Patents by Inventor Kreisler Lau
Kreisler Lau has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7307137Abstract: The present invention is directed to low dielectric polymers and to methods of producing these low dielectric constant polymers, dielectric materials and layers, and electronic components. In one aspect of the present invention, an isomeric mixture of thermosetting monomers, wherein the monomers have a core structure and a plurality of arms, is provided, and the isomeric mixture of thermosetting monomers is polymerized, wherein polymerization comprises a reaction of an ethynyl group that is located in at least one arm of a monomer.Type: GrantFiled: October 18, 2001Date of Patent: December 11, 2007Assignee: Honeywell International Inc.Inventors: Kreisler Lau, Feng Quan Liu, Paul Apen, Boris Korolev, Emma Brouk, Ruslan Zherebin, David Nalewajek, Roger Leung
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Publication number: 20070155997Abstract: Compositions and methods of forming and using those compositions are provided herein where the composition comprises at least one oligomer or polymer of Formula I wherein E is a cage compound; each Q is the same or different and selected from aryl, branched aryl, and substituted aryl wherein the substituents include hydrogen, halogen, alkyl, aryl, substituted aryl, heteroaryl, aryl ether, alkenyl, alkynyl, alkoxyl, hydroxyalkyl, hydroxyaryl, hydroxyalkenyl, hydroxyalkynyl, hydroxyl, or carboxyl; A is substituted or unsubstituted aryl with substituted or unsubstituted arylalkynyl group (substituents include hydrogen, halogen, alkyl, phenyl or substituted aryl; and aryl includes phenyl, biphenyl, naphthyl, terphenyl, anthracenyl, polyphenylene, polyphenylene ether, or substituted aryl); h is from 0 to 10; i is from 0 to 10; j is from 0 to 10; and w is 0 or 1.Type: ApplicationFiled: December 31, 2003Publication date: July 5, 2007Inventors: Bo Li, Kreisler Lau, Paul Apen
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Patent number: 7141188Abstract: The present invention provides a composition comprising: (a) dielectric material; and (b) porogen comprising at least two fused aromatic rings wherein each of the fused aromatic rings has at least one alkyl substituent thereon and a bond exists between at least two of the alkyl substituents on adjacent aromatic rings. Preferably, the dielectric material is a composition comprising (a) thermosetting component comprising (1) optionally monomer of Formula I as set forth below and (2) at least one oligomer or polymer of Formula II as set forth below where Q, G, h, I, I, and w are as set forth below and (b) porogen.Type: GrantFiled: May 30, 2002Date of Patent: November 28, 2006Assignee: Honeywell International Inc.Inventors: Bo Li, Nancy Iwamoto, Boris Korolev, Paul G. Apen, Kreisler Lau, John G. Sikonia, Ananth Naman, Amauel Gebrebrhan, Nassrin Sleiman, Ruslan Zherebin
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Patent number: 7060204Abstract: The present invention provides a composition comprising: (a) dielectric material; and (b) porogen comprising at least two fused aromatic rings wherein each of the fused aromatic rings has at least one alkyl substituent thereon and a bond exists between at least two of the alkyl substituents on adjacent aromatic rings. Preferably, the dielectric material is a composition comprising (a) thermosetting component comprising (1) optionally monomer of Formula I as set forth below and (2) at least one oligomer or polymer of Formula II as set forth below where Q, G, h, I, I, and w are as set forth below and (b) porogen.Type: GrantFiled: April 2, 2003Date of Patent: June 13, 2006Assignee: Honeywell International Inc.Inventors: Bo Li, Nancy Iwamoto, Boris Korolev, Paul G. Apen, Kreisler Lau, John G. Sikonia, Ananth Naman, Amauel Gebrebrhan, Nassrin Sleiman, Ruslan Zherebin
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Patent number: 6987147Abstract: A polymeric network comprises a plurality of monomers that include a cage compound with at least three arms, wherein at least one of the arms has two or more branches, and wherein each of the branches further comprises a reactive group. Monomers in contemplated polymeric networks are covalently coupled to each other via the reactive groups. Particularly contemplated cage compounds include adamantane and diamantane, and especially contemplated branched arms comprise ortho-bis(phenylethynyl)phenyl. Especially contemplated polymeric networks have a dielectric constant of no more than 3.0, and are formed on the surface of a substrate.Type: GrantFiled: October 1, 2002Date of Patent: January 17, 2006Assignee: Honeywell International Inc.Inventors: Kreisler Lau, Bo Li, Boris Korolev, Edward Sullivan, Ruslan Zherebin
