Abstract: A method for fabricating a microelectronic assembly including a built-in TEC, a microelectronic assembly including a built-in TEC, and a system including the microelectronic assembly. The method includes providing a microelectronic device, and fabricating the TEC directly onto the microelectronic device such that there is no mounting material between the TEC and the microelectronic device.

Abstract: A method for fabricating a microelectronic assembly including a built-in TEC, a microelectronic assembly including a built-in TEC, and a system including the microelectronic assembly. The method includes providing a microelectronic device, and fabricating the TEC directly onto the microelectronic device such that there is no mounting material between the TEC and the microelectronic device.

Abstract: An apparatus is described for a bridge clip used to hold an IC package to a process carrier in the semiconductor manufacturing processes. According to embodiments of the present invention, the bridge clip includes a bridge comprising a rectangular sheet having tabs at opposite ends the tabs having an irregular shape, a stiffener affixed to the bridge, the stiffener comprising a rectangular sheet sized to fit within the bent down tabs of the bridge and having a stiffening structure along a longitudinal axis of the stiffener, and a pressure plate coupled to the stiffener under the bridge and fitting within the tabs and long edges of the stiffener.

Abstract: A socket for a microelectronic component is provided. The socket contains power, ground and signal conductors. It further contains a plurality of electrical conductors, each with a respective stop component, interconnection element, spring portion and protrusions. A plurality of protrusions is equal amongst each respective electrical conductor and identical in height. A plurality of electrical conductors are inserted into a respective opening within the socket body, a select plurality of electrical conductors electrically connects, via protrusions that frictionally fit, to either a power, ground or signal plane for the purpose of providing current to the integrated circuit. While a first plurality of electrical conductors are electrically connected through the same power, ground or signal conductor, they are also electrically disconnected from a second plurality of electrical conductors that are electrically connected though another conductors, not the same as the first.

Abstract: A method for fabricating a microelectronic assembly including a built-in TEC, a microelectronic assembly including a built-in TEC, and a system including the microelectronic assembly. The method includes providing a microelectronic device, and fabricating the TEC directly onto the microelectronic device such that there is no mounting material between the TEC and the microelectronic device.

Abstract: Embodiments of a method for attaching a die to a substrate using a flame or other heat source are disclosed. The flame may be produced by combustible gas. Also disclosed are embodiments of a system for performing die attach using a flame. Other embodiments are described and claimed.

Abstract: A socket for a microelectronic component is provided. The socket contains power, ground and signal conductors. It further contains a plurality of electrical conductors, each with a respective stop component, interconnection element, spring portion and protrusions. A plurality of protrusions is equal amongst each respective electrical conductor and identical in height. A plurality of electrical conductors are inserted into a respective opening within the socket body, a select plurality of electrical conductors electrically connects, via protrusions that frictionally fit, to either a power, ground or signal plane for the purpose of providing current to the integrated circuit. While a first plurality of electrical conductors are electrically connected through the same power, ground or signal conductor, they are also electrically disconnected from a second plurality of electrical conductors that are electrically connected though another conductors, not the same as the first.

Abstract: The present invention relates to apparatus and methods for providing a low resistance power supply to a microelectronic package through the use of dual conductive paths. A first conductive path contained within the substrate and supplies current, primarily in responding to transient current demands to the microelectronic package. A lower resistance second conductive path supplies primarily steady state current to the microelectronic package through an electrical connection to an edge of the microelectronic package. Resistance in the second conductive path is reduced by using a power clamp to connect the second power supply to the microelectronic package.

Abstract: An apparatus is described for a bridge clip used to hold an IC package to a process carrier in the semiconductor manufacturing processes. According to embodiments of the present invention, the bridge clip includes a bridge comprising a rectangular sheet having tabs at opposite ends the tabs having an irregular shape, a stiffener affixed to the bridge, the stiffener comprising a rectangular sheet sized to fit within the bent down tabs of the bridge and having a stiffening structure along a longitudinal axis of the stiffener, and a pressure plate coupled to the stiffener under the bridge and fitting within the tabs and long edges of the stiffener.

