Patents by Inventor Kozo Katayama
Kozo Katayama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10354735Abstract: A semiconductor device includes a plurality of nonvolatile memory cells (1). Each of the nonvolatile memory cells comprises a MOS type first transistor section (3) used for information storage, and a MOS type second transistor section (4) which selects the first transistor section. The second transistor section has a bit line electrode (16) connected to a bit line, and a control gate electrode (18) connected to a control gate control line. The first transistor section has a source line electrode (10) connected to a source line, a memory gate electrode (14) connected to a memory gate control line, and a charge storage region (11) disposed directly below the memory gate electrode. A gate withstand voltage of the second transistor section is lower than that of the first transistor section.Type: GrantFiled: August 29, 2018Date of Patent: July 16, 2019Assignee: Renesas Electronics CorporationInventors: Toshihiro Tanaka, Yukiko Umemoto, Mitsuru Hiraki, Yutaka Shinagawa, Masamichi Fujito, Kazufumi Suzukawa, Hiroyuki Tanikawa, Takashi Yamaki, Yoshiaki Kamigaki, Shinichi Minami, Kozo Katayama, Nozomu Matsuzaki
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Publication number: 20180374542Abstract: A semiconductor device includes a plurality of nonvolatile memory cells (1). Each of the nonvolatile memory cells comprises a MOS type first transistor section (3) used for information storage, and a MOS type second transistor section (4) which selects the first transistor section. The second transistor section has a bit line electrode (16) connected to a bit line, and a control gate electrode (18) connected to a control gate control line. The first transistor section has a source line electrode (10) connected to a source line, a memory gate electrode (14) connected to a memory gate control line, and a charge storage region (11) disposed directly below the memory gate electrode. A gate withstand voltage of the second transistor section is lower than that of the first transistor section.Type: ApplicationFiled: August 29, 2018Publication date: December 27, 2018Inventors: Toshihiro TANAKA, Yukiko UMEMOTO, Mitsuru HIRAKI, Yutaka SHINAGAWA, Masamichi FUJITO, Kazufumi SUZUKAWA, Hiroyuki TANIKAWA, Takashi YAMAKI, Yoshiaki KAMIGAKI, Shinichi MINAMI, Kozo KATAYAMA, Nozomu MATSUZAKI
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Patent number: 10115469Abstract: A semiconductor device includes a plurality of nonvolatile memory cells (1). Each of the nonvolatile memory cells comprises a MOS type first transistor section (3) used for information storage, and a MOS type second transistor section (4) which selects the first transistor section. The second transistor section has a bit line electrode (16) connected to a bit line, and a control gate electrode (18) connected to a control gate control line. The first transistor section has a source line electrode (10) connected to a source line, a memory gate electrode (14) connected to a memory gate control line, and a charge storage region (11) disposed directly below the memory gate electrode. A gate withstand voltage of the second transistor section is lower than that of the first transistor section.Type: GrantFiled: October 27, 2017Date of Patent: October 30, 2018Assignee: Renesas Electronics CorporationInventors: Toshihiro Tanaka, Yukiko Umemoto, Mitsuru Hiraki, Yutaka Shinagawa, Masamichi Fujito, Kazufumi Suzukawa, Hiroyuki Tanikawa, Takashi Yamaki, Yoshiaki Kamigaki, Shinichi Minami, Kozo Katayama, Nozomu Matsuzaki
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Publication number: 20180047452Abstract: A semiconductor device includes a plurality of nonvolatile memory cells (1). Each of the nonvolatile memory cells comprises a MOS type first transistor section (3) used for information storage, and a MOS type second transistor section (4) which selects the first transistor section. The second transistor section has a bit line electrode (16) connected to a bit line, and a control gate electrode (18) connected to a control gate control line. The first transistor section has a source line electrode (10) connected to a source line, a memory gate electrode (14) connected to a memory gate control line, and a charge storage region (11) disposed directly below the memory gate electrode. A gate withstand voltage of the second transistor section is lower than that of the first transistor section.Type: ApplicationFiled: October 27, 2017Publication date: February 15, 2018Inventors: Toshihiro TANAKA, Yukiko UMEMOTO, Mitsuru HIRAKI, Yutaka SHINAGAWA, Masamichi FUJITO, Kazufumi SUZUKAWA, Hiroyuki TANIKAWA, Takashi YAMAKI, Yoshiaki KAMIGAKI, Shinichi MINAMI, Kozo KATAYAMA, Nozomu MATSUZAKI