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Patent number: 6890641Abstract: In accordance with the present invention, compositions and methods are provided in which the mechanical strength and durability of a precursor material having a plurality of pores is increased by a) providing a precursor material; b) treating the precursor material to form a nanoporous aerogel, preferably by using a supercritical drying process; c) providing a blending material having a reinforcing component and a volatile component; d) combining the nanoporous aerogel and the blending material to form an amalgamation layer; and e) treating the amalgamation layer to increase the mechanical strength of the layer by a substantial amount and to ultimately form a low dielectric material that can be utilized in various applications.Type: GrantFiled: July 8, 2003Date of Patent: May 10, 2005Assignee: Honeywell International Inc.Inventors: Shyama Mukherjee, Roger Leung, Kreisler Lau
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Publication number: 20050090596Abstract: The present invention provides adamantane or diamantane compositions that are useful as a dielectric material in microelectronic applications such as microchips.Type: ApplicationFiled: April 2, 2003Publication date: April 28, 2005Inventors: Paul Apen, Kreisler Lau, Boris Korolev, Bo Li, Ruslan Zherebin, Edward Sullivan, Christian Werner, Sonja Demel, Bernd Kellermeier, Andreas Kanschik-Conradsen
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Patent number: 6878796Abstract: Aromatic aliphatic ether solvents, such as anisole, methylanisole, and phenetole, have been found useful in formulating coating solutions of polymeric dielectric materials and as a clean up solvent in the coating process. A process for forming a dielectric film on a substrate includes depositing a coating solution of a dielectric material in a formulation solvent onto a surface of the substrate and depositing an aromatic aliphatic ether solvent onto an edge portion of the surface of the substrate. The process is used to form films of dielectric materials including arylene ether dielectric polymers, hydridosiloxane resins, organohydridosiloxane resins, spin-on-glass materials, partially hydrolyzed and partially condensed alkoxysilane compositions which are cured to form a nanoporous dielectric silica material, and poly(perhydrido)silazanes.Type: GrantFiled: November 18, 2002Date of Patent: April 12, 2005Assignee: Honeywell International Inc.Inventors: Oana Leonte, Tadashi Nakano, Kelly Beres, Kreisler Lau
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Patent number: 6849696Abstract: A low dielectric constant material has a first backbone with an aromatic moiety and a first reactive group, and a second backbone with an aromatic moiety and a second reactive group, wherein the first and second backbones are crosslinked via the first and second reactive groups in a crosslinking reaction without an additional crosslinker, and wherein a cage structure having at least 10 atoms is covalently bound to at least one of the first and second backbone.Type: GrantFiled: November 12, 2002Date of Patent: February 1, 2005Assignee: Honeywell International Inc.Inventors: Kreisler Lau, Feng Quan Liu, Boris Korolev, Emma Brouk, Roger Leung
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Publication number: 20050020702Abstract: The present invention provides a composition comprising (a) thermosetting component comprising: (1) optionally monomer of Formula I as set forth below and (2) at least one oligomer or polymer of Formula II as set forth below where E, Q, G, h, I, j, and w are as set forth below and (b) porogen that bonds to thermosetting component (a). Preferably, the porogen is selected from the group consisting of unsubstituted polynorbornene, substituted polynorbornene, polycaprolactone, unsubstituted polystyrene, substituted polystyrene, polyacenaphthylene homopolymer, and polyacenaphthylene copolymer. Preferably, the present compositions may be used as dielectric substrate in microchips, multichip modules, laminated circuit boards, or printed wiring boards.Type: ApplicationFiled: December 12, 2003Publication date: January 27, 2005Inventors: Bo Li, Paul Apen, Kreisler Lau, Edward Sullivan
