Abstract: A housing device for housing communication circuits and equipment which includes a frame which can receive a plurality of printed boards, each printed board comprising a communication circuit and circuit cables disposed along the frame. A test jack testing the circuit is disposed at the front end of each printed board, and a connector, which is connected to a connector mounted on the frame, disposed at the rear end of the printed board. The test jack includes further includes first and second leads within a molded body, the opening of each jack being disposed at the front side of the printed board so that the insertion direction is parallel with the printed board. The first and second loads are formed so that they contact each other in the neck of the jack, separate from each other at the rear side of the jack, and project out of said molded body.