Patents by Inventor Kozo Kurita

Kozo Kurita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • COLD-SHRINKABLE TYPE RUBBER INSULATION SLEEVE AND METHOD OF MANUFACTURING
    Publication number: 20100276831
    Abstract: A cold-shrinkable type rubber insulation sleeve includes a reinforced insulation sleeve, a semiconductive stress-relief cone, an internal semiconductive layer, and an external semiconductive layer. The reinforced insulation sleeve, the semiconductive stress-relief cone, and the internal semiconductive layer are formed by molding, and the external semiconductive layer is formed by coating.
    Type: Application
    Filed: July 16, 2010
    Publication date: November 4, 2010
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Shozo KOBAYASHI, Kozo Kurita, Isao Takaoka
  • Cold-shrinkable type rubber insulation sleeve and method of manufacturing
    Publication number: 20070039692
    Abstract: A cold-shrinkable type rubber insulation sleeve includes a reinforced insulation sleeve, a semiconductive stress-relief cone, an internal semiconductive layer, and an external semiconductive layer. The reinforced insulation sleeve, the semiconductive stress-relief cone, and the internal semiconductive layer are formed by molding, and the external semiconductive layer is formed by coating.
    Type: Application
    Filed: October 30, 2006
    Publication date: February 22, 2007
    Applicant: The FURUKAWA ELECTRIC CO., LTD.
    Inventors: Shozo Kobayashi, Kozo Kurita, Isao Takaoka
  • Cold-shrinkable type rubber insulation sleeve and method of manufacturing
    Publication number: 20040258863
    Abstract: A cold-shrinkable type rubber insulation sleeve includes a reinforced insulation sleeve, a semiconductive stress-relief cone, an internal semiconductive layer, and an external semiconductive layer. The reinforced insulation sleeve, the semiconductive stress-relief cone, and the internal semiconductive layer are formed by molding, and the external semiconductive layer is formed by coating.
    Type: Application
    Filed: June 17, 2004
    Publication date: December 23, 2004
    Applicant: The Furukawa Electric Co., Ltd.
    Inventors: Shozo Kobayashi, Kozo Kurita, Isao Takaoka