Abstract: An energy storage system includes a sealed housing defining an interior space and a plurality of cells arranged within the interior space of the housing. A cooling liquid submerges each of the cells. The cooling system is positioned within the sealed housing configured to actively and passively cool and heat each of the cells.

Abstract: A fixed wobbler of a hydraulic unit includes a body having a first end and an opposite second end, the first end defining a first surface, and the second end defining a second surface oriented at an angle relative to the first surface, the body having an outer diameter and an inner wall defining an inner diameter, wherein the outer diameter is approximately 2.1655+0.0000?0.0007 inches (5.5004+0.000?0.0018 cm), and wherein the inner diameter is approximately 1.043±0.003 inches (2.6492±0.0076 cm).

Abstract: A hydraulic unit includes a housing, a pump located in the housing, and a motor located in the housing and operably connected to the pump such that the motor is driven in response to fluid pressure delivered to the motor from the pump. An output shaft is operably connected to and driven by the motor and includes a body having a first end and a second opposite end, and a first flange and a substantially identical second flange integrally formed with the body of the shaft adjacent the second end. A relief is formed about a circumference of the body. A plurality of first splines are integrally formed with an exterior of the body between the second portion and the third portion, and a plurality of second splines are integrally formed with an interior surface of the body adjacent the second end.

Abstract: An immersion cooled electronic arrangement includes a sealed housing, a coolant contained within the housing, and an electronic device submerged within the coolant. An agitator is disposed within the housing to control passive heat transfer between the electronic device and the coolant. An immersion cooling system and related method are also described.

Abstract: A shaft can include a first portion comprising a first material having first material properties, a disconnect portion comprising at least some of a second material having second material properties, and a third portion comprising a third material having third material properties. The disconnect portion can be positioned between the first portion and the third portion, the three material properties being configured such that the first portion is physically disconnected from the third portion in response to failure of the disconnect portion under at least one of a mechanical load and/or an electrical load and/or thermal load.

Abstract: A refrigeration system for electronics includes a compressor disposed on a main line and configured to compress a refrigerant in the refrigeration system and a condenser disposed downstream of the compressor on the main line. An evaporator line is in fluid communication with the main line downstream of the condenser and has an evaporator configured to receive heat into the refrigerant from an external heat source. The system also includes an immersion line in fluid communication with main line downstream of the condenser. The immersion line includes an immersion cooling container that is configured to at least partially house electronics such that the electronics are in direct fluid communication with the refrigerant to cool the electronics.

Abstract: An immersion cooled electronics arrangement includes a sealed housing, a coolant contained within the sealed housing, and an electronic device disposed within the sealed housing. The sealed housing has a variable-volume alterable between at least a first volume and a second volume in response to changes in pressure within the sealed housing to reduce the rate of pressure change in the sealed housing over time from heating of the coolant.

Abstract: A friction stir welded component includes a channel body having a main surface and an elongated channel formed in the main surface. The elongated channel has a first depth portion that is longitudinally spanned by shoulders having a second depth, the second depth being shallower than the first depth. The body further has an abutting face that connects the main surface with one of the shoulders at an oblique angle relative to the main surface. A channel cover with an abutting face is seated against the abutting face of the channel body. A friction stir weld joint joins the channel cover to the channel body, wherein the friction stir weld joint is defined along abutting faces of the channel body and channel cover.

Abstract: A method of disconnecting a generator from a source of mechanical rotation includes receiving a generator disconnect command and receiving a rotational position of a generator input member. The input member rotational angle is compared to the target disconnect angle range, and a determination made whether to disconnect the input member from a generator drive member based on the comparison.

Abstract: An immersion cooled electronics arrangement includes a housing containing a coolant, an electronic device submerged within the housing and in thermal communication with the coolant, and a variable volume body. The variable volume body is disposed within the housing. An actuator is operatively connected to the variable volume body and is arranged to displace coolant within the housing.