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Patent number: 6803441Abstract: In a method of producing a low dielectric constant polymer, a thermosetting monomer is provided, wherein the thermosetting monomer has a cage compound or aryl core structure, and a plurality of arms that are covalently bound to the cage compound or core structure. In a subsequent step, the thermosetting monomer is incorporated into a polymer to form the low dielectric constant polymer, wherein the incorporation into the polymer comprises a chemical reaction of a triple bond that is located in at least one of the arms. Contemplated cage compounds and core structures include adamantane, diamantane, silicon, a phenyl group and a sexiphenylene group, while preferred arms include an arylene, a branched arylene, and an arylene ether. The thermosetting monomers may advantageously be employed to produce low-k dielectric material in electronic devices, and the dielectric constant of the polymer can be controlled by varying the overall length of the arms.Type: GrantFiled: October 8, 2002Date of Patent: October 12, 2004Assignee: Honeywell International Inc.Inventors: Kreisler Lau, Feng Quan Liu, Boris Korolev, Emma Brouk, Ruslan Zherebin, David Nalewajek
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Patent number: 6797777Abstract: A low dielectric constant material has a first backbone with an aromatic moiety and a first reactive group, and a second backbone with an aromatic moiety and a second reactive group, wherein the first and second backbones are crosslinked via the first and second reactive groups in a crosslinking reaction without an additional crosslinker, and wherein a cage structure having at least 10 atoms is covalently bound to at least one of the first and second backbone.Type: GrantFiled: July 10, 2001Date of Patent: September 28, 2004Assignee: Honeywell International Inc.Inventors: Kreisler Lau, Feng Quan Liu, Boris Korolev, Emma Brouk, Rusian Zherebin, Roger Leung
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Publication number: 20040176488Abstract: In accordance with the present invention, compositions and methods are provided in which the mechanical strength and durability of a precursor material having a plurality of pores is increased by a) providing a precursor material; b) treating the precursor material to form a nanoporous aerogel, preferably by using a supercritical drying process; c) providing a blending material having a reinforcing component and a volatile component; d) combining the nanoporous aerogel and the blending material to form an amalgamation layer; and e) treating the amalgamation layer to increase the mechanical strength of the layer by a substantial amount, and to ultimately form a low dielectric material that can be utilized in various applications.Type: ApplicationFiled: March 13, 2003Publication date: September 9, 2004Inventors: Shyama Mukherjee, Roger Leung, Kreisler Lau
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Publication number: 20040158024Abstract: The present invention is directed to low dielectric polymers and to methods of producing these low dielectric constant polymers, dielectric materials and layers, and electronic components. In one aspect of the present invention, an isomeric mixture of thermosetting monomers, wherein the monomers have a core structure and a plurality of arms, is provided, and the isomeric mixture of thermosetting monomers is polymerized, wherein polymerization comprises a reaction of an ethynyl group that is located in at least one arm of a monomer.Type: ApplicationFiled: March 11, 2004Publication date: August 12, 2004Inventors: Kreisler Lau, Feng Quan Liu, Paul Apen, Boris Korolev, Emma Brouk, Ruslan Zherebin, David Nalewajek, Roger Leung
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Publication number: 20040046155Abstract: The present invention provides a composition comprising: (a) dielectric material; and (b) porogen comprising at least two fused aromatic rings wherein each of the fused aromatic rings has at least one alkyl substituent thereon and a bond exists between at least two of the alkyl substituents on adjacent aromatic rings. Preferably, the dielectric material is a composition comprising (a) thermosetting component comprising (1) optionally monomer of Formula I as set forth below and (2) at least one oligomer or polymer of Formula II as set forth below where Q, G, h, I, I, and w are as set forth below and (b) porogen.Type: ApplicationFiled: April 2, 2003Publication date: March 11, 2004Inventors: Bo Li, Nancy Iwamoto, Boris Korolev, Paul G. Apen, Kreisler Lau, John G. Sikonia, Ananth Naman, Amauel Gebrebrhan, Nassrin Sleiman, Ruslan Zherebin
