Abstract: A vacuum process apparatus includes a plurality of cassettes for holding samples, a transporter which transports the samples, a plurality of vacuum process chambers each for processing samples one by one, an evacuator which evacuates the vacuum process chambers, and a load chamber and an unload chamber communicating with the vacuum process chambers. An apparatus controller is provided for controlling transporting and processing of the samples. The apparatus controller measures a time period for transporting each of the samples and a processing time period for processing a sample in each of the vacuum process chambers, and determines a next order of extraction of the samples from the plurality of cassettes based on the measured time periods.

Abstract: This invention relates to a vacuum processing apparatus having vacuum processing chambers the insides of which must be dry cleaned, and to a method of operating such an apparatus. When the vacuum processing chambers are dry-cleaned, dummy substrates are transferred into the vacuum processing chamber by substrates conveyor means from dummy substrate storage means which is disposed in the air atmosphere together with storage means for storing substrates to be processed, and the inside of the vacuum processing chamber is dry-cleaned by generating a plasma. The dummy substrate is returned to the dummy substrate storage means after dry cleaning is completed. Accordingly, any specific mechanism for only the cleaning purpose is not necessary and the construction of the apparatus can be made simple.

Abstract: This invention relates to a vacuum processing apparatus having vacuum processing chambers the insides of which must be dry cleaned, and to a method of operating such an apparatus. When the vacuum processing chambers are dry-cleaned, dummy substrates are transferred into the vacuum processing chamber by substrates conveyor means from dummy substrate storage means which is disposed in the air atmosphere together with storage means for storing substrates to be processed, and the inside of the vacuum processing chamber is dry-cleaned by generating a plasma. The dummy substrate is returned to the dummy substrate storage means after dry cleaning is completed. Accordingly, any specific mechanism for only the cleaning purpose is not necessary and the construction of the apparatus can be made simple.

Abstract: A method of operating vacuum processing equipment that includes multiple sets of apparatus for performing a succession of different processes on individual wafers, an apparatus for transporting said wafers, and an apparatus for controlling said processing apparatus sets and said transport apparatus, and has at least two sets of wafer processing routes including multiple sets of said processing apparatus; wherein it is possible to judge whether each set of said processing apparatus for performing various processes is in a valid or invalid status for operation, to electrically disconnect only the processing apparatus whose operational status has been judged to be invalid, to reconstruct said processing routes by using the processing apparatus whose operational status has been judged to be valid, and to process said wafers by using only said processing apparatus which is valid for operation.

Abstract: A vacuum process apparatus has a plurality of cassettes for holding samples; a transporting means for transporting the samples; a plurality of vacuum process chambers each for processing samples one by one; an evacuation means for evacuating the vacuum process chambers; a load chamber and an unload chamber communicating with the vacuum process chambers; and an apparatus control means for controlling transporting and processing of the samples. The apparatus control means operates to measure a time period of transporting each of the samples and a time period of processing in each of the vacuum process chambers, and determines a next extracting order of extraction of the samples from the plurality of cassettes based on the measured time periods.

Abstract: This invention relates to a vacuum processing apparatus having vacuum processing chambers the insides of which must be dry cleaned, and to a method of operating such an apparatus. When the vacuum processing chambers are dry-cleaned, dummy substrates are transferred into the vacuum processing chamber by substrates conveyor means from dummy substrate storage means which is disposed in the air atmosphere together with storage means for storing substrates to be processed, and the inside of the vacuum processing chamber is dry-cleaned by generating a plasma. The dummy substrate is returned to the dummy substrate storage means after dry cleaning is completed. Accordingly, any specific mechanism for only the cleaning purpose is not necessary and the construction of the apparatus can be made simple.

Abstract: This invention relates to a vacuum processing apparatus having vacuum processing chambers the insides of which must be dry cleaned, and to a method of operating such an apparatus When the vacuum processing chambers are dry-cleaned, dummy substrates are transferred into the vacuum processing chamber by substrates conveyor means from dummy substrate storage means which is disposed in the air atmosphere together with storage means for storing substrates to be processed, and the inside of the vacuum processing chamber is dry-cleaned by generating a plasma. The dummy substrate is returned to the dummy substrate storage means after dry cleaning is completed.

Abstract: A method of operating a vacuum processing system including a plurality of processing units for processing wafers, a transferring unit for carrying the wafers and a control unit for controlling the processing units and the transferring unit. At least two of the plurality of processing units are connected to the transferring unit and wafers are processed using the processing units. The method includes the steps of judging whether each of the processing units is operable or inoperable, isolating inoperable ones of the processing units judged in the judging step from wafer processing, carrying wafers to operable ones of the processing units using the transferring unit and processing the wafers using only the operable processing units.

Abstract: A vacuum processing apparatus which includes a conveyor structure for transferring a substrate from a substrate storage device held on a substrate storage device mount table. The apparatus further includes a vacuum loader provided with an additional conveyor structure and a vacuum processing chamber for sequentially loading substrate to be processed. The conveyor structures are each provided with a robot.

Abstract: This invention relates to a vacuum processing apparatus having vacuum processing chambers the insides of which must be dry cleaned, and to a method of operating such an apparatus. When the vacuum processing chambers are dry-cleaned, dummy substrates are transferred into the vacuum processing chamber by substrates conveyor means from dummy substrate storage means which is disposed in the air atmosphere together with storage means for storing substrates to be processed, and the inside of the vacuum processing chamber is dry-cleaned by generating a plasma. The dummy substrate is returned to the dummy substrate storage means after dry cleaning is completed. Accordingly, any specific mechanism for only the cleaning purpose is not necessary and the construction of the apparatus can be made simple.

Abstract: A wafer conveyor system for use in a vacuum processing apparatus wherein the conveyor structure is provided with a transfer structure, and a robot apparatus is arranged on the transfer structure. The robot provides for rotation of the wafer in a horizontally from a position in a cassette to an opposite position of the cassette.

Abstract: A vacuum processing apparatus which includes a means for transferring substrates from a loader with a transferring device to a double lock chamber and then to a selected vacuum processing chamber. The substrates are then returned to a substrate by the vacuum loader and back into the substrate table. The surfaces of the substrates are maintained in a horizontal position during processing.

Abstract: Etching end point judging method that includes the following steps in a dry etching end point judging method having a step of reducing noise of input signal waveforms using first digital filter, a step of obtaining a differential coefficient (primary or secondary) of a signal waveform from differential processing by operation circuit, a step of obtaining a smoothed differential coefficient value by reducing the noise components of the time series differential coefficient waveform that was obtained in the previous step, using the second digital filter, and a step of judging an etching end point by comparing the smoothed differential coefficient value and a preset value using discrimination method.

Abstract: A vacuum processing apparatus includes a means for transferring wafer cassettes from a transferring chamber to a lock chamber. The wafer cassettes are mounted within a cassette table and are arranged in a single line. The vacuum processing apparatus further includes lock chambers connected to a plurality of processing chambers with each substrate being carried into and out of the lock chambers.

Abstract: An etching end point judging device which uses emission spectroscopy for dry etching. The device includes an AND converter for obtaining time series data of emission intensity of a specific wavelength produced during etching, a first digital filter for performing smoothening of the time series data, a differential operator for obtaining a differential coefficient of the smoothened time series data, a second digital filter for smoothening the calculated differential coefficient of the time series data, and a discriminator for judging the etching end point by comparing said smoothened differential coefficient with a value set beforehand.

Abstract: A vacuum processing apparatus which includes a cassette mount table for holding at least one cassette, a conveying structure which includes a robot for conveying a wafer held on the cassette mount table, a vacuum loader which includes an additional robot, an additional conveying structure and a plurality of lock chambers.

Abstract: This invention relates to a vacuum processing apparatus having vacuum processing chambers the insides of which must be dry cleaned, and to a method of operating such an apparatus. When the vacuum processing chambers are dry-cleaned, dummy substrates are transferred into the vacuum processing chamber by substrates conveyor means from dummy substrate storage means which is disposed in the air atmosphere together with storage means for storing substrates to be processed, and the inside of the vacuum processing chamber is dry-cleaned by generating a plasma. The dummy substrate is returned to the dummy substrate storage maeans after dry cleaning is completed. Accordingly, any specific mechanism for only the cleaning purpose is not necessary and the construction of the apparatus can be made simple.

Abstract: This invention relates to a vacuum processing system for use in a vacuum processing apparatus. The system has a cassette mount unit for holding a cassette of, e.g., wafers; a vacuum loader having a conveyor and at least one vacuum processing chamber; a conveyor structure for conveying a wafer from the cassette; and at least one lock chamber between the conveyor structure and the conveyor of the vacuum holder. The conveyor structure, which is between the cassette mount unit and the lock chamber, includes a track and a robot (having a robot arm) traveling on the track. The robot can transfer a wafer from the cassette mount unit to the lock chamber.

Abstract: This invention relates to a vacuum processing apparatus having vacuum processing chambers the insides of which must be dry cleaned, and to a method of operating such an apparatus. When the vacuum processing chambers are dry-cleaned, dummy substrates are transferred into the vacuum processing chamber by substrates conveyor means from dummy substrate storage means which is disposed in the air atmosphere together with storage means for storing substrates to be processed, and the inside of the vacuum processing chamber is dry-cleaned by generating a plasma. The dummy substrate is returned to the dummy substrate storage means after dry cleaning is completed. Accordingly, any specific mechanism for only the cleaning purpose is not necessary and the construction of the apparatus can be made simple.