Abstract: The present invention provides a thermally conductive holder for holding a heat-generating component. The thermally conductive holder comprising a material formed from a thermally conductive composition. The thermally conductive composition includes a silicone rubber; and a thermally conductive filler in a range of 40 to 70 percent by volume with respect to total volume of the silicone rubber and the thermally conductive filler. From 35 to 100 percent by volume of the thermally conductive filler is composed of magnesium oxide of 5 ?m or less in average particle size. Said material has a hardness in a range of 20 to 70 as measured by a Type A durometer in conformity with ISO 7619.

Abstract: A thermally conductive sheet includes a thermally conductive layer and an insulation layer laminated onto the thermally conductive layer. The thermally conductive layer includes matrix containing thermally conductive filler having an electrical conductivity. The insulation layer contains thermally conductive filler having an insulating property. The thermally conductive sheet is disposed so that the insulation layer covers the terminal of the electronic component and the electric circuit. At this time, the thermally conductive layer covers and closely contacts with the insulation layer and the electronic component. The heat generated by the electronic component is conducted to a cooling member through the thermally conductive layer and is ultimately dissipated.

Abstract: The present invention provides a thermally conductive holder for holding a heat-generating component. The thermally conductive holder comprising a material formed from a thermally conductive composition. The thermally conductive composition includes a silicone rubber; and a thermally conductive filler in a range of 40 to 70 percent by volume with respect to total volume of the silicone rubber and the thermally conductive filler. From 35 to 100 percent by volume of the thermally conductive filler is composed of magnesium oxide of 5 ?m or less in average particle size. Said material has a hardness in a range of 20 to 70 as measured by a Type A durometer in conformity with ISO 7619.

Abstract: A heat conductive sheet comprising organic matrix and heat conductive filler contained in the organic matrix at a volume percent between 30% and 80%. The heat conductive filler comprises spherical shaped alumina grains which have an average grain diameter in a range between 50 &mgr;m and 80 &mgr;m. The heat conductive filler includes micro grains having a grain diameter of 30 &mgr;m or less at a proportion of 5 volume % or less with respect to the total amount of the spherical shaped alumina grains.

Abstract: A heat-radiating electromagnetic wave absorber molded in a predetermined form from a mixed composition comprising Fe—Si alloy powder as soft magnetic powder and a thermally conductive filler in an organic matrix. This heat-radiating electromagnetic wave absorber has better thermal conductivity, as well as excellent electromagnetic wave absorbing property in high frequency band.

Abstract: A heat conductive sheet comprising organic matrix and heat conductive filler contained in the organic matrix at a volume percent between 30% and 80%. The heat conductive filler comprises spherical shaped alumina grains which have an average grain diameter in a range between 50 &mgr;m and 80 &mgr;m. The heat conductive filler includes micro grains having a grain diameter of 30 &mgr;m or less at a proportion of 5 volume % or less with respect to the total amount of the spherical shaped alumina grains.

Abstract: A thermally conductive sheet includes a thermally conductive layer and an insulation layer laminated onto the thermally conductive layer. The thermally conductive layer includes matrix containing thermally conductive filler having an electrical conductivity. The insulation layer contains thermally conductive filler having an insulating property. The thermally conductive sheet is disposed so that the insulation layer covers the terminal of the electronic component and the electric circuit. At this time, the thermally conductive layer covers and closely contacts with the insulation layer and the electronic component. The heat generated by the electronic component is conducted to a cooling member through the thermally conductive layer and is ultimately dissipated.

Abstract: A heat-radiating electromagnetic wave absorber molded in a predetermined form from a mixed composition comprising Fe—Si alloy powder as soft magnetic powder and a thermally conductive filler in an organic matrix. This heat-radiating electromagnetic wave absorber has better thermal conductivity, as well as excellent electromagnetic wave absorbing property in high frequency band.