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Patent number: 9825049Abstract: A semiconductor device of the present invention has a first insulating film formed between a control gate electrode and a semiconductor substrate and a second insulating film formed between a memory gate electrode and the semiconductor substrate and between the control gate electrode and the memory gate electrode, the second insulating film having a charge accumulating part therein. The second insulating film has a first film, a second film serving as a charge accumulating part disposed on the first film, and a third film disposed on the second film. The third film has a sidewall film positioned between the control gate electrode and the memory gate electrode and a deposited film positioned between the memory gate electrode and the semiconductor substrate. In this structure, the distance at a corner part of the second insulating film can be increased, and electric-field concentration can be reduced.Type: GrantFiled: January 16, 2016Date of Patent: November 21, 2017Assignee: Renesas Electronics CorporationInventors: Naohiro Hosoda, Daisuke Okada, Kozo Katayama
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Patent number: 9812211Abstract: A semiconductor device includes a plurality of nonvolatile memory cells (1). Each of the nonvolatile memory cells comprises a MOS type first transistor section (3) used for information storage, and a MOS type second transistor section (4) which selects the first transistor section. The second transistor section has a bit line electrode (16) connected to a bit line, and a control gate electrode (18) connected to a control gate control line. The first transistor section has a source line electrode (10) connected to a source line, a memory gate electrode (14) connected to a memory gate control line, and a charge storage region (11) disposed directly below the memory gate electrode. A gate withstand voltage of the second transistor section is lower than that of the first transistor section.Type: GrantFiled: August 1, 2016Date of Patent: November 7, 2017Assignee: Renesas Electronics CorporationInventors: Toshihiro Tanaka, Yukiko Umemoto, Mitsuru Hiraki, Yutaka Shinagawa, Masamichi Fujito, Kazufumi Suzukawa, Hiroyuki Tanikawa, Takashi Yamaki, Yoshiaki Kamigaki, Shinichi Minami, Kozo Katayama, Nozomu Matsuzaki
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Publication number: 20160336074Abstract: A semiconductor device includes a plurality of nonvolatile memory cells (1). Each of the nonvolatile memory cells comprises a MOS type first transistor section (3) used for information storage, and a MOS type second transistor section (4) which selects the first transistor section. The second transistor section has a bit line electrode (16) connected to a bit line, and a control gate electrode (18) connected to a control gate control line. The first transistor section has a source line electrode (10) connected to a source line, a memory gate electrode (14) connected to a memory gate control line, and a charge storage region (11) disposed directly below the memory gate electrode. A gate withstand voltage of the second transistor section is lower than that of the first transistor section.Type: ApplicationFiled: August 1, 2016Publication date: November 17, 2016Inventors: Toshihiro TANAKA, Yukiko UMEMOTO, Mitsuru HIRAKI, Yutaka SHINAGAWA, Masamichi FUJITO, Kazufumi SUZUKAWA, Hiroyuki TANIKAWA, Takashi YAMAKI, Yoshiaki KAMIGAKI, Shinichi MINAMI, Kozo KATAYAMA, Nozomu MATSUZAKI
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Patent number: 9412459Abstract: A semiconductor device includes a plurality of nonvolatile memory cells (1). Each of the nonvolatile memory cells comprises a MOS type first transistor section (3) used for information storage, and a MOS type second transistor section (4) which selects the first transistor section. The second transistor section has a bit line electrode (16) connected to a bit line, and a control gate electrode (18) connected to a control gate control line. The first transistor section has a source line electrode (10) connected to a source line, a memory gate electrode (14) connected to a memory gate control line, and a charge storage region (11) disposed directly below the memory gate electrode. A gate withstand voltage of the second transistor section is lower than that of the first transistor section.Type: GrantFiled: March 16, 2014Date of Patent: August 9, 2016Assignee: Renesas Electronics CorporationInventors: Toshihiro Tanaka, Yukiko Umemoto, Mitsuru Hiraki, Yutaka Shinagawa, Masamichi Fujito, Kazufumi Suzukawa, Hiroyuki Tanikawa, Takashi Yamaki, Yoshiaki Kamigaki, Shinichi Minami, Kozo Katayama, Nozomu Matsuzaki
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Publication number: 20160133641Abstract: A semiconductor device of the present invention has a first insulating film formed between a control gate electrode and a semiconductor substrate and a second insulating film formed between a memory gate electrode and the semiconductor substrate and between the control gate electrode and the memory gate electrode, the second insulating film having a charge accumulating part therein. The second insulating film has a first film, a second film serving as a charge accumulating part disposed on the first film, and a third film disposed on the second film. The third film has a sidewall film positioned between the control gate electrode and the memory gate electrode and a deposited film positioned between the memory gate electrode and the semiconductor substrate. In this structure, the distance at a corner part of the second insulating film can be increased, and electric-field concentration can be reduced.Type: ApplicationFiled: January 16, 2016Publication date: May 12, 2016Inventors: Naohiro HOSODA, Daisuke OKADA, Kozo KATAYAMA
