Abstract: The present invention is directed to an adapter device for electronic equipment, which is adapted to have ability to load another electronic equipment at a loading unit of the existing IC card, and comprises a casing (31) loaded at a host equipment (1), a loading portion (35) in which the IC card (10) is loaded, a terminal portion (53) for performing transmission/reception of data to and from the host equipment provided at front surface (31a) side serving as insertion side into the host equipment, an insertion/withdrawal opening (52) for IC card provided in a manner continuous to the loading portion, a connecting terminal (44) electrically connected to a terminal portion and connected to a terminal portion (12) of the IC card, and cut portions (67), (68) having dimensions different from each other, which allow the rear surface side of the IC card formed at surfaces opposite to each other of the rear surface side of the casing to be exposed.

Abstract: The present invention holds a card-like electronic appliance, such as a semiconductor storage medium or an expansion module, and makes it difficult for dust, dirt and moisture to adhere to the card-like electronic appliance. The invention also makes it possible for card-like electronic appliances to be easily and appropriately held, stored, and organized, even when there are a large number of card-like electronic appliances. The card-like electronic appliance holder includes a holder main body with an appliance insertion hole into which at least part of a card-like electronic appliance is inserted, and is provided with a support part with a through-hole for hanging the holder main body. A convex part for engaging a concave part provided in the card-like electronic appliance and holding the card-like electronic appliance is provided inside the appliance insertion hole.

Abstract: The present invention is directed to an adapter device for electronic equipment, which is adapted to have ability to load another electronic equipment at a loading unit of the existing IC card, and comprises a casing (31) loaded at a host equipment (1), a loading portion (35) in which the IC card (10) is loaded, a terminal portion (53) for performing transmission/reception of data to and from the host equipment provided at front surface (31a) side serving as insertion side into the host equipment, an insertion/withdrawal opening (52) for IC card provided in a manner continuous to the loading portion, a connecting terminal (44) electrically connected to a terminal portion and connected to a terminal portion (12) of the IC card, and cut portions (67), (68) having dimensions different from each other, which allow the rear surface side of the IC card formed at surfaces opposite to each other of the rear surface side of the casing to be exposed.

Abstract: Spacers used in a picture display device are formed of a sintered product having a structure in which at least one kind of metal selected from the group consisting of Si, Zn, Al, Sn, Cu and Mg is dispersed in a glass. In the picture display device using spacers, therefore, the spacers are effectively prevented from being electrically charged and, besides, trouble such as distortion in the displayed picture caused by the electric charge in the spacers is effectively prevented, too. In producing the spacers by firing, further, the volume expands due to the oxidation of the metal component, whereby shrinkage due to firing is effectively relaxed, making it possible to produce the spacers maintaining a high dimensional precision. Besides, the spacers are effectively prevented from being deformed by the shrinkage caused by firing.

Abstract: The present invention holds a card-like electronic appliance, such as a semiconductor storage medium or an expansion module, and makes it difficult for dust, dirt and moisture to adhere to the card-like electronic appliance. The invention also makes it possible for card-like electronic appliances to be easily and appropriately held, stored, and organized, even when there are a large number of card-like electronic appliances. The card-like electronic appliance holder includes a holder main body with an appliance insertion hole into which at least part of a card-like electronic appliance is inserted, and is provided with a support part with a through-hole for hanging the holder main body. A convex part for engaging a concave part provided in the card-like electronic appliance and holding the card-like electronic appliance is provided inside the appliance insertion hole.

Abstract: The present invention holds a card-like electronic appliance, such as a semiconductor storage medium or an expansion module, and makes it difficult for dust, dirt and moisture to adhere to the card-like electronic appliance. The invention also makes it possible for card-like electronic appliances to be easily and appropriately held, stored, and organized, even when there are a large number of card-like electronic appliances. The card-like electronic appliance holder includes a holder main body with an appliance insertion hole into which at least part of a card-like electronic appliance is inserted, and is provided with a support part with a through-hole for hanging the holder main body. A convex part for engaging a concave part provided in the card-like electronic appliance and holding the card-like electronic appliance is provided inside the appliance insertion hole.

Abstract: Upon fabrication of semiconductor devices, a semiconductor substrate is subjected to ion implantation with high energy. Subsequent annealing of the ion-implanted semiconductor substrate, when conducted by heating the substrate to a temperature of from 1,000° C. to 1,200° C. at a ramp-up rate of at least 200° C./sec, makes it possible to provide the resulting semiconductor devices with smaller leakage currents of reduced variations (&sgr;/X). The present invention can therefore provide a process for the fabrication of semiconductor devices featuring both smaller leakage currents and reduced variations of the leakage currents even when ion implantation is conducted with high energy.

Abstract: Upon fabrication of semiconductor devices, a semiconductor substrate is subjected to ion implantation with high energy. Subsequent annealing of the ion-implanted semiconductor substrate, when conducted by heating the substrate to a temperature of from 1,000° C. to 1,200° C. at a ramp-up rate of at least 200° C./sec, makes it possible to provide the resulting semiconductor devices with smaller leakage currents of reduced variations (&sgr;/X). The present invention can therefore provide a process for the fabrication of semiconductor devices featuring both smaller leakage currents and reduced variations of the leakage currents even when ion implantation is conducted with high energy.