Abstract: To improve pedestrian visibility. Provided is a headlight controller connectable to a first headlight and a second headlight spaced apart in a vehicle width direction at the front of the vehicle, the headlight controller including: a rainfall amount detection means installed in the vehicle; and a controller installed in the vehicle, where the controller is connected to the rainfall amount detection means, and the controller carries out control such that when rainfall amount detected by the rainfall amount detection means is equal to or more than a predetermined value, irradiation light from the first headlight becomes relatively darker than irradiation light from the second headlight.

Abstract: Provided is a socket for inspection that can correct inclination of a terminal in contact with a device under inspection to stabilize the terminal-to-electrode contact. The socket includes: a contact terminal having a barrel with a flange, a device side terminal, a test board side terminal, and a spring; a housing having a stepped hole through which the contact terminal is inserted and in which a step that abuts against the flange is axially formed; and a movable pedestal provided so as to move closer to and away from the housing and having a receiving hole through which a distal end side of the device side terminal projecting from the barrel is inserted and which receives an electrode of the device. A guide part whose inner diameter is substantially the same as the outer diameter of a projecting portion of the device side terminal is formed in the receiving hole.

Abstract: Provided is a socket for inspection that can correct inclination of a terminal in contact with a device under inspection to stabilize the terminal-to-electrode contact. The socket includes: a contact terminal having a barrel with a flange, a device side terminal, a test board side terminal, and a spring; a housing having a stepped hole through which the contact terminal is inserted and in which a step that abuts against the flange is axially formed; and a movable pedestal provided so as to move closer to and away from the housing and having a receiving hole through which a distal end side of the device side terminal projecting from the barrel is inserted and which receives an electrode of the device. A guide part whose inner diameter is substantially the same as the outer diameter of a projecting portion of the device side terminal is formed in the receiving hole.

Abstract: The test socket includes: a pressing body for pressing an IC package housed in a device housing portion in a direction toward a board; a lid-part main body holding the pressing body while allowing reciprocating movement in the direction toward and from the board, and to be connected to a housing-part main body; a stopper attached at an intermediate point to the lid-part main body so that the stopper is swingable, the stopper having an engaging portion 5a coming into engagement with the housing-part main body, and a proximal end portion approaching and separating from a side surface of the lid-part main body; and an insertion portion to be inserted into a gap between the proximal end portion and the side surface of the lid-part main body according to an action of the pressing body pressing the IC package in the direction toward the board.

Abstract: The test socket includes: a pressing body for pressing an IC package housed in a device housing portion in a direction toward a board; a lid-part main body holding the pressing body while allowing reciprocating movement in the direction toward and from the board, and to be connected to a housing-part main body; a stopper attached at an intermediate point to the lid-part main body so that the stopper is swingable, the stopper having an engaging portion 5a coming into engagement with the housing-part main body, and a proximal end portion approaching and separating from a side surface of the lid-part main body; and an insertion portion to be inserted into a gap between the proximal end portion and the side surface of the lid-part main body according to an action of the pressing body pressing the IC package in the direction toward the board.