Patents by Inventor Kouji Takeshita

Kouji Takeshita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7686665
    Abstract: The present invention is related to a printed matter on which thin film is formed by a printing method. Functional organic thin film is formed in little process with highly precise on a substrate without water absorbing property sectioned by partition walls. According to the current invention, the printing that accuracy is preferable can be achieved only by alignment in only one direction. In addition, yield of manufacture of printed matter is preferable. In addition, configuration of partition wall is configuration that printing plate is easy to approach one part of partition wall. Therefore, ink is transferred surely from printing plate to a substrate. Even more particularly, problem such as disconnection of the functional layer or substrate on partition wall when the functional layer or substrate is laminated on a top face of printed matter can be prevented.
    Type: Grant
    Filed: June 2, 2006
    Date of Patent: March 30, 2010
    Assignee: Toppan Printing Co., Ltd.
    Inventors: Akio Nakamura, Sen Ihan, Kouji Takeshita, Eiichi Kitazume
  • Publication number: 20070066179
    Abstract: The present invention is related to a printed matter on which thin film is formed by a printing method. Functional organic thin film is formed in little process with highly precise on a substrate without water absorbing property sectioned by partition walls. According to the current invention, the printing that accuracy is preferable can be achieved only by alignment in only one direction. In addition, yield of manufacture of printed matter is preferable. In addition, configuration of partition wall is configuration that printing plate is easy to approach one part of partition wall. Therefore, ink is transferred surely from printing plate to a substrate. Even more particularly, problem such as disconnection of the functional layer or substrate on partition wall when the functional layer or substrate is laminated on a top face of printed matter can be prevented.
    Type: Application
    Filed: June 2, 2006
    Publication date: March 22, 2007
    Inventors: Akio Nakamura, Sen Ihan, Kouji Takeshita, Eiichi Kitazume
  • Patent number: 4861398
    Abstract: DC bias currents are applied to a conducting wire of a thin film magnetic head to be inspected. When the DC bias currents (I.sub.0, I.sub.1, I.sub.2) are supplied to the conducting wire, the impedances (Z.sub.0, Z.sub.1, Z.sub.2) corresponding to the DC bias currents are measured. When a ratio (.vertline.Z.sub.1 -Z.sub.0 .vertline./.vertline.Z.sub.2 -Z.sub.0 .vertline.) corresponding to an overwrite characteristic (OW) reaches to a predetermined value by lapping tip portions of an upper magnetic layer and a lower magnetic layer of the magnetic head, the lapping process of the magnetic head is finished.
    Type: Grant
    Filed: November 20, 1987
    Date of Patent: August 29, 1989
    Assignee: Hitachi, Ltd.
    Inventors: Hirotsugu Fukuoka, Kanji Kawakami, Makoto Aihara, Mitsuo Suda, Kouji Takeshita, Yukihiro Isono