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Publication number: 20030191275Abstract: Aromatic aliphatic ether solvents, such as anisole, methylanisole, and phenetole, have been found useful in formulating coating solutions of polymeric dielectric materials and as a clean up solvent in the coating process. A process for forming a dielectric film on a substrate includes depositing a coating solution of a dielectric material in a formulation solvent onto a surface of the substrate and depositing an aromatic aliphatic ether solvent onto an edge portion of the surface of the substrate. The process is used to form films of dielectric materials including arylene ether dielectric polymers, hydridosiloxane resins, organohydridosiloxane resins, spin-on-glass materials, partially hydrolyzed and partially condensed alkoxysilane compositions which are cured to form a nanoporous dielectric silica material, and poly(perhydrido)silazanes.Type: ApplicationFiled: November 18, 2002Publication date: October 9, 2003Inventors: Oana Leonte, Tadashi Nakano, Kelly Beres, Kreisler Lau
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Publication number: 20030187139Abstract: A low dielectric constant material has a first backbone with an aromatic moiety and a first reactive group, and a second backbone with an aromatic moiety and a second reactive group, wherein the first and second backbones are crosslinked via the first and second reactive groups in a crosslinking reaction without an additional crosslinker, and wherein a cage structure having at least 10 atoms is covalently bound to at least one of the first and second backbone.Type: ApplicationFiled: November 12, 2002Publication date: October 2, 2003Inventors: Kreisler Lau, Feng Quan Liu, Boris Korolev, Emma Brouk, Roger Leung
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Patent number: 6627669Abstract: In accordance with the present invention, compositions and methods are provided in which the mechanical strength and durability of a precursor material having a plurality of pores is increased by a) providing a precursor material; b) treating the precursor material to form a nanoporous aerogel, preferably by using a supercritical drying process; c) providing a blending material having a reinforcing component and a volatile component; d) combining the nanoporous aerogel and the blending material to form an amalgamation layer; and e) treating the amalgamation layer to increase the mechanical strength of the layer by a substantial amount, and to ultimately form a low dielectric material that can be utilized in various applications.Type: GrantFiled: July 3, 2002Date of Patent: September 30, 2003Assignee: Honeywell International Inc.Inventors: Shyama Mukherjee, Roger Leung, Kreisler Lau
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Publication number: 20030162002Abstract: A polymeric network comprises a plurality of monomers that include a cage compound with at least three arms, wherein at least one of the arms has two or more branches, and wherein each of the branches further comprises a reactive group. Monomers in contemplated polymeric networks are covalently coupled to each other via the reactive groups. Particularly contemplated cage compounds include adamantane and diamantane, and especially contemplated branched arms comprise ortho-bis-(phenylethynyl)phenyl. Especially contemplated polymeric networks have a dielectric constant of no more than 3.0, and are formed on the surface of a substrate.Type: ApplicationFiled: October 1, 2002Publication date: August 28, 2003Inventors: Kreisler Lau, Bo Li, Boris Korolev, Edward Sullivan, Ruslan Zherebin
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Publication number: 20030151031Abstract: The present invention provides a composition comprising: (a) dielectric material; and (b) porogen comprising at least two fused aromatic rings wherein each of the fused aromatic rings has at least one alkyl substituent thereon and a bond exists between at least two of the alkyl substituents on adjacent aromatic rings. Preferably, the dielectric material is a composition comprising (a) thermosetting component comprising (1) optionally monomer of Formula I as set forth below and (2) at least one oligomer or polymer of Formula II as set forth below where Q, G, h, I, I, and w are as set forth below and (b) porogen.Type: ApplicationFiled: May 29, 2002Publication date: August 14, 2003Inventors: Bo Li, Nancy Iwamoto, Boris Korolev, Paul G. Apen, Kreisler Lau, John G. Sikonia, Ananth Naman, Amauel Gebrebrhan, Nassrin Sleiman, Ruslan Zherebin