Patents by Inventor Krishna Bharath Kolluru

Krishna Bharath Kolluru has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Techniques For Arranging Conductive Pads In Electronic Devices
    Publication number: 20240120302
    Abstract: An electronic device includes first and second external conductive pads coupled to route a first signal and third and fourth external conductive pads. The third and the fourth external conductive pads are between the first and the second external conductive pads on a surface of the electronic device.
    Type: Application
    Filed: December 18, 2023
    Publication date: April 11, 2024
    Applicant: Intel Corporation
    Inventors: Krishna Bharath Kolluru, Atul Maheshwari, Mahesh Kumashikar, Md Altaf Hossain, Ankireddy Nalamalpu, Omkar Karhade
  • Techniques For Configuring Repeater Circuits In Active Interconnection Devices
    Publication number: 20240111703
    Abstract: An active interconnection device has a repeater circuit that includes a storage circuit. The storage circuit is coupled to store a configuration bit for configuring the repeater circuit to transmit a signal between a first integrated circuit die and a second integrated circuit die. The storage circuit is coupled to receive the configuration bit through a conductor during a configuration mode. A buffer circuit in the repeater circuit is configurable to transmit the signal through the conductor during a transmission mode in response to the configuration bit.
    Type: Application
    Filed: December 12, 2023
    Publication date: April 4, 2024
    Applicant: Altera Corporation
    Inventors: Mahesh Kumashikar, Atul Maheshwari, Md Altaf Hossain, Ankireddy Nalamalpu, Krishna Bharath Kolluru
  • Techniques For Shifting Signal Transmission To Compensate For Defects In Pads In Integrated Circuits
    Publication number: 20240113014
    Abstract: An integrated circuit includes first external conductive pads, second external conductive pads, and third external conductive pads. The second external conductive pads are between the first external conductive pads and the third external conductive pads. Repair group circuitry is configurable to shift signal transmission away from one of the first external conductive pads to one of the third external conductive pads if the one of the first external conductive pads has a defect.
    Type: Application
    Filed: December 13, 2023
    Publication date: April 4, 2024
    Applicant: Altera Corporation
    Inventors: Krishna Bharath Kolluru, Atul Maheshwari, Mahesh Kumashikar, Md Altaf Hossain, Ankireddy Nalamalpu, Jeffrey Chromczak