Patents by Inventor Krishnan Suresh

Krishnan Suresh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11017597
    Abstract: Systems and methods for modifying and generating quadrilateral meshes for computer graphic structures include obtaining a polygon mesh representing a computer graphic structure, the polygon mesh comprising a plurality of polygonal faces and a plurality of singularities, determining, based on a first singularity of the plurality of vertices, selecting, based on one or more characteristics of the patch, a first minimum singularity template (MST) of a plurality of MSTs each representing a corresponding quadmesh that has three or fewer singularities, and replacing, within the polygon mesh, the patch with the first MST.
    Type: Grant
    Filed: June 28, 2019
    Date of Patent: May 25, 2021
    Assignee: WISCONSIN ALUMNI RESEARCH FOUNDATION
    Inventors: Krishnan Suresh, Chaman S. Verma
  • Patent number: 10613496
    Abstract: Systems and methods for generating designs of objects for additive manufacturing (AM) include a topological optimization framework that facilitates optimized computer generated designs requiring significantly reduced support structures. Towards this end, the concept of ‘support structure topological sensitivity’ is introduced. This is combined with performance sensitivity to result in a TO framework that maximizes performance, subject to support structure constraints. The robustness and efficiency of the proposed method is demonstrated through numerical experiments, and validated through fused deposition modeling, a popular AM process.
    Type: Grant
    Filed: September 19, 2016
    Date of Patent: April 7, 2020
    Assignee: Wisconsin Alumni Research Foundation
    Inventors: Krishnan Suresh, Amirmassoud Mirzendehdel
  • Publication number: 20190325647
    Abstract: Systems and methods for modifying and generating quadrilateral meshes for computer graphic structures include obtaining a polygon mesh representing a computer graphic structure, the polygon mesh comprising a plurality of polygonal faces and a plurality of singularities, determining, based on a first singularity of the plurality of vertices, selecting, based on one or more characteristics of the patch, a first minimum singularity template (MST) of a plurality of MSTs each representing a corresponding quadmesh that has three or fewer singularities, and replacing, within the polygon mesh, the patch with the first MST.
    Type: Application
    Filed: June 28, 2019
    Publication date: October 24, 2019
    Applicant: Wisconsin Alumni Research Foundation
    Inventors: Krishnan Suresh, Chaman S. Verma
  • Patent number: 10360726
    Abstract: Systems and methods for modifying and generating quadrilateral meshes for computer graphic structures include obtaining a polygon mesh representing a computer graphic structure, the polygon mesh comprising a plurality of polygonal faces and a plurality of singularities, determining, based on a first singularity of the plurality of vertices, selecting, based on one or more characteristics of the patch, a first minimum singularity template (MST) of a plurality of MSTs each representing a corresponding quadmesh that has three or fewer singularities, and replacing, within the polygon mesh, the patch with the first MST.
    Type: Grant
    Filed: October 7, 2016
    Date of Patent: July 23, 2019
    Assignee: Wisconsin Alumni Research Foundation
    Inventors: Krishnan Suresh, Chaman S. Verma
  • Publication number: 20190178767
    Abstract: A method is provided for carrying out finite element analysis. The method includes the step of meshing a domain under a field with a plurality of finite elements. Each overlapping finite element is detected and a stiffness contribution due to the plurality of finite elements is calculated. A stiffness contribution due to the overlapping finite elements is also calculated and combined with the stiffness contribution due to the plurality of finite element.
    Type: Application
    Filed: February 4, 2019
    Publication date: June 13, 2019
    Inventors: Krishnan Suresh, Joshua Danczyk
  • Patent number: 10102671
    Abstract: Systems and methods for generating approximations and other representations of data in a data set include a generalized non-uniform rational B-splines (NURBS) framework that facilitates optimized computer-generated representations having high accuracy and requiring less computing resources than previous frameworks capable of achieving similar accuracy. The framework includes a set of rational basis functions that define a mesh parametrization of the data set; these rational basis functions are based on the typical NURBS rational basis functions, but decoupled to provide discrete weights in each direction of a parametrized space. The value of each decoupled weight can be individually altered to improve the accuracy of the representation in the corresponding direction without altering the underlying mesh parametrization. The accuracy and efficiency of the proposed methods, particularly for data sets including discontinuities or localized gradients, is demonstrated through numerical experiments.
    Type: Grant
    Filed: February 9, 2017
    Date of Patent: October 16, 2018
    Assignee: Wisconsin Alumni Research Foundation
    Inventors: Krishnan Suresh, Alireza H. Taheri
  • Publication number: 20180225871
    Abstract: Systems and methods for generating approximations and other representations of data in a data set include a generalized non-uniform rational B-splines (NURBS) framework that facilitates optimized computer-generated representations having high accuracy and requiring less computing resources than previous frameworks capable of achieving similar accuracy. The framework includes a set of rational basis functions that define a mesh parametrization of the data set; these rational basis functions are based on the typical NURBS rational basis functions, but decoupled to provide discrete weights in each direction of a parametrized space. The value of each decoupled weight can be individually altered to improve the accuracy of the representation in the corresponding direction without altering the underlying mesh parametrization. The accuracy and efficiency of the proposed methods, particularly for data sets including discontinuities or localized gradients, is demonstrated through numerical experiments.
