Patents by Inventor Koutarou Masuyama

Koutarou Masuyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Metal particle aggregates, method for producing same, paste-like metal particle aggregate composition, and method for producing bonded body using said paste-like metal particle aggregate composition
    Patent number: 11801556
    Abstract: A metal particle aggregate includes metal particles and an organic substance. The metal particles include first particles that contain one or both of silver and copper in an amount of 70% by mass or more relative to 100% by mass of all metals and have a particle diameter of 100 nm or more and less than 500 nm at a ratio of 20 to 30% by number, and include second particles that have a particle diameter of 50 nm or more and less than 100 nm, and third particles that have a particle diameter of less than 50 nm at a ratio of 80 to 70% by number in total. Surfaces of the first to third particles are covered with the same protective film.
    Type: Grant
    Filed: February 15, 2019
    Date of Patent: October 31, 2023
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Tomohiko Yamaguchi, Koutarou Masuyama, Kazuhiko Yamasaki, Akihiro Higami
  • METAL PARTICLE AGGREGATES, METHOD FOR PRODUCING SAME, PASTE-LIKE METAL PARTICLE AGGREGATE COMPOSITION, AND METHOD FOR PRODUCING BONDED BODY USING SAID PASTE-LIKE METAL PARTICLE AGGREGATE COMPOSITION
    Publication number: 20210050319
    Abstract: A metal particle aggregate includes metal particles and an organic substance. The metal particles include first particles that contain one or both of silver and copper in an amount of 70% by mass or more relative to 100% by mass of all metals and have a particle diameter of 100 nm or more and less than 500 nm at a ratio of 20 to 30% by number, and include second particles that have a particle diameter of 50 nm or more and less than 100 nm, and third particles that have a particle diameter of less than 50 nm at a ratio of 80 to 70% by number in total. Surfaces of the first to third particles are covered with the same protective film.
    Type: Application
    Filed: February 15, 2019
    Publication date: February 18, 2021
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Tomohiko Yamaguchi, Koutarou Masuyama, Kazuhiko Yamasaki, Akihiro Higami