Abstract: Techniques for graphic formation via material ablation described. In at least some implementations, a graphic is applied to a surface of an object by ablating layers of the object to form an ablation trench in the shape of the graphic. In at least some embodiments, an object can include a surface layer and multiple sublayers of materials. When an ablation trench is generated in the object, the ablation trench can penetrate a surface layer of the object and into an intermediate layer. In at least some implementations, height variations in an object surface caused by an ablation trench can cause variations in light reflection properties such that a graphic applied via the ablation trench appears at a different color tone than a surrounding surface, even if the ablation trench and the surrounding surface are coated with a same colored coating.

Abstract: Techniques for graphic formation via material ablation described. In at least some implementations, a graphic is applied to a surface of an object by ablating layers of the object to form an ablation trench in the shape of the graphic. In at least some embodiments, an object can include a surface layer and multiple sublayers of materials. When an ablation trench is generated in the object, the ablation trench can penetrate a surface layer of the object and into an intermediate layer. In at least some implementations, height variations in an object surface caused by an ablation trench can cause variations in light reflection properties such that a graphic applied via the ablation trench appears at a different color tone than a surrounding surface, even if the ablation trench and the surrounding surface are coated with a same colored coating.

Abstract: Techniques for graphic formation via material ablation described. In at least some implementations, a graphic is applied to a surface of an object by ablating layers of the object to form an ablation trench in the shape of the graphic. In at least some embodiments, an object can include a surface layer and multiple sublayers of materials. When an ablation trench is generated in the object, the ablation trench can penetrate a surface layer of the object and into an intermediate layer. In at least some implementations, height variations in an object surface caused by an ablation trench can cause variations in light reflection properties such that a graphic applied via the ablation trench appears at a different color tone than a surrounding surface, even if the ablation trench and the surrounding surface are coated with a same colored coating.

Abstract: A system and method is provided for selecting a light source in a pointing device such as a mouse. The selection of the light source may be based on attributes of a received image, which are in turn based on reflected light received at the pointing device from the tracking surface. Because the attributes of the receive image are related to characteristics of the tracking surface over which the pointing device is moved, an illumination source appropriate for a particular surface type can be chosen.

Abstract: A keyboard for use with a computing device and a method of manufacturing a keyboard key are provided. One disclosed keyboard includes a plurality of keys, each key having a key cap including a perimeter wall and a void positioned within the perimeter wall and opening to a top of the key cap. Each key further includes a cushion having a top portion configured to be contacted by a digit of a user and a bottom portion configured to be fitted within the void in the key cap. The cushion being may be configured to absorb an impact force directed against the key during a keystroke.

Abstract: A system and method is provided for selecting a light source in a pointing device such as a mouse. The selection of the light source may be based on attributes of a received image, which are in turn based on reflected light received at the pointing device from the tracking surface. Because the attributes of the receive image are related to characteristics of the tracking surface over which the pointing device is moved, an illumination source appropriate for a particular surface type can be chosen.

Abstract: An apparatus, with moving parts, having a flexible circuit configured such that its fatigue life is enhanced. The apparatus includes a first component, a second component, and a positioning mechanism between the first component and the second component. The positioning mechanism enables movement of the first component and the second component between at least a proximate position and a spaced-apart position. Also included between the first component and the second component is a flexible circuit that has a first end coupled to the first component and a second end coupled to the second component. The flexible circuit is configured as a compliant spring that can extend and collapse in a predefined shape when the components are spaced-apart and proximate, respectively.

Abstract: A system and method is provided for selecting a light source in a pointing device such as a mouse. The selection of the light source may be based on attributes of a received image, which are in turn based on reflected light received at the pointing device from the tracking surface. Because the attributes of the receive image are related to characteristics of the tracking surface over which the pointing device is moved, an illumination source appropriate for a particular surface type can be chosen.

Abstract: Solder balls, such as, low melt C4 solder balls undergo volume expansion during reflow. Where the solder balls are encapsulated, expansion pressure can cause damage to device integrity. A volume expansion region in the semiconductor chip substrate beneath each of the solder balls accommodates volume expansion. Air-cushioned diaphgrams, deformable materials and non-wettable surfaces may be used to permit return of the solder during cooling to its original site. A porous medium with voids sufficient to accommodate expansion may also be used.

Abstract: A keyboard for use with a computing device and a method of manufacturing a keyboard key are provided. One disclosed keyboard includes a plurality of keys, each key having a key cap including a perimeter wall and a void positioned within the perimeter wall and opening to a top of the key cap. Each key further includes a cushion having a top portion configured to be contacted by a digit of a user and a bottom portion configured to be fitted within the void in the key cap. The cushion being may be configured to absorb an impact force directed against the key during a keystroke.

