Abstract: A dynamic film thickness control system/method and its utilization consisting of a minimum of one mask plate arranged between a substrate and a vapor source. A film thickness control device is utilized for real-time control over deposited film thickness and gradually moves the mask plate according to the film thickness control value acquired by the film thickness control device, enabling the mask plate to mask film zones on the said substrate to achieve the film thickness of a design objective. When the required zones of deposition are masked, the deposition of a particular film layer is completed.

Abstract: A dynamic film thickness control system/method and its utilization consisting of a minimum of one mask plate arranged between a substrate and a vapor source. A film thickness control device is utilized for real-time control over deposited film thickness and gradually moves the mask plate according to the film thickness control value acquired by the film thickness control device, enabling the mask plate to mask film zones on the said substrate to achieve the film thickness of a design objective. When the required zones of deposition are masked, the deposition of a particular film layer is completed.

Abstract: A dynamic film thickness control system/method and its utilization consisting of a minimum of one mask plate arranged between a substrate and a vapor source. A film thickness control device is utilized for real-time control over deposited film thickness and gradually moves the mask plate according to the film thickness control value acquired by the film thickness control device, enabling the mask plate to mask film zones on the said substrate to achieve the film thickness of a design objective. When the required zones of deposition are masked, the deposition of a particular film layer is completed.

Abstract: In a polishing holder for workpiece end surface, a main body and a framework are respectively provided with corresponding fixing portions, at least one of the two fixing portions has at least one set of upper and lower contact portions, the upper and the lower contact portions on each set are respectively disposed above and below a contact plane of the polished end surface of the workpiece and a polishing surface; the mutual contact restriction between the upper and lower contact portions and another fixing portion is used to allow the main body to be maintained parallel to the polishing surface and the pressure exerted on the polished end surface of each workpiece to be closer to an equivalent value. Whereby, the number of simultaneously polished optical fiber end surfaces can be increased so as to elevate the polishing speed and quality.

Abstract: A dynamic film thickness control system/method and its utilization consisting of a minimum of one mask plate arranged between a substrate and a vapor source. A film thickness control device is utilized for real-time control over deposited film thickness and gradually moves the mask plate according to the film thickness control value acquired by the film thickness control device, enabling the mask plate to mask film zones on the said substrate to achieve the film thickness of a design objective. When the required zones of deposition are masked, the deposition of a particular film layer is completed.

Abstract: A mounting apparatus for polishing end faces of optical fibers, comprising a main body with fixing grooves; a fixing rod is accepted in each fixing groove; the upper end of the fixing rod is combined with the supporting stand; the bottom of the fixing rod has diametrically protruding engaging portion to allow the fixing rod not to be contacted with the fixing groove except at the engaging portion; the fixing groove is indented below the main body to cause a contact face of the bottom of the fixing rod and the fixing groove is on a same plane with a contact face of the polished end faces of optical fibers and a polishing surface to allow a same polished shape to be obtained at a same batch work of the polished end faces. Whereby, the polishing speed and quality can be enhanced.

Abstract: A mounting apparatus for polishing end faces of optical fibers, comprising a main body with fixing grooves; a fixing rod is accepted in each fixing groove; the upper end of the fixing rod is combined with the supporting stand; the bottom of the fixing rod has diametrically protruding engaging portion to allow the fixing rod not to be contacted with the fixing groove except at the engaging portion; the fixing groove is indented below the main body to cause a contact face of the bottom of the fixing rod and the fixing groove is on a same plane with a contact face of the polished end faces of optical fibers and a polishing surface to allow a same polished shape to be obtained at a same batch work of the polished end faces. Whereby, the polishing speed and quality can be enhanced.

Abstract: A device for grinding and polishing optical fiber ends. The device includes a holder and an elastic grinding surface. The holder is used to hold equidistantly a set of optical fibers such that the ends of the optical fibers are in contact with the elastic grinding surface capable of only eccentric rotation, to enable the grinding speed and the grinding direction of each of the optical fiber ends to be the same. The grinding direction is uniformly changed along with the change in time and the grinding angles in all direction are substantially the same.

Abstract: An equipment is designed to grind and polish a plurality of optical fiber ends and is formed of a holder, and an elastic grinding surface. The holder is used to hold equidistantly a plurality of optical fibers such that the ends of the optical fibers are in contact with the elastic grinding surface capable of only eccentric rotation, thereby enabling instantaneously the grinding speed and the grinding direction of each optical fiber end to be the same. The grinding direction is uniformly changed along with the change in time. The grinding degrees in all direction are substantially the same.