Abstract: A method for work quality control of a worker in work where repetitive operation is performed which includes: a model construction step of statistically constructing, from past path data of the worker, past intermediate quality data on a product to be subjected to the work, and past final quality data on the product to be subjected to the work, a prediction model that receives the path data and the intermediate quality data and outputs the final quality data; a worker position recognition step of recognizing a position of the worker from image data on the work captured; and an unusual worker position determining step of substituting the position of the worker recognized in the worker position recognition step into the model constructed in the model construction step, to determine whether the position of the target worker is a usual one or an unusual one.

Abstract: A method for work quality control of a worker in work where repetitive operation is performed which includes: a model construction step of statistically constructing, from past path data of the worker, past intermediate quality data on a product to be subjected to the work, and past final quality data on the product to be subjected to the work, a prediction model that receives the path data and the intermediate quality data and outputs the final quality data; a worker position recognition step of recognizing a position of the worker from image data on the work captured; and an unusual worker position determining step of substituting the position of the worker recognized in the worker position recognition step into the model constructed in the model construction step, to determine whether the position of the target worker is a usual one or an unusual one.

Abstract: A photosensitive resin composition for a flexible circuit board capable of suppressing warpage occurrence after heat curing, and a flexible circuit board obtained by using the same. The photosensitive resin composition includes (A) a carboxyl-group containing linear polymer having a glass transition temperature of not more than 55° C. obtained by addition polymerizing an ethylenic unsaturated compound; (B) a polymerizable compound containing an ethylenic unsaturated group; and (C) a photopolymerization initiator.

Abstract: A photosensitive resin composition for a flexible circuit board having excellent flame retardancy and with non-halogenation for consideration of environmental aspects, and a flexible circuit board obtained by using the same. The photosensitive resin composition includes (A) a linear polymer containing a carboxyl group obtained by addition polymerizing an ethylenic unsaturated compound; (B) a polymerizable compound containing an ethylenic unsaturated group; (C) a photopolymerization initiator: and (D) a phosphorated epoxy resin containing phosphorous atom at not less than 2% by weight based on a total molecular weight thereof.