Patents by Inventor Kousuke Kashima

Kousuke Kashima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240116278
    Abstract: This layered film includes a base layer and a sealant layer that becomes one outermost surface of the layered film. The base layer contains 77 to 99 parts by mass of a high-density polyethylene having a density of 0.942 to 0.970 g/cm3 and a melt mass-flow rate of 0.1 to 3.0 g/10 min under conditions of a temperature of 190° C. and a load of 2.16 kg and 1 to 23 parts by mass of an ultra-high-molecular-weight polyethylene having a density of 0.930 to 0.960 g/cm3 in a total of 100 parts by mass.
    Type: Application
    Filed: January 19, 2022
    Publication date: April 11, 2024
    Inventors: Kousuke Kashima, Toshihiko Mori, Shinya Ozaki
  • Patent number: 11738546
    Abstract: A laminate has a substrate layer, an intermediate layer, and a fluorine-based resin layer in this order, and has a total film thickness of 400 ?m or less, in which a thickness of the fluorine-based resin layer is 20 ?m or more and 150 ?m or less and a water vapor permeability of the laminate is 0.5 g/m2/24 hours or less.
    Type: Grant
    Filed: March 12, 2018
    Date of Patent: August 29, 2023
    Assignee: FUJIMORI KOGYO CO., LTD.
    Inventors: Hajime Okamoto, Kousuke Kashima, Ai Ito, Toyoaki Suzuki
  • Patent number: 11261354
    Abstract: The present invention provides an adhesive resin composition that is used for adhesion of a fluorine-based resin and is aimed at adhesion between fluorine-based resins or between a fluorine-based resin and a material other than a fluorine-based resin. More specifically, the present invention relates to an adhesive resin composition for use in adhesion of a fluorine-based resin, the composition including a polyethylene-based resin, an elastomer component, and a component having an epoxy group and a vinyl group, wherein a content of the polyethylene-based resin is 55 parts by mass or more and 90 parts by mass or less, a content of the elastomer component is 10 parts by mass or more and 45 parts by mass or less, the elastomer component and the component having an epoxy group and a vinyl group have a common repetition unit, and a content of the component having an epoxy group and a vinyl group based on a total amount of 100 parts by mass of the polyethylene-based resin and the elastomer component is 0.
    Type: Grant
    Filed: November 30, 2017
    Date of Patent: March 1, 2022
    Assignee: FUJIMORI KOGYO CO., LTD.
    Inventors: Kousuke Kashima, Takeo Matsuyama, Toyoaki Suzuki, Hidekazu Furukawa
  • Publication number: 20200031104
    Abstract: A laminate has a substrate layer, an intermediate layer, and a fluorine-based resin layer in this order, in which a total light transmittance of the laminate is 85% or more and a haze value of the laminate is 35% or less.
    Type: Application
    Filed: March 12, 2018
    Publication date: January 30, 2020
    Inventors: Hajime OKAMOTO, Kousuke KASHIMA, Toyoaki SUZUKI
  • Publication number: 20200031105
    Abstract: A laminate has a substrate layer, an intermediate layer, and a fluorine-based resin layer in this order, and has a total film thickness of 400 ?m or less, in which a thickness of the fluorine-based resin layer is 20 ?m or more and 150 ?m or less and a water vapor permeability of the laminate is 0.5 g/m2/24 hours or less.
    Type: Application
    Filed: March 12, 2018
    Publication date: January 30, 2020
    Inventors: Hajime OKAMOTO, Kousuke KASHIMA, Ai ITO, Toyoaki SUZUKI
  • Publication number: 20190322908
    Abstract: The present invention provides an adhesive resin composition that is used for adhesion of a fluorine-based resin and is aimed at adhesion between fluorine-based resins or between a fluorine-based resin and a material other than a fluorine-based resin. More specifically, the present invention relates to an adhesive resin composition for use in adhesion of a fluorine-based resin, the composition including a polyethylene-based resin, an elastomer component, and a component having an epoxy group and a vinyl group, wherein a content of the polyethylene-based resin is 55 parts by mass or more and 90 parts by mass or less, a content of the elastomer component is 10 parts by mass or more and 45 parts by mass or less, the elastomer component and the component having an epoxy group and a vinyl group have a common repetition unit, and a content of the component having an epoxy group and a vinyl group based on a total amount of 100 parts by mass of the polyethylene-based resin and the elastomer component is 0.
    Type: Application
    Filed: November 30, 2017
    Publication date: October 24, 2019
    Inventors: Kousuke KASHIMA, Takeo MATSUYAMA, Toyoaki SUZUKI, Hidekazu FURUKAWA
  • Publication number: 20150125098
    Abstract: A resin composition for a sealant which has heat-sealing properties and non-absorbing properties to an inorganic component contained in the content, a laminated film, and a packaging bag, and a resin composition for a sealant including a cycloolefin polymer and a cycloolefin copolymer, wherein the resin composition includes 10 to 95% by weight of the cycloolefin polymer and 5 to 90% by weight of the cycloolefin copolymer.
    Type: Application
    Filed: January 7, 2013
    Publication date: May 7, 2015
    Applicant: FUJIMORI KOGYO CO., LTD.
    Inventors: Hajime Okamoto, Kousuke Kashima, Masakazu Inada, Mihoko Yoshida
  • Publication number: 20140308466
    Abstract: The invention provides a resin composition for a sealant capable of improving non-adsorption properties and heat sealing properties with respect to an organic component in an article contained, a laminated film and a packaging bag. The resin composition for a sealant of the invention is made of a resin obtained by blending a cycloolefin polymer (COP), a cycloolefin copolymer (COC) and polyethylene (PE), and the blending ratio is 42 weight % to 98 weight % of the cycloolefin polymer (COP), 1 weight % to 49 weight % of the cycloolefin copolymer (COC) and 1 weight % to 19 weight % of the polyethylene (PE).
    Type: Application
    Filed: December 11, 2012
    Publication date: October 16, 2014
    Inventors: Kousuke Kashima, Hajime Okamoto, Masakazu Inada, Mihoko Yoshida