Abstract: Force measuring systems for electronic pens, styli, or other products may include structure for changing a direction or location of application of a force (e.g., a force transmitted via pen or stylus contact with a writing surface) from a first direction or location to a second direction or location. In this manner, a sensor portion of the force measuring system may be reoriented in a direction such that it is not normal to the direction of the force. This feature may help make electronic pens or styli (or other products) thinner and dimensioned more consistent with their non-electronic counterparts. Various structures for changing the direction or location of application of the force are described.

Abstract: An apparatus, with moving parts, having a flexible circuit configured such that its fatigue life is enhanced. The apparatus includes a first component, a second component, and a positioning mechanism between the first component and the second component. The positioning mechanism enables movement of the first component and the second component between at least a proximate position and a spaced-apart position. Also included between the first component and the second component is a flexible circuit that has a first end coupled to the first component and a second end coupled to the second component. The flexible circuit is configured as a compliant spring that can extend and collapse in a predefined shape when the components are spaced-apart and proximate, respectively.

Abstract: A system and method is provided for selecting a light source in a pointing device such as a mouse. The selection of the light source may be based on attributes of a received image, which are in turn based on reflected light received at the pointing device from the tracking surface. Because the attributes of the receive image are related to characteristics of the tracking surface over which the pointing device is moved, an illumination source appropriate for a particular surface type can be chosen.

Abstract: A VCSEL die is packaged so that its optical axis is at a predetermined non-perpendicular and nonparallel angle relative to the plane of a PCB to which the packaged die will be mounted. The die is packaged to form an emitting component which is shaped to orient the VCSEL optical axis at the predetermined angle when the component is placed onto a PCB. The component can be used in combination with a flip-chip sensor IC located on an opposite side of a PCB from the emitting component. The component can also be used in combination with a CSP sensor IC on the same side of a PCB. A VCSEL die and sensor IC can be contained in a single package. The optical axis of the VCSEL die packaged with a sensor IC may or may not be perpendicular to a plane of an array in the sensor IC.

Abstract: A VCSEL die is packaged so that its optical axis is at a predetermined non-perpendicular and nonparallel angle relative to the plane of a PCB to which the packaged die will be mounted. The die is packaged to form an emitting component which is shaped to orient the VCSEL optical axis at the predetermined angle when the component is placed onto a PCB. The component can be used in combination with a flip-chip sensor IC located on an opposite side of a PCB from the emitting component. The component can also be used in combination with a CSP sensor IC on the same side of a PCB. A VCSEL die and sensor IC can be contained in a single package. The optical axis of the VCSEL die packaged with a sensor IC may or may not be perpendicular to a plane of an array in the sensor IC.

Abstract: Solder balls, such as, low melt C4 solder balls undergo volume expansion during reflow. Where the solder balls are encapsulated, expansion pressure can cause damage to device integrity. A volume expansion region in the semiconductor chip substrate beneath each of the solder balls accommodates volume expansion. Air-cushioned diaphgrams, deformable materials and non-wettable surfaces may be used to permit return of the solder during cooling to its original site. A porous medium with voids sufficient to accommodate expansion may also be used.

Abstract: Force measuring systems for electronic pens, styli, or other products may include structure for changing a direction or location of application of a force (e.g., a force transmitted via pen or stylus contact with a writing surface) from a first direction or location to a second direction or location. In this manner, a sensor portion of the force measuring system may be reoriented in a direction such that it is not normal to the direction of the force. This feature may help make electronic pens or styli (or other products) thinner and dimensioned more consistent with their non-electronic counterparts. Various structures for changing the direction or location of application of the force are described.

Abstract: Solder balls such as, low melt C4 solder balls, undergo volume expansion during reflow, such as may occur during attachment of chip modules to a PCB. Where the solder balls are encapsulated, expansion pressure can cause damage to device integrity. A volume expansion region in the semiconductor chip substrate beneath each of the solder balls accommodated this volume expansion. Air-cushioned diaphgrams, deformable materials and non-wettable surfaces may be used to permit return of the solder during cooling to its original site. A porous medium with voids sufficient to accommodate expansion may also be used.

Abstract: A method and structure to electrically couple a semiconductor device to a substrate that is divided into a plurality of segments. Alternatively, a semiconductor device may be divided into a plurality of segments and the plurality of segments are electrically coupled to a single substrate.

Abstract: A flexible chip carrier with contact pads on its upper surface matching those of the chip with said pads conductively connected to land grid array (LGA) pads on its lower surface matching the those of a card or PCB. The chip carrier is provided with a stiffening layer at the LGA interface. The stiffening layer is mechanically attached to the lower surface of the chip carrier. Holes are formed in the stiffening layer to expose the LGA pads. The holes are then filled with a conductive adhesive material. Compliant LGA bumps are applied to the uncured conductive adhesive material which material is then cured.