

Abstract: There is disclosed a method of processing a work comprising polishing a work holding surface 4a of a work holding plate 4 by contacting and rubbing a work holding surface 4a of a work holding plate 4 with a polishing pad 2 attached on a polishing turn table 1 with providing polishing agent 5 thereto, holding a wafer W on said work holding surface 4a by vacuum-holding, and contacting and rubbing the wafer W with said polishing pad 2 to polish the work with providing polishing agent 5 wherein temperature of the polishing agent 5 or the polishing turn table 1 is controlled by temperature controller 7,9 so that a temperature of said work holding surface 4a when polishing said work holding plate 4 and a temperature of said work holding surface 4a when polishing the wafer w are controlled to be the same.

Abstract: By improving the material of workpiece holder body of a workpiece holder for polishing that holds a workpiece by vacuum adsorption, and the material of resin film for coating a workpiece holding surface of the holder, and developing a method for coating the surface with a resin, which does not cause blocking of perforated holes of the holder body with the resin during the resin coating process, there are provided a workpiece holder for polishing having a workpiece holding surface of high precision, and a method for producing it. According to the present invention, there are provided a workpiece holder for polishing having a workpiece holder body provided with multiple perforated holes for holding a workpiece by vacuum adsorption, wherein a holding surface of the holder body is coated with a coating film formed by applying a thermosetting resin on the holding surface and curing it with heating, and a surface of the coating film is polished, and a method for producing it.

Abstract: A polishing method and a polishing apparatus that are for making contact pressure between a work and a polishing pad substantially uniform within surfaces to obtain a work having good quality. A turn table (2) is supported by a grooved surface of a turn table receiving member (3b), the grooved surface being provided with grooves (9b) in a straight direction, a work (W) is pressed against a polishing pad (8) adhered to the turn table (2) while flowing polishing slurry, and a polishing is carried out by rotating the work (W) and the turn table (2).

Abstract: A plasma processing apparatus is provided. In the apparatus, an inside surface of a process chamber is prevented from having its quality varied or becoming a heavy metal contamination source by plasma in the chamber, and at the same time the plasma characteristic is stabilized over time. In a plasma processing apparatus including a plasma generating unit, a process chamber capable of having its inside pressure reduced, a gas supply system for supplying a gas to the process chamber, a sample table for holding a sample and a vacuum pumping system, the process chamber has an outer cylinder capable of withstanding depressurization and an inner cylinder arranged inside the outer cylinder and being spaced therefrom through a gap, and a heater and a temperature control are provided in the outer cylinder. A non-magnetic metallic material not containing heavy metals, or ceramic, carbon, silicon or quartz is used for the inner cylinder.

Abstract: A crankshaft angle sensor comprising a crankshaft angle sensing element (33) mounted to a housing (35) and a circuit board (37) mounted to the housing (35) and having an electronic circuit thereon. The electronic circuit is electrically connected to the crankshaft angle sensing element (33) for controlling an ignition timing of an internal combustion engine. The crankshaft angle sensing element (33) and the circuit board (37) are disposed in the direction substantially parallel to the axis of the distributor rotary shaft (31). The crankshaft angle sensing element (33) and the electronic circuit board (37) are electrically connected through a plurality of leads (33aa, 33bb, 38) and insert conductors (44, 54) having a parallel-gap-welded connection portion extending in a direction substantially perpendicular to the rotary shaft (31).

Abstract: An angle measuring device for measuring the turning angle of a crankshaft in an internal combustion engine in order to control the ignition timing, etc.

Abstract: An angle measuring device for measuring the turning angle of a crankshaft in an internal combustion engine in order to control, for example, the ignition timing thereof comprises: a rotating disc which is adapted to rotate in synchronization with a crankshaft and which has a plurality of slits formed along the circumference thereof; light-emitting elements arranged in the vicinity of the rotating disc; light-receiving elements adapted to receive light emitted from the light-emitting elements through the slits of the rotating disc; and a signal processing circuit adapted to process signals output from the light-receiving elements and including: a semiconductor substrate, a plurality of islands formed on the surface of the semiconductor substrate from diffusion layers, a protective-resistor element formed in one of the islands and connected to the light-emitting means, and separation layers separating the island on which the protective-resistor element is formed from the other islands, no other elements being f

Abstract: An ignition device for an internal combustion engine includes a transistor circuit used to turn a primary current of an ignition coil on and off to produce a high voltage for spark ignition. A reference voltage generator produces a temperature compensated reference voltage. A primary current detecting circuit produces a voltage corresponding to a primary current of the ignition coil. A comparator compares the temperature compensated reference voltage with the voltage produced by the primary current detecting circuit. A control circuit responsive to an output of the comparator controls a base voltage of the transistor circuit to a predetermined constant value.

Abstract: A corner holder for use with a box of corrugated cardboard having a pair of slots in sidewalls thereof adjacent to a corner of the box, comprises a pair of inserts each including a tongue-shaped base plate and a U-shaped flange on the base plate, and a flexible connector web joined between the inserts. The base plate and the flange jointly define a channel or groove extending along opposite side edges and an arcuate bottom edge of the base plate. When the corner holder is installed on the box, the inserts are inserted in the slots, respectively, with edges of the sidewalls which define the slots being fitted in the grooves in the inserts. The corner of the box is thus clamped and reinforced by the corner holder. The box can readily be folded into a collapsed form simply by removing the inserts out of the slots.

Abstract: This invention relates to a device for fixing fasteners to the flaps of corrugated cardboard boxes for sealing the flaps. With the fastener placed across the adjoining edges of at least two flaps, piercing nails in the form of a cow horn and attached to a pair of turnable pieces on the fastener are driven into the flaps by the device. The device is characterized in that two reciprocally movable sliders (12, 13) move to drive a cutting blade (17), causing the blade to separate a fastener from other fasteners, and subsequently drive pivotal members (29a, 29b) to depress the turnable pieces on the fastener, driving the piercing nails into the flaps. Fasteners can be fixed in place easily and reliably.