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Publication number: 20160093716Abstract: To provide a manufacturing method of a semiconductor device including a memory cell having a higher reliability. First and second stacked structures in a memory cell formation region are formed so as to have a larger height than a third stacked structure in a transistor formation region, and then an interlayer insulating layer is formed so as to cover these stacked structures and then polished.Type: ApplicationFiled: October 7, 2015Publication date: March 31, 2016Applicant: RENESAS ELECTRONICS CORPORATIONInventors: Eiji TSUKUDA, Kozo KATAYAMA, Kenichiro SONODA, Tatsuya KUNIKIYO
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Patent number: 9245900Abstract: A semiconductor device of the present invention has a first insulating film formed between a control gate electrode and a semiconductor substrate and a second insulating film formed between a memory gate electrode and the semiconductor substrate and between the control gate electrode and the memory gate electrode, the second insulating film having a charge accumulating part therein. The second insulating film has a first film, a second film serving as a charge accumulating part disposed on the first film, and a third film disposed on the second film. The third film has a sidewall film positioned between the control gate electrode and the memory gate electrode and a deposited film positioned between the memory gate electrode and the semiconductor substrate. In this structure, the distance at a corner part of the second insulating film can be increased, and electric-field concentration can be reduced.Type: GrantFiled: September 13, 2012Date of Patent: January 26, 2016Assignee: Renesas Electronics CorporationInventors: Naohiro Hosoda, Daisuke Okada, Kozo Katayama
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Patent number: 9184264Abstract: To provide a manufacturing method of a semiconductor device including a memory cell having a higher reliability. First and second stacked structures in a memory cell formation region are formed so as to have a larger height than a third stacked structure in a transistor formation region, and then an interlayer insulating layer is formed so as to cover these stacked structures and then polished.Type: GrantFiled: December 30, 2014Date of Patent: November 10, 2015Assignee: Renesas Electronics CorporationInventors: Eiji Tsukuda, Kozo Katayama, Kenichiro Sonoda, Tatsuya Kunikiyo
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Publication number: 20150111357Abstract: To provide a manufacturing method of a semiconductor device including a memory cell having a higher reliability. First and second stacked structures in a memory cell formation region are formed so as to have a larger height than a third stacked structure in a transistor formation region, and then an interlayer insulating layer is formed so as to cover these stacked structures and then polished.Type: ApplicationFiled: December 30, 2014Publication date: April 23, 2015Applicant: Renesas Electronics CorporationInventors: Eiji TSUKUDA, Kozo KATAYAMA, Kenichiro SONODA, Tatsuya KUNIKIYO
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Patent number: 8956941Abstract: To provide a manufacturing method of a semiconductor device including a memory cell having a higher reliability. First and second stacked structures in a memory cell formation region are formed so as to have a larger height than a third stacked structure in a transistor formation region, and then an interlayer insulating layer is formed so as to cover these stacked structures and then polished.Type: GrantFiled: January 15, 2014Date of Patent: February 17, 2015Assignee: Renesas Electronics CorporationInventors: Eiji Tsukuda, Kozo Katayama, Kenichiro Sonoda, Tatsuya Kunikiyo
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Publication number: 20140213030Abstract: To provide a manufacturing method of a semiconductor device including a memory cell having a higher reliability. First and second stacked structures in a memory cell formation region are formed so as to have a larger height than a third stacked structure in a transistor formation region, and then an interlayer insulating layer is formed so as to cover these stacked structures and then polished.Type: ApplicationFiled: January 15, 2014Publication date: July 31, 2014Applicant: Renesas Electronics CorporationInventors: Eiji TSUKUDA, Kozo KATAYAMA, Kenichiro SONODA, Tatsuya KUNIKIYO
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Publication number: 20140198577Abstract: A semiconductor device includes a plurality of nonvolatile memory cells (1). Each of the nonvolatile memory cells comprises a MOS type first transistor section (3) used for information storage, and a MOS type second transistor section (4) which selects the first transistor section. The second transistor section has a bit line electrode (16) connected to a bit line, and a control gate electrode (18) connected to a control gate control line. The first transistor section has a source line electrode (10) connected to a source line, a memory gate electrode (14) connected to a memory gate control line, and a charge storage region (11) disposed directly below the memory gate electrode. A gate withstand voltage of the second transistor section is lower than that of the first transistor section.Type: ApplicationFiled: March 16, 2014Publication date: July 17, 2014Applicants: HITACHI ULSI SYSTEMS CO., LTD., RENESAS ELECTRONICS CORPORATIONInventors: Toshihiro TANAKA, Yukiko UMEMOTO, Mitsuru HIRAKI, Yutaka SHINAGAWA, Masamichi FUJITO, Kazufumi SUZUKAWA, Hiroyuki TANIKAWA, Takashi YAMAKI, Yoshiaki KAMIGAKI, Shinichi MINAMI, Kozo KATAYAMA, Nozomu MATSUZAKI
