Abstract: A semiconductor component package includes circuitry that can be used both for mitigating radio-frequency interference of signals in the package and for performing self-test procedures of components in the package. The circuitry includes chokes between the I/O pads of the package and a sensor module in the package to attenuate high-frequency RF interference in the package and protect sensors in the package. Each I/O pad may have a corresponding choke. During a self-test procedure, such as a test of a sensor's temperature coefficient of offset, the chokes can be decoupled from the I/O pads and the sensor module and coupled between a current source and a ground. A current can be supplied to the choke to raise the temperature of the package. The chokes may use high-resistance windings to increase heat generation during the self-test procedure.

Abstract: An electronic device may include one or more ultrasonic temperature sensors. The ultrasonic temperature sensors may be formed in openings or cavities in a housing of the electronic device. The ultrasonic temperature sensors may include ultrasonic transmitters that transmit signals at different ultrasonic frequencies and ultrasonic receivers that receive the transmitted signals. Phase differences between the received ultrasonic signals may be used to determine the speed of sound of ambient air and therefore calculate the temperature of the ambient air. The ultrasonic transmitters and receivers may include piezoelectric micromachined ultrasound transducers (PMUTs). Each transmitter and receiver may be a dedicated transmitter or receiver, or may transmit and receive ultrasonic signals. Each receiver may include an array of PMUTs that receive ultrasonic signals of different frequencies. The PMUTS may be formed on complementary metal-oxide semiconductors (CMOS).

Abstract: A head-mounted device or other electronic device may emit an alternating-current magnetic field. A wireless controller may have alternating-current magnetometers for monitoring the alternating-current field. The wireless controller may also have an accelerometer for measuring the orientation of the controller relative to the Earth's gravity and a direct-current magnetometer for measuring the orientation of the controller relative to the Earth's magnetic field. The alternating-current magnetometers may be three-coil magnetometers located at different locations in a controller housing. Using data from the alternating-current magnetometers, the direct-current magnetometer, the accelerometer, and/or other sensors, the wireless controller can determine the position and orientation of the wireless controller. This information can be wirelessly transmitted to the head-mounted device to control the head-mounted device.

Abstract: A waterproofed environmental sensing device with water detection provisions includes an environmental sensor to sense one or more environmental properties. The device further includes an electronic integrated circuit implemented on a substrate and coupled to the environmental sensor via a wire bonding. An air-permeable cap structure is formed over the environmental sensor, and a protective layer is formed over the wire bonding to protect the wire bonding against damage.

Abstract: Aspects of the subject technology relate to an apparatus including multiple cavities disposed adjacent to one another in a housing structure. The apparatus further includes a number of membranes, with each membrane disposed over a cavity to seal the cavity, and a sensor that can sense a deflection of a respective membrane associated with one of the cavities in response to an applied pressure. Each membrane is operable within a respective pressure range, and the applied pressure is within an operating range of the respective membrane.

Abstract: Aspects of the subject technology relate to an apparatus including multiple cavities disposed adjacent to one another in a housing structure. The apparatus further includes a number of membranes, with each membrane disposed over a cavity to seal the cavity, and a sensor that can sense a deflection of a respective membrane associated with one of the cavities in response to an applied pressure. Each membrane is operable within a respective pressure range, and the applied pressure is within an operating range of the respective membrane.

Abstract: A pressure sensing module for an electronic device includes a substrate and a module housing coupled to the substrate. The module housing defines a first chamber and a second chamber. The second chamber is separate from the first chamber. The first chamber is configured to connect to an environment around an electronic device. The second chamber is configured to connect to an internal volume of the housing of the electronic device. A first pressure sensing element is electrically coupled to the substrate and disposed in the first chamber and is operative to detect an external pressure around the electronic device. A second pressure sensing element is electrically coupled to the substrate and disposed in the second chamber and is operative to detect an internal pressure within the electronic device housing.

Abstract: A waterproofed environmental sensing device with water detection provisions includes an environmental sensor to sense one or more environmental properties. The device further includes an electronic integrated circuit implemented on a substrate and coupled to the environmental sensor via a wire bonding. An air-permeable cap structure is formed over the environmental sensor, and a protective layer is formed over the wire bonding to protect the wire bonding against damage.

Abstract: A waterproofed environmental sensing device with water detection provisions includes an environmental sensor to sense one or more environmental properties. The device further includes an electronic integrated circuit implemented on a substrate and coupled to the environmental sensor via a wire bonding. An air-permeable cap structure is formed over the environmental sensor, and a protective layer is formed over the wire bonding to protect the wire bonding against damage.

Abstract: A pressure sensing module for an electronic device includes a substrate and a module housing coupled to the substrate. The module housing defines a first chamber and a second chamber. The second chamber is separate from the first chamber. The first chamber is configured to connect to an environment around an electronic device. The second chamber is configured to connect to an internal volume of the housing of the electronic device. A first pressure sensing element is electrically coupled to the substrate and disposed in the first chamber and is operative to detect an external pressure around the electronic device. A second pressure sensing element is electrically coupled to the substrate and disposed in the second chamber and is operative to detect an internal pressure within the electronic device housing.

Abstract: An electronic device can include a force and touch sensing system. In one embodiment, an input force sensor device of an electronic device is disclosed.

Abstract: A waterproofed environmental sensing device with water detection provisions includes an environmental sensor to sense one or more environmental properties. The device further includes an electronic integrated circuit implemented on a substrate and coupled to the environmental sensor via a wire bonding. An air-permeable cap structure is formed over the environmental sensor, and a protective layer is formed over the wire bonding to protect the wire bonding against damage.

Abstract: An electronic device can include a force and touch sensing system. In one embodiment, an input force sensor device of an electronic device is disclosed.

Abstract: A strain measurement platform that comprises of a strain die that can be embedded inside a package substrate or have its own substrate with through silicon vias (TSVs) is disclosed. The strain die comprises a body and a base. The base is coupled to the body with strain enhancing structures. Strain enhancing structures are formed on the strain die to amplify the strain signals locally, while also acting as strain and vibration isolators. Strain sensors are formed on or around the strain enhancing structures at locations of maximum strain. The strain sensors can be piezo-resistors, piezo-junctions or piezo-electrics. Strain enhancing structures are implemented either as compliant springs or as a thin membrane over which the base is suspended. A package stack can be mounted on top of the strain die and electrically connected to a strain measuring platform. Some example process flows for fabricating strain die are also disclosed.

Abstract: A planar inverted F antenna structure includes an insulating substrate having a main face, a ground plane conductor on the main face of the substrate, the ground plane conductor having a straight edge, and an antenna element on the main face of the substrate. The antenna element includes a feed portion, a ground return portion, and a radiative arm projecting from the feed portion and extending beside the straight edge of the ground plane conductor. A first edge of the antenna arm is a straight edge that is located between a second edge of the antenna arm and the straight edge of the ground plane conductor and is spaced from the straight edge of the ground plane conductor. The first edge of the antenna arm is inclined to the straight edge of the ground plane conductor.