Patents by Inventor Kouji Ikari

Kouji Ikari has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Package for semiconductor devices with first and second metal layers on the substrate of said package
    Patent number: 4229758
    Abstract: A package for sealing an MOS type semiconductor element having a die-attach area comprising a first metal layer composed of gold and a second metal layer composed of a metal having a good bondability to aluminum metal, which is electrically connected to the first metal layer.
    Type: Grant
    Filed: February 9, 1979
    Date of Patent: October 21, 1980
    Assignee: Kyoto Ceramic Co., Ltd.
    Inventor: Kouji Ikari