Abstract: A refrigeration system for electronics includes a compressor disposed on a main line and configured to compress a refrigerant in the refrigeration system and a condenser disposed downstream of the compressor on the main line. An evaporator line is in fluid communication with the main line downstream of the condenser and has an evaporator configured to receive heat into the refrigerant from an external heat source. The system also includes an immersion line in fluid communication with main line downstream of the condenser. The immersion line includes an immersion cooling container that is configured to at least partially house electronics such that the electronics are in direct fluid communication with the refrigerant to cool the electronics.

Abstract: A slipper retainer of a hydraulic unit having a circular body having a back surface and an outer edge, the circular body defining a diameter of about 2.240 inches (5.629 cm), a central aperture through a center of the circular body, the circular body having a curved surface defining an edge of the central aperture, wherein the curved surface is defined by a sphere that is centered at a point located a distance of about 0.209 inches (0.531 cm) from the back surface of the body, and a plurality of slipper apertures located between the curved surface of the circular body and the outer edge of the circular body, wherein each slipper aperture of the plurality of slipper apertures has a diameter of about 0.464 inches (1.179 cm).

Abstract: A port plate assembly of a hydraulic unit includes a port plate and a journal bearing. The port plate includes a fixed-speed interface side having a fixed-speed interface surface, and a variable-speed interface side having a variable-speed interface surface. A plurality of kidney-shaped apertures is defined at a kidney pitch diameter about a central bore of the port plate between the fixed-speed interface surface and the variable-speed interface surface. The port plate also includes control cylinder interface formed at a control cylinder radial offset from a central axis of the central bore, where a ratio of the control cylinder radial offset to the kidney pitch diameter is between 1.629 and 1.639. The journal bearing is installed in the central bore of the port plate, where the journal bearing provides an interface for a fixed-speed shaft and a variable-speed shaft of the hydraulic unit.

Abstract: A circuit board arrangement includes a deflector configured to guide flow over an electronic component on a circuit board disposed in an air flow. A method for thermal management of a circuit board includes modifying an air flow over the circuit board to increase speed or direction the air flow over a component of the circuit board using a deflector.

Abstract: A condensing heat exchanger to exchange heat from a hot flow to a cold flow includes a hot flow side to receive the hot flow, the hot flow side including a hot flow inlet disposed on a hot flow inlet side and a hot flow outlet disposed on a hot flow outlet side, wherein a hot flow side cross section decreases from the hot flow inlet side to the hot flow outlet side, a cold flow side to receive the cold flow, and an interface disposed between the hot flow side and the cold flow side to allow thermal communication therebetween.

Abstract: A transformer assembly includes a housing with a sealed housing interior, a transformer disposed within the housing interior and having a core with windings wrapped about the core, and a condenser mounted to the housing. The condenser is in fluid communication with the housing interior. A surface of the windings bounds a coolant channel extending between the windings and the condenser to convey coolant of a first phase to the condenser and receive coolant of a second phase from the condenser.

Abstract: A circuit board arrangement includes a deflector configured to guide flow over an electronic component on a circuit board disposed in an air flow. A method for thermal management of a circuit board includes modifying an air flow over the circuit board to increase speed or direction the air flow over a component of the circuit board using a deflector.

Abstract: An immersion cooled electronics arrangement includes a sealed housing, a coolant contained within the sealed housing, and an electronic device disposed within the sealed housing. The sealed housing has a variable-volume alterable between at least a first volume and a second volume in response to changes in pressure within the sealed chamber to reduce the rate of pressure change in the sealed housing over time form heating of the coolant.

Abstract: An immersion cooled electronic arrangement includes a sealed housing, a coolant contained within the housing, and an electronic device submerged within the coolant. An agitator is disposed within the housing to control passive heat transfer between the electronic device and the coolant. An immersion cooling system and related method are also described.

Abstract: An electronics cooling arrangement includes a housing, an electronic device disposed within the housing, and a solid-liquid phase change material disposed within the housing and is in thermal communication with the electronic device to absorb heat generated by the electronic device. A method of cooling an electronic device and a vehicular electronics cooling system are also described.