Abstract: The complete outdoor radio unit for LMDS is a light weight, compact transceiver featuring planar circuitry. The transceiver uses cross polarization through an orthomodal transducer and frequency offset between transmit and receive to provide isolation between the transmitter and receiver. The transceiver includes three printed circuit boards directly attached by thermally conductive epoxy to a heat sink which forms part of the antenna dish/transceiver housing for effective heat transfer. Two of the waveguides are used as receiver and transmitter transmission lines into the orthomodal transducer, and two of the waveguides are used as bandpass filters. The transceiver also includes a DC—DC converter in the power supply which is modified to connect the base plate to the heat sink for compactness and improved heat transfer, and a frequency synthesizer with a phase locked loop hardwired to a single reference frequency for compact size.

Abstract: The complete outdoor radio unit for LMDS is a light weight, compact transceiver featuring planar circuitry. The transceiver uses cross polarization through an orthomodal transducer and frequency offeset beteen transmit and receive to provide isolation between the transmitter and receiver. The transceiver includes three printed circuit boards directly attached by thermally conductive epoxy to a heat sink which forms part of the antenna dish/transceiver housing for effective heat transfer. One of the three circuit boards is a millimeter wave circuit board, which is attached to the heat sink by a millimeter ground plane. The millimeter ground plane has a plurality of cavities defined therein which form the lower portion of waveguide assemblies. Two of the waveguides are used as receiver and transmitter transmission lines into the orthomodal transducer, and two of the waveguides are used as bandpass filters. The waveguides interface with the millimeter wave board through microstrips.

Abstract: A process to fabricate a specified height and cross-section of Microwave Monolithic Integrated Circuit gold posts comprising a patterned conductive substrate overlayed by an adhesive layer, a matrix layer, and a photoresist layer. Using photolithographic techniques, gold post locations are defined in the photoresist layer. m Gold post locations and cross-sections are defined in the matrix layer. The adhesive layer at the gold post locations is removed. The gold post locations are plated to form gold posts. The matrix is etched and the adhesive is dissolved.