Abstract: A semiconductor device includes first and second wiring layers, and first and second via plugs. The first wiring layer has parallel tracks along which wirings are laid out, the tracks including first and second outer tracks and an inner track between the first and second outer tracks, the wirings including a first line laid out along the first outer track and having an end portion that is laid out along the first outer track, and a second line laid out along the inner track and having an end portion that is laid out along the first outer track. The first via plug is in contact with the end portion of the first line and extends between the first and second wiring layers, and the second via plug is in contact with the end portion of the second line and extends between the first and second wiring layers.

Abstract: The laser welding device includes a laser transmission window and a gas injection nozzle. The gas injection nozzle includes an optical path hole and an injection unit that injects an inert gas for shielding metal vapor into the optical path hole toward an irradiation direction side and an optical axis side of a laser beam.

Abstract: A method for manufacturing a laminated structure, or a method for manufacturing a liquid ejection head substrate having an electrode pad, including: preparing a substrate on which a first layer is formed, foreign matter being present on a surface of the first layer; forming a mask layer on an entire area of a surface of the substrate, the surface of the substrate being provided with the first layer; removing at least a part of the foreign matter in a height direction by performing an etching treatment on the entire surface of the mask layer; and forming a second layer on a surface on which the etching treatment is performed, wherein the etching treatment is performed so that the foreign matter is not exposed from the second layer after forming the second layer.

Abstract: A method of manufacturing a semiconductor substrate includes: forming a barrier metal layer on a semiconductor substrate; forming a resist mask on the barrier metal layer; performing dry etching on a portion of the barrier metal layer, which is exposed from an opening portion of the resist mask, so that the dry etching is prevented from reaching a top surface of a layer immediately under the barrier metal layer; performing wet etching on a portion of the barrier metal layer exposed by the dry etching so that the wet etching reaches the top surface of the layer immediately under the barrier metal layer and a portion of the barrier metal layer remains; and stripping the resist mask.

Abstract: A method of manufacturing a semiconductor substrate includes: forming a barrier metal layer on a semiconductor substrate; forming a resist mask on the barrier metal layer; performing dry etching on a portion of the barrier metal layer, which is exposed from an opening portion of the resist mask, so that the dry etching is prevented from reaching a top surface of a layer immediately under the barrier metal layer; performing wet etching on a portion of the barrier metal layer exposed by the dry etching so that the wet etching reaches the top surface of the layer immediately under the barrier metal layer and a portion of the barrier metal layer remains; and stripping the resist mask.

Abstract: A method for manufacturing a liquid-discharge-head substrate includes providing a substrate having an energy-generating element and a pad, the pad having a wiring layer and a contact-probe receiving section, the contact-probe receiving section having a Vickers hardness that is higher than a Vickers hardness of the wiring layer; bringing a contact probe into contact with the contact-probe receiving section; and performing an electrical inspection by bringing the contact probe into contact with the wiring layer in the pad.

Abstract: A method for producing a liquid-ejection-head substrate includes providing a substrate having an energy-generating element and a pad, the pad including a wiring layer, the wiring layer in the pad having a relatively thick portion and a relatively thin portion and performing electrical inspection by applying a contact probe to the relatively thin portion of the wiring layer in the pad.

Abstract: A method for producing a liquid-ejection-head substrate includes providing a substrate having an energy-generating element and a pad, the pad including a wiring layer, the wiring layer in the pad having a relatively thick portion and a relatively thin portion and performing electrical inspection by applying a contact probe to the relatively thin portion of the wiring layer in the pad.

Abstract: A method for manufacturing a liquid-discharge-head substrate includes providing a substrate having an energy-generating element and a pad, the pad having a wiring layer and a contact-probe receiving section, the contact-probe receiving section having a Vickers hardness that is higher than a Vickers hardness of the wiring layer; bringing a contact probe into contact with the contact-probe receiving section; and performing an electrical inspection by bringing the contact probe into contact with the wiring layer in the pad.

Abstract: A liquid ejection head includes a print element board and an electric wiring board electrically connected to a bump of the print element board using an interconnecting wire. The bump has a first surface and a second surface. The height of the second surface from a surface of a base plate is higher than that of the first surface. The first surface has a protrusion formed therein, and the bump is connected to the interconnecting wire in the second surface.