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Patent number: 8698224Abstract: A semiconductor device includes a plurality of nonvolatile memory cells (1). Each of the nonvolatile memory cells comprises a MOS type first transistor section (3) used for information storage, and a MOS type second transistor section (4) which selects the first transistor section. The second transistor section has a bit line electrode (16) connected to a bit line, and a control gate electrode (18) connected to a control gate control line. The first transistor section has a source line electrode (10) connected to a source line, a memory gate electrode (14) connected to a memory gate control line, and a charge storage region (11) disposed directly below the memory gate electrode. A gate withstand voltage of the second transistor section is lower than that of the first transistor section.Type: GrantFiled: April 20, 2013Date of Patent: April 15, 2014Assignees: Renesas Electronics Corporation, Hitachi ULSI Systems Co., Ltd.Inventors: Toshihiro Tanaka, Yukiko Umemoto, Mitsuru Hiraki, Yutaka Shinagawa, Masamichi Fujito, Kazufumi Suzukawa, Hiroyuki Tanikawa, Takashi Yamaki, Yoshiaki Kamigaki, Shinichi Minami, Kozo Katayama, Nozomu Matsuzaki
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Publication number: 20130235668Abstract: A semiconductor device includes a plurality of nonvolatile memory cells (1). Each of the nonvolatile memory cells comprises a MOS type first transistor section (3) used for information storage, and a MOS type second transistor section (4) which selects the first transistor section. The second transistor section has a bit line electrode (16) connected to a bit line, and a control gate electrode (18) connected to a control gate control line. The first transistor section has a source line electrode (10) connected to a source line, a memory gate electrode (14) connected to a memory gate control line, and a charge storage region (11) disposed directly below the memory gate electrode. A gate withstand voltage of the second transistor section is lower than that of the first transistor section.Type: ApplicationFiled: April 20, 2013Publication date: September 12, 2013Applicants: HITACHI ULSI SYSTEMS CO., LTD., RENESAS ELECTRONICS CORPORATIONInventors: Toshihiro TANAKA, Yukiko UMEMOTO, Mitsuru HIRAKI, Yutaka SHINAGAWA, Masamichi FUJITO, Kazufumi SUZUKAWA, Hiroyuki TANIKAWA, Takashi YAMAKI, Yoshiaki KAMIGAKI, Shinichi MINAMI, Kozo KATAYAMA, Nozomu MATSUZAKI
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Patent number: 8426904Abstract: A semiconductor device includes a plurality of nonvolatile memory cells (1). Each of the nonvolatile memory cells comprises a MOS type first transistor section (3) used for information storage, and a MOS type second transistor section (4) which selects the first transistor section. The second transistor section has a bit line electrode (16) connected to a bit line, and a control gate electrode (18) connected to a control gate control line. The first transistor section has a source line electrode (10) connected to a source line, a memory gate electrode (14) connected to a memory gate control line, and a charge storage region (11) disposed directly below the memory gate electrode. A gate withstand voltage of the second transistor section is lower than that of the first transistor section.Type: GrantFiled: September 1, 2011Date of Patent: April 23, 2013Assignees: Renesas Electronics Corporation, Hitachi ULSI Systems Co., Ltd.Inventors: Toshihiro Tanaka, Yukiko Umemoto, Mitsuru Hiraki, Yutaka Shinagawa, Masamichi Fujito, Kazufumi Suzukawa, Hiroyuki Tanikawa, Takashi Yamaki, Yoshiaki Kamigaki, Shinichi Minami, Kozo Katayama, Nozomu Matsuzaki
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Publication number: 20130082315Abstract: A semiconductor device of the present invention has a first insulating film formed between a control gate electrode and a semiconductor substrate and a second insulating film formed between a memory gate electrode and the semiconductor substrate and between the control gate electrode and the memory gate electrode, the second insulating film having a charge accumulating part therein. The second insulating film has a first film, a second film serving as a charge accumulating part disposed on the first film, and a third film disposed on the second film. The third film has a sidewall film positioned between the control gate electrode and the memory gate electrode and a deposited film positioned between the memory gate electrode and the semiconductor substrate. In this structure, the distance at a corner part of the second insulating film can be increased, and electric-field concentration can be reduced.Type: ApplicationFiled: September 13, 2012Publication date: April 4, 2013Inventors: Naohiro HOSODA, Daisuke OKADA, Kozo KATAYAMA