    Type: Application
    Filed: February 9, 2017
    Publication date: August 9, 2018
    Inventors: Krishnan Suresh, Alireza H. Taheri
  • Publication number: 20180101983
    Abstract: Systems and methods for modifying and generating quadrilateral meshes for computer graphic structures include obtaining a polygon mesh representing a computer graphic structure, the polygon mesh comprising a plurality of polygonal faces and a plurality of singularities, determining, based on a first singularity of the plurality of vertices, selecting, based on one or more characteristics of the patch, a first minimum singularity template (MST) of a plurality of MSTs each representing a corresponding quadmesh that has three or fewer singularities, and replacing, within the polygon mesh, the patch with the first MST.
    Type: Application
    Filed: October 7, 2016
    Publication date: April 12, 2018
    Inventors: KRISHNAN SURESH, CHAMAN S. VERMA
  • Publication number: 20180079149
    Abstract: Systems and methods for generating designs of objects for additive manufacturing (AM) include a topological optimization framework that facilitates optimized computer generated designs requiring significantly reduced support structures. Towards this end, the concept of ‘support structure topological sensitivity’ is introduced. This is combined with performance sensitivity to result in a TO framework that maximizes performance, subject to support structure constraints. The robustness and efficiency of the proposed method is demonstrated through numerical experiments, and validated through fused deposition modeling, a popular AM process.
    Type: Application
    Filed: September 19, 2016
    Publication date: March 22, 2018
    Inventors: Krishnan Suresh, Amirmassoud Mirzendehdel
  • Publication number: 20140260654
    Abstract: A method is provided for carrying out finite element analysis. The method includes the step of meshing a domain under a field with a plurality of finite elements. Each overlapping finite element is detected and a stiffness contribution due to the plurality of finite elements is calculated. A stiffness contribution due to the overlapping finite elements is also calculated and combined with the stiffness contribution due to the plurality of finite element.
    Type: Application
    Filed: March 14, 2013
    Publication date: September 18, 2014
    Applicant: Wisconsin Alumni Research Foundation
    Inventors: Krishnan Suresh, Joshua Danczyk
  • Patent number: 8355893
    Abstract: A method and system for simulating and analyzing the behavior of a structural component of a computerized model in response to a simulated event to determine an optimized shape for the component is disclosed. The shape is optimized using an implicit dimensional reduction rather than an explicit geometric replacement by discarding data of a 3D discretization that has little or no bearing on the performance of the component to a simulated event. The reduced dataset is then collapsed onto a lower dimension projection that is applied over a force vector that is representative of the simulated event to determine the behavior of the component to the simulated event. Optimization tools may then be used to modify the physical attributes of the component and performance of the component once again simulated until an optimized component is determined.
    Type: Grant
    Filed: December 12, 2008
    Date of Patent: January 15, 2013
    Assignee: Wisconsin Alumni Research Foundation
    Inventors: Krishnan Suresh, Kavous Jorabchi, Josh Danczyk
  • Patent number: 8346584
    Abstract: An engineering simulation tool uses boundary regions of proposed design modifications to a finite design element to assess the impact of those proposed design modifications. This tool allows a designer to incorporate a new design feature into a proposed model and generate simulated performance results for the proposed design without re-execution of finite element method.
    Type: Grant
    Filed: January 30, 2008
    Date of Patent: January 1, 2013
    Assignee: Wisconsin Alumni Research Foundation
    Inventors: Krishnan Suresh, Sankara Hari Gopalakrishnan
  • Publication number: 20100153077
    Abstract: A method and system for simulating and analyzing the behavior of a structural component of a computerized model in response to a simulated event to determine an optimized shape for the component is disclosed. The shape is optimized using an implicit dimensional reduction rather than an explicit geometric replacement by discarding data of a 3D discretization that has little or no bearing on the performance of the component to a simulated event. The reduced dataset is then collapsed onto a lower dimension projection that is applied over a force vector that is representative of the simulated event to determine the behavior of the component to the simulated event. Optimization tools may then be used to modify the physical attributes of the component and performance of the component once again simulated until an optimized component is determined.
    Type: Application
    Filed: December 12, 2008
    Publication date: June 17, 2010
    Inventors: Krishnan Suresh, Kavous Jorabchi, Josh Danczyk
  • Publication number: 20080183524
    Abstract: An engineering simulation tool uses boundary regions of proposed design modifications to a finite design element to assess the impact of those proposed design modifications. This tool allows a designer to incorporate a new design feature into a proposed model and generate simulated performance results for the proposed design without re-execution of finite element method.
    Type: Application
    Filed: January 30, 2008
    Publication date: July 31, 2008
    Inventors: Krishnan Suresh, Sankara Hari Gopalakrishnan
  • Patent number: 7320423
    Abstract: A wire bonding machine is disclosed for bonding a wire to a semiconductor device. The wire bonding machine includes a wire bonding head having a bonding tool mounted to it. The bonding tool is adapted to attach a wire end to a semiconductor device. At least a portion of the bonding head is pivotable about a first horizontal axis so as to provide vertical displacement of the bonding tool. The bonding head is also rotatably mounted to the bonding machine so as to permit rotation of the bonding tool about a vertically oriented rotational axis. The machine also includes a work table for supporting at least one semiconductor device to be wire bonded. A conveyance system is used to translate the work table in a direction relative to the bonding head and in a substantially orthogonal direction to the horizontal pivot axis of the bonding head.
    Type: Grant
    Filed: November 17, 2003
    Date of Patent: January 22, 2008
    Assignee: Kulicke and Soffa Industries, Inc.
    Inventors: Krishnan Suresh, David T. Beatson
  • Publication number: 20060277008
    Abstract: A method for simplifying engineering analysis of CAD geometric models, one which retains much of the accuracy of detailed finite element (FE) analysis while avoiding its computational burdens, is described. A skeleton, such as an exact or approximate medial mesh, is defined within the model, and the skeleton is then meshed. Known field values (physical values of interest, and/or their derivatives) are then “projected” onto the skeleton, as by interpolation or coordinate transformation, and these field values and the governing equations for the model and its engineering problem are then used to solve for unknown field values across all or desired portions of the skeletal mesh. The newly-determined field values may then be projected outwardly from the skeletal mesh to the remainder of the geometric model, again via interpolation or other methods. The method is found to be particularly efficient and accurate (again in comparison to standard FE methods) when applied to thin geometric objects, e.g.
    Type: Application
    Filed: June 2, 2005
    Publication date: December 7, 2006
    Inventor: Krishnan Suresh
  • Publication number: 20040129754
    Abstract: A wire bonding machine is disclosed for bonding a wire to a semiconductor device. The wire bonding machine includes a wire bonding head having a bonding tool mounted to it. The bonding tool is adapted to attach a wire end to a semiconductor device. At least a portion of the bonding head is pivotable about a first horizontal axis so as to provide vertical displacement of the bonding tool. The bonding head is also rotatably mounted to the bonding machine so as to permit rotation of the bonding tool about a vertically oriented rotational axis. The machine also includes a work table for supporting at least one semiconductor device to be wire bonded. A conveyance system is used to translate the work table in a direction relative to the bonding head and in a substantially orthogonal direction to the horizontal pivot axis of the bonding head.
    Type: Application
    Filed: November 17, 2003
    Publication date: July 8, 2004
    Inventors: Krishnan Suresh, David T. Beatson
  • Patent number: 6634545
    Abstract: An apparatus and method for high speed, reliable and repeatable delivery and reflow of solder material onto a substrate are disclosed. The apparatus has a repositionable capillary to direct individual solder material to a specific location on the substrate. An energy source is directed through the capillary onto the solder to reflow the solder to the substrate. The apparatus provides for individual introduction of the solder material into the capillary and urging of the solder material from a reservoir to the capillary while preventing unintended jams and blockage of the solder material.
    Type: Grant
    Filed: November 7, 2001
    Date of Patent: October 21, 2003
    Assignee: Kulicke & Soffa Investments, Inc.
    Inventors: Eli Razon, Vaughn Svendsen, Robert Kowtko, Kyle Dury, Krishnan Suresh
  • Patent number: 6386433
    Abstract: An apparatus and method for high speed, reliable and repeatable delivery and reflow of solder material onto a substrate are disclosed. The apparatus has a repositionable capillary to direct individual solder material to a specific location on the substrate. An energy source is directed through the capillary onto the solder to reflow the solder to the substrate. The apparatus provides for individual introduction of the solder material into the capillary and urging of the solder material from a reservoir to the capillary while preventing unintended jams and blockage of the solder material.
    Type: Grant
    Filed: August 11, 2000
    Date of Patent: May 14, 2002
    Assignee: Kulicke & Soffa Investments, Inc.
    Inventors: Eli Razon, Vaughn Svendsen, Robert Kowtko, Kyle Dury, Krishnan Suresh
  • Publication number: 20020053591
    Abstract: An apparatus and method for high speed, reliable and repeatable delivery and reflow of solder material onto a substrate are disclosed. The apparatus has a repositionable capillary to direct individual solder material to a specific location on the substrate. An energy source is directed through the capillary onto the solder to reflow the solder to the substrate. The apparatus provides for individual introduction of the solder material into the capillary and urging of the solder material from a reservoir to the capillary while preventing unintended jams and blockage of the solder material.
    Type: Application
    Filed: November 7, 2001
    Publication date: May 9, 2002
    Inventors: Eli Razon, Vaughn Svendsen, Robert Kowtko, Kyle Dury, Krishnan Suresh