Abstract: An apparatus is described for a bridge clip used to hold an IC package to a process carrier in the semiconductor manufacturing processes. According to embodiments of the present invention, the bridge clip includes a bridge comprising a rectangular sheet having tabs at opposite ends the tabs having an irregular shape, a stiffener affixed to the bridge, the stiffener comprising a rectangular sheet sized to fit within the bent down tabs of the bridge and having a stiffening structure along a longitudinal axis of the stiffener, and a pressure plate coupled to the stiffener under the bridge and fitting within the tabs and long edges of the stiffener.

Abstract: The present invention relates to apparatus and methods for providing a low resistance power supply to a microelectronic package through the use of dual conductive paths. A first conductive path contained within the substrate and supplies current, primarily in responding to transient current demands to the microelectronic package. A lower resistance second conductive path supplies primarily steady state current to the microelectronic package through an electrical connection to an edge of the microelectronic package. Resistance in the second conductive path is reduced by using a power clamp to connect the second power supply to the microelectronic package.

Abstract: An apparatus is described for a bridge clip used to hold an IC package to a process carrier in the semiconductor manufacturing processes. According to embodiments of the present invention, the bridge clip includes a bridge comprising a rectangular sheet having tabs at opposite ends the tabs having an irregular shape, a stiffener affixed to the bridge, the stiffener comprising a rectangular sheet sized to fit within the bent down tabs of the bridge and having a stiffening structure along a longitudinal axis of the stiffener, and a pressure plate coupled to the stiffener under the bridge and fitting within the tabs and long edges of the stiffener.

Abstract: An apparatus, comprising: a plurality of stacked computer components comprising; a vapor chamber, and a centerpoint force, wherein the centerpoint force is applied to the vapor chamber.

Abstract: A system and method for embedding power and ground planes in a pin grid array (PGA) socket is provided. Integrated circuit pins are inserted into multiple insertion holes of varying dimensions in the power and ground planes. When the cover of the socket is slidably moved, power pins touch the power plane and ground pins touch the ground plane. Decoupling capacitors are also affixed to the substrate. Thus, the power delivery performance of the overall central processing unit (CPU) package is improved. Moreover, the power and ground planes enhance the mechanical strength of the socket which reduces warpage.

Abstract: A system and method for embedding power and ground planes in a pin grid array (PGA) socket is provided. Integrated circuit pins are inserted into multiple insertion holes of varying dimensions in the power and ground planes. When the cover of the socket is slidably moved, power pins touch the power plane and ground pins touch the ground plane. Decoupling capacitors are also affixed to the substrate. Thus, the power delivery performance of the overall central processing unit (CPU) package is improved. Moreover, the power and ground planes enhance the mechanical strength of the socket which reduces warpage.

Abstract: An apparatus that includes a number of stacked computer components such as a vapor chamber, and a centerpoint force, wherein the centerpoint force is applied to the vapor chamber.

Abstract: A system and method for embedding power and ground planes in a pin grid array (PGA) socket is provided. Integrated circuit pins are inserted into multiple insertion holes of varying dimensions in the power and ground planes. When the cover of the socket is sidably moved, power pins touch the power plane and ground pins touch the ground plane. Decoupling capacitors are also affixed to the substrate. Thus, the power delivery performance of the overall central processing unit (CPU) package is improved. Moreover, the power and ground planes enhance the mechanical strength of the socket which reduces warpage.

Abstract: A system and method for embedding power and ground planes in a pin grid array (PGA) socket is provided. Integrated circuit pins are inserted into multiple insertion holes of varying dimensions in the power and ground planes. When the cover of the socket is slidably moved, power pins touch the power plane and ground pins touch the ground plane. Decoupling capacitors are also affixed to the substrate. Thus, the power delivery performance of the overall central processing unit (CPU) package is improved. Moreover, the power and ground planes enhance the mechanical strength of the socket which reduces warpage.

Abstract: An apparatus, comprising: a plurality of stacked computer components comprising; a vapor chamber, and a centerpoint force, wherein the centerpoint force is applied to the vapor chamber.