Abstract: A device substrate includes a substrate body having an energy generating device provided thereon, where the energy generating device generates energy for ejecting liquid, an ejection port forming member disposed on the substrate body, where the ejection port forming member has a pressure chamber that surrounds the energy generating device and an ejection port that communicates with the pressure chamber, and a supply port configured to supply the liquid to the pressure chamber. The ejection port forming member has a first surface that is in contact with the substrate body and a second surface other than the first surface, and the supply port is formed in the second surface.

Abstract: A liquid ejection head and a printing apparatus can perform high-quality printing by suppressing the shrinkage stress of an adhesive joining a substrate and a flow path forming member and the deformation and peeling of the flow path forming member. A stress dispersing section is formed on the side surface of the substrate.

Abstract: There are provided a liquid ejection head and a printing apparatus capable of performing high-quality printing by suppressing the shrinkage stress of an adhesive joining a substrate and a flow path forming member and the deformation and peeling of the flow path forming member. A stress dispersing section 11 is formed on the side surface of the substrate 1.

Abstract: A method for manufacturing a liquid ejection head includes the steps of: disposing an etching mask layer on a substrate having a first face and a second face that is on an opposite side of the first face, the etching mask layer being disposed on the second face; forming a concave line pattern at a region of the etching mask layer other than a region where an opening for the support port is to be formed; providing an etching opening at the etching mask layer; performing anisotropic etching from a side of the second face using the etching mask layer provided with the etching opening as a mask, thus forming the supply port at the substrate; comparing the line pattern with a recess generated at the substrate, thus selecting a device chip for liquid ejection; and connecting the selected device chip to a liquid supply part.

Abstract: The method of manufacturing a liquid ejection head includes: forming a first protective layer on one surface of the substrate; forming the wiring layer on another surface of the substrate; forming the insulating layer on the wiring layer, and then partially removing the insulating layer to partially expose the wiring layer; forming the electrode pad on an exposed portion of the wiring layer; forming a flow path member on the another surface of the substrate; forming a second protective layer on the one surface of the substrate after the formation of the flow path member; and partially removing at least one of the first protective layer and the second protective layer, and then forming the supply port leading from the one surface of the substrate to the another surface of the substrate.

Abstract: A device substrate includes a substrate body having an energy generating device provided thereon, where the energy generating device generates energy for ejecting liquid, an ejection port forming member disposed on the substrate body, where the ejection port forming member has a pressure chamber that surrounds the energy generating device and an ejection port that communicates with the pressure chamber, and a supply port configured to supply the liquid to the pressure chamber. The ejection port forming member has a first surface that is in contact with the substrate body and a second surface other than the first surface, and the supply port is formed in the second surface.

Abstract: A method for manufacturing a liquid ejection head includes the steps of: disposing an etching mask layer on a substrate having a first face and a second face that is on an opposite side of the first face, the etching mask layer being disposed on the second face; forming a concave line pattern at a region of the etching mask layer other than a region where an opening for the support port is to be formed; providing an etching opening at the etching mask layer; performing anisotropic etching from a side of the second face using the etching mask layer provided with the etching opening as a mask, thus forming the supply port at the substrate; comparing the line pattern with a recess generated at the substrate, thus selecting a device chip for liquid ejection; and connecting the selected device chip to a liquid supply part.

Abstract: A liquid ejection head includes a print element board and an electric wiring board electrically connected to a bump of the print element board using an interconnecting wire. The bump has a first surface and a second surface. The height of the second surface from a surface of a base plate is higher than that of the first surface. The first surface has a protrusion formed therein, and the bump is connected to the interconnecting wire in the second surface.

Abstract: The method of manufacturing a liquid ejection head includes: forming a first protective layer on one surface of the substrate; forming the wiring layer on another surface of the substrate; forming the insulating layer on the wiring layer, and then partially removing the insulating layer to partially expose the wiring layer; forming the electrode pad on an exposed portion of the wiring layer; forming a flow path member on the another surface of the substrate; forming a second protective layer on the one surface of the substrate after the formation of the flow path member; and partially removing at least one of the first protective layer and the second protective layer, and then forming the supply port leading from the one surface of the substrate to the another surface of the substrate.

Abstract: Provided is a liquid ejection head, including: an ejection orifice forming member having an ejection orifice for ejecting liquid; a substrate having a supply port for supplying the liquid to the ejection orifice; and a filter disposed at a position upstream of the ejection orifice when the liquid is supplied to the ejection orifice, in which the filter includes an opening having a diameter smaller than or equal to a diameter of the ejection orifice, and a tapered shape structure disposed at a position upstream of the opening when the liquid is supplied to the ejection orifice, the tapered shape structure having a distal end directed toward an upstream side.