Patents by Inventor Kozo Ohama

Kozo Ohama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Current diffusion bonding apparatus and current diffusion bonding method
    Patent number: 9669488
    Abstract: A current diffusion bonding apparatus (1) includes upper and lower electrodes (11, 12), which sandwich members to be bonded (M, M) and which are electrically conductible with the members to be bonded (M, M); a power supply unit (20), which supplies a current to the electrodes (11, 12); and a pressurizing unit (30), which applies a pressure to bonding surfaces S. If a temperature T detected by a temperature sensor (45) is a first set temperature T1 or lower, the pressurizing unit (30) applies a pressure to the bonding surfaces S while restricting the displacement of the members to be bonded (M, M), and if the temperature T exceeds the first set temperature T1, the pressurizing unit (30) applies a pressure based on the elastic force of a spring (35d), which elastically deforms according to the displacement of the members to be bonded (M, M), to the bonding surfaces S.
    Type: Grant
    Filed: November 4, 2011
    Date of Patent: June 6, 2017
    Assignee: ECO-A CO., LTD.
    Inventors: Yoshinobu Mizuno, Makoto Ito, Kozo Ohama, Hitoshi Kabasawa
  • CURRENT DIFFUSION BONDING APPARATUS AND CURRENT DIFFUSION BONDING METHOD
    Publication number: 20140299582
    Abstract: A current diffusion bonding apparatus (1) includes upper and lower electrodes (11, 12), which sandwich members to be bonded (M, M) and which are electrically conductible with the members to be bonded (M, M); a power supply unit (20), which supplies a current to the electrodes (11, 12); and a pressurizing unit (30), which applies a pressure to bonding surfaces S. If a temperature T detected by a temperature sensor (45) is a first set temperature T1 or lower, the pressurizing unit (30) applies a pressure to the bonding surfaces S while restricting the displacement of the members to be bonded (M, M), and if the temperature T exceeds the first set temperature T1, the pressurizing unit (30) applies a pressure based on the elastic force of a spring (35d), which elastically deforms according to the displacement of the members to be bonded (M, M), to the bonding surfaces S.
    Type: Application
    Filed: November 4, 2011
    Publication date: October 9, 2014
    Applicant: ECO-A CO., LTD.
    Inventors: Yoshinobu Mizuno, Makoto Ito, Kozo Ohama, Hitoshi Kabasawa