Patents by Inventor Krishnan Suresh
Krishnan Suresh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11017597Abstract: Systems and methods for modifying and generating quadrilateral meshes for computer graphic structures include obtaining a polygon mesh representing a computer graphic structure, the polygon mesh comprising a plurality of polygonal faces and a plurality of singularities, determining, based on a first singularity of the plurality of vertices, selecting, based on one or more characteristics of the patch, a first minimum singularity template (MST) of a plurality of MSTs each representing a corresponding quadmesh that has three or fewer singularities, and replacing, within the polygon mesh, the patch with the first MST.Type: GrantFiled: June 28, 2019Date of Patent: May 25, 2021Assignee: WISCONSIN ALUMNI RESEARCH FOUNDATIONInventors: Krishnan Suresh, Chaman S. Verma
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Patent number: 10613496Abstract: Systems and methods for generating designs of objects for additive manufacturing (AM) include a topological optimization framework that facilitates optimized computer generated designs requiring significantly reduced support structures. Towards this end, the concept of ‘support structure topological sensitivity’ is introduced. This is combined with performance sensitivity to result in a TO framework that maximizes performance, subject to support structure constraints. The robustness and efficiency of the proposed method is demonstrated through numerical experiments, and validated through fused deposition modeling, a popular AM process.Type: GrantFiled: September 19, 2016Date of Patent: April 7, 2020Assignee: Wisconsin Alumni Research FoundationInventors: Krishnan Suresh, Amirmassoud Mirzendehdel
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Publication number: 20190325647Abstract: Systems and methods for modifying and generating quadrilateral meshes for computer graphic structures include obtaining a polygon mesh representing a computer graphic structure, the polygon mesh comprising a plurality of polygonal faces and a plurality of singularities, determining, based on a first singularity of the plurality of vertices, selecting, based on one or more characteristics of the patch, a first minimum singularity template (MