Patents by Inventor Kouji Takabatake

Kouji Takabatake has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5847036
    Abstract: The present invention provides a (meth)acrylic molding material comprising (A) a (meth)acrylic polymer obtained by polymerization of monomer components essentially containing a monomer having (a) carboxyl group(s) and an alkyl (meth)acrylate monomer, and (B) one or more kinds of monomers containing a vinyl group, wherein 30-600 parts by weight of aluminum hydroxide and 0.01-10 parts by weight of a succinic acid derivative are added for 100 parts by weight of the total of said polymer (A) and monomer (B). The (meth)acrylic molding material is thickened by aluminum hydroxide and the thickening behavior is controlled by the succinic acid derivative to prevent the viscosity from increasing with time, accordingly, the (meth)acrylic molding material shows good workability.
    Type: Grant
    Filed: June 21, 1996
    Date of Patent: December 8, 1998
    Assignee: Nippon Shokubai Co., Ltd.
    Inventors: Kouji Takabatake, Yuichi Kawata, Shigeo Otome
  • Patent number: 5834547
    Abstract: A molding compound composition of the present invention comprises a resin composition, for example, unsaturated polyester, a succinic acid derivative, and a thickening agent such as magnesium oxide, and the moisture content thereof is adjusted in a range of from 0.1 to 0.45 percent by weight. A molding compound comprises the molding compound composition and reinforced fibers such as glass fibers, and the moisture content thereof is adjusted to be in a range of from 0.1 percent to 0.4 percent by weight. As shown in FIG. 1, the molding compound composition has excellent viscosity characteristics since the initial thickening action due to the thickering agent is restrained. Although the viscosity after thickened is lower than that of a conventional composition, the stickiness of the surface of the molding compound composition is reduced.
    Type: Grant
    Filed: June 17, 1997
    Date of Patent: November 10, 1998
    Assignee: Nippon Shokubai Co., Ltd.
    Inventors: Kouji Takabatake, Katsura Hayashi, Yoshinori Utikoshi