Abstract: A data management system comprises: an outsourcer terminal outsourcing a fabrication by an instruction document; an outsourcee terminal receiving outsourcing and/or sub-outsourcing; and a server device. The server device comprises: a data management unit managing a proprietary authority of data stored in a data storage unit; an order container storage unit storing an order container with which data stored in the data storage unit is correlated, for each order created in an order creation unit of the outsourcer terminal and/or the outsourcee terminal; and an order container management unit managing sharing of the order container, based on an instruction from an order container sharing authority management unit of the outsourcer terminal and/or the outsourcee terminal. The server device, for each order, correlates any format of data element stored with the order container, for management.

Abstract: A lock device includes a base attached to a lid, a knob having a grip portion movably supported on a front side of the base and an arm portion projecting rearward with respect to the grip portion, a slider slidably supported in a rear part of the base so as to move slidingly by being pushed by the arm portion in response to a movement of the knob, a first rod and a second rod slidably supported by a part of the base located in front of the slider in a vertically arranged manner so as to be engaged by and disengaged from a pair of corresponding engaging holes, and a power transmission mechanism provided between the slider and the first rod and the second rod so that the first rod and the second rod are slidingly moved in response to a movement of the slider.

Abstract: A lock device includes a base attached to a lid, a knob having a grip portion movably supported on a front side of the base and an arm portion projecting rearward with respect to the grip portion, a slider slidably supported in a rear part of the base so as to move slidingly by being pushed by the arm portion in response to a movement of the knob, a first rod and a second rod slidably supported by a part of the base located in front of the slider in a vertically arranged manner so as to be engaged by and disengaged from a pair of corresponding engaging holes, and a power transmission mechanism provided between the slider and the first rod and the second rod so that the first rod and the second rod are slidingly moved in response to a movement of the slider.

Abstract: Plural thermoplastic resin films, each having a circuit pattern formed thereon, are laminated. Via-holes filled with conductor paste are formed in the thermoplastic films to electrically connect neighboring layers. The laminated body is pressed under heat between a pair of hot press plates to thereby form an integral body of multi-layer circuit board. To apply a uniform pressure to the laminated body in the pressing process, a projected portion formed on a pressure-adjusting sheet is pushed against a portion of the laminated body where the number of laminated circuit patterns is smaller than other portions. In this manner, the plural thermoplastic films are uniformly bonded together, and the paste in the via-holes is sufficiently converted into an alloy. Thus, reliability of the laminated multi-layer circuit board is enhanced.

Abstract: A multi-layer substrate connecting to an external electric device includes: a plurality of resin films; and a plurality of conductive patterns. The resin films are stacked together with the conductive patterns. The conductive pattern includes an inner conductive pattern and a surface conductive pattern. The inner conductive pattern is disposed inside of the multi-layer substrate for providing an inner circuit. The surface conductive pattern is exposed on the multi-layer substrate for connecting to the external electric device. The surface conductive pattern has a thickness in a stacking direction, which is thicker than a thickness of the inner conductive pattern.

Abstract: In a method of manufacturing a multilayer printed circuit board, a plurality of insulating substrates each having a first surface and a second surface is prepared. A circuit pattern is formed on each of the first surfaces of the insulating substrates. A plurality of via holes is provided so as to extend through respective ones of the insulating substrates from a side of the second surfaces in such a manner that the via holes reach corresponding ones of the circuit patterns. Ones of a plurality of sintered bodies made of conductive particles is inserted into corresponding ones of the via holes and is fixed in the via holes. The insulating substrates are stacked so that the circuit patterns are electrically coupled through the sintered bodies.

Abstract: Plural thermoplastic resin films, each having a circuit pattern formed thereon, are laminated. Via-holes filled with conductor past are formed in the thermoplastic films to electrically connect neighboring layers. The laminated body is pressed under heat between a pair of hot press plates to thereby form an integral body of multi-layer circuit board. To apply a uniform pressure to the laminated body in the pressing process, a projected portion formed on a pressure-adjusting sheet is pushed against a portion of the laminated body where the number of laminated circuit patterns is smaller than other portions. In this manner, the plural thermoplastic films are uniformly bonded together, and the paste in the via-holes is sufficiently converted into an alloy. Thus, reliability of the laminated multi-layer circuit board is enhanced.

Abstract: A multi-layer substrate connecting to an external electric device includes: a plurality of resin films; and a plurality of conductive patterns. The resin films are stacked together with the conductive patterns. The conductive pattern includes an inner conductive pattern and a surface conductive pattern. The inner conductive pattern is disposed inside of the multi-layer substrate for providing an inner circuit. The surface conductive pattern is exposed on the multi-layer substrate for connecting to the external electric device. The surface conductive pattern has a thickness in a stacking direction, which is thicker than a thickness of the inner conductive pattern.

Abstract: The present invention provides a method and apparatus of recycling a printed circuit board for separating and retrieving a metallic material, which includes a printed metallic material, and an insulating material, both composing the printed circuit board. Both the metallic material and the insulating material, which are separated and retrieved, are possible for recycling. In the method for recycling the printed circuit board, hot filtration equipment 4a and resin-metal separation equipment 51 are used in hot filtration process P400. The waste printed circuit board 1 is heated and force-filtered so that only the insulating material 1a pass through the filter. Then, the insulating material 1a and the metallic material 1b are separated and retrieved. It is preferred that the insulating body base 23 of the printed circuit board 100 as the waste printed circuit board is made of thermoplastic resin or a mixture of thermoplastic resin and inorganic loading material.

Abstract: The present invention provides a method and apparatus of recycling a printed circuit board for separating and retrieving a metallic material, which includes a printed metallic material, and an insulating material, both composing the printed circuit board. Both the metallic material and the insulating material, which are separated and retrieved, are possible for recycling. In the method for recycling the printed circuit board, hot filtration equipment 4a and resin-metal separation equipment 51 are used in hot filtration process P400. The waste printed circuit board 1 is heated and force-filtered so that only the insulating material 1a pass through the filter. Then, the insulating material 1a and the metallic material 1b are separated and retrieved. It is preferred that the insulating body base 23 of the printed circuit board 100 as the waste printed circuit board is made of thermoplastic resin or a mixture of thermoplastic resin and inorganic loading material.

Abstract: A base plate for a printed circuit board, having a conductive foil heat-bonded to at least one side of a film insulator which comprises from 65 to 35 wt % of a polyarylketone resin and from 35 to 65 wt % of a non-crystalline polyether imide resin and of which the glass transition temperature is from 150 to 230° C. and the peak temperature of crystal fusion is at least 260° C., as measured when the temperature is raised in the differential scanning calorimetry, if necessary after forming a through-hole and filling a conductive paste therein, and of which, after the heat bonding, the heat of crystal fusion &Dgr;Hm and the heat of crystallization &Dgr;Hc generated by crystallization during the temperature rise, as measured when the temperature is raised by the differential scanning calorimetry, satisfy the following relation: [(&Dgr;Hm−&Dgr;Hc)/&Dgr;Hm]≦0.5.