Abstract: A hinge, can be used for a stand of an electronic device, includes: a first hinge shaft that is provided in a rotation fulcrum of a rotary body and rotatably supports the rotary body from first rotational position to second rotational position; a second hinge shaft that is provided in parallel with the first hinge shaft; a coupling member that couples the first hinge shaft and the second hinge shaft together and is rotatably supported by the second hinge shaft; a stopper that is provided to the coupling member and regulates the second rotational position by abutting the rotary body; and a rotation restriction mechanism that restricts rotation of the coupling member until a load in a rotational direction, which is exerted on the coupling member with respect to the second hinge shaft as a center, exceeds a threshold load.

Abstract: A heat dissipation component includes a plate that presses a heat receiving portion against a heat generating portion, and a heat pipe installed at a first surface side of the plate to be in contact with the heat receiving portion, wherein the plate has a shape of an equilateral triangle in plan view from a normal direction of the first surface of the plate, an outer circumferential portion of the plate, except for a portion between each two vertexes of the equilateral triangle, is bent to the first surface side of the plate, and the heat pipe extends to an outside of the plate through a non-bent portion in the outer circumferential portion of the plate.

Abstract: A heat dissipation component includes a plate that presses a heat receiving portion against a heat generating portion, and a heat pipe installed at a first surface side of the plate to be in contact with the heat receiving portion, wherein the plate has a shape of an equilateral triangle in plan view from a normal direction of the first surface of the plate, an outer circumferential portion of the plate, except for a portion between each two vertexes of the equilateral triangle, is bent to the first surface side of the plate, and the heat pipe extends to an outside of the plate through a non-bent portion in the outer circumferential portion of the plate.

Abstract: A hinge, can be used for a stand of an electronic device, includes: a first hinge shaft that is provided in a rotation fulcrum of a rotary body and rotatably supports the rotary body from first rotational position to second rotational position; a second hinge shaft that is provided in parallel with the first hinge shaft; a coupling member that couples the first hinge shaft and the second hinge shaft together and is rotatably supported by the second hinge shaft; a stopper that is provided to the coupling member and regulates the second rotational position by abutting the rotary body; and a rotation restriction mechanism that restricts rotation of the coupling member until a load in a rotational direction, which is exerted on the coupling member with respect to the second hinge shaft as a center, exceeds a threshold load.

Abstract: A personal computer (electronic apparatus) (1) is equipped with a plurality of heat generating devices: a power source unit (11), a CPU (12), an FD drive device (13), a CD/DVD drive device (14), and an LCD (15), and a cooling fan (16) for cooling the plurality of heat generating devices (11) through (15). The plurality of heat generating devices (11) through (15) are arranged in parallel in a direction Y which crosses a central axis (16c) of an impeller (16b) of the cooling fan (16). Further, the heat generating devices (11) through (15) are arranged within a blowing range (21) of the cooling fan (16).

Abstract: A personal computer (electronic apparatus) (1) is equipped with a plurality of heat generating devices: a power source unit (11), a CPU (12), an FD drive device (13), a CD/DVD drive device (14), and an LCD (15), and a cooling fan (16) for cooling the plurality of heat generating devices (11) through (15). The plurality of heat generating devices (11) through (15) are arranged in parallel in a direction Y which crosses a central axis (16c) of an impeller (16b) of the cooling fan (16). Further, the heat generating devices (11) through (15) are arranged within a blowing range (21) of the cooling fan (16).

Abstract: An attaching device is provided for mounting and fixing a semiconductor device and a heat sink provided on the semiconductor device on a board. The attaching device includes a base part fixed to the board, a rotation member provided to the base part rotatably, the rotation member rotated and received at the base part so that the semiconductor device is fixed to the board, and a press mechanism that presses the heat sink to the semiconductor device when the rotation member is rotated.

Abstract: An attaching device is provided for mounting and fixing a semiconductor device and a heat sink provided on the semiconductor device on a board. The attaching device includes a base part fixed to the board, a rotation member provided to the base part rotatably, the rotation member rotated and received at the base part so that the semiconductor device is fixed to the board, and a press mechanism that presses the heat sink to the semiconductor device when the rotation member is rotated.

Abstract: An attaching device is provided for mounting and fixing a device for generating heat, such as a semiconductor device, and a heat sink provided on the device for generating heat on a board. The attaching device includes a base part fixed to the board, a rotation member provided to the base part rotatably, the rotation member rotated and received at the base part so that the device for generating heat, is fixed to the board, and a press mechanism that presses the heat sink to the device for generating heat when the rotation member is rotated.

Abstract: An attaching device is provided for mounting and fixing a semiconductor device and a heat sink provided on the semiconductor device on a board. The attaching device includes a base part fixed to the board, a rotation member provided to the base part rotatably, the rotation member rotated and received at the base part so that the semiconductor device is fixed to the board, and a press mechanism that presses the heat sink to the semiconductor device when the rotation member is rotated.