Abstract: Provided is an electronic device handling apparatus capable of increasing the number of simultaneous measurements while suppressing the increase in cost. An electronic device handling apparatus, which moves bare dies relative to a probe card, includes: a thermal head which includes a plurality of holding regions each of which holds the bare die and has openings; at least one lift unit which is movably held by the thermal head so as to correspond to the holding regions and is able to advance and retreat through the openings; a moving device which moves the thermal head; and a fixed arm which is able to support the one lift unit.

Abstract: Provided is an electronic device handling apparatus capable of increasing the number of simultaneous measurements while suppressing the increase in cost. An electronic device handling apparatus, which moves bare dies relative to a probe card, includes: a thermal head which includes a plurality of holding regions each of which holds the bare die and has openings; at least one lift unit which is movably held by the thermal head so as to correspond to the holding regions and is able to advance and retreat through the openings; a moving device which moves the thermal head; and a fixed arm which is able to support the one lift unit.

Abstract: An electronic device test apparatus used for bringing the ICs into electrical contact with contact parts of the test head in the state where the ICs are held on a test tray and running tests on the electrical characteristics of ICs, the electronic device test apparatus including an inversion system for rotating the test tray which holds a plurality of ICs in a direction dropping ICs which are insufficiently held at least once before testing.

Abstract: In a handler comprising a movable head (suction pads) capable of holding and conveying a plurality of pre-test IC devices at a time: when conveying a plurality of pre-test IC devices from a supply customer tray KST to a test tray TST, a first step of leaving on the customer tray KST pre-test IC devices loaded on positions corresponding to turned-off sockets, holding by the suction pads only pre-test IC devices on the customer tray KST loaded on positions corresponding to other sockets than the turned-off ones and conveying them from the customer tray KST to the test tray TST without changing the arrangement; and a second step of conveying pre-test IC devices left on the customer tray KST for the reason of being at positions corresponding to the turned-off sockets from the customer tray KST to positions on the test tray TST corresponding to other sockets than the turned-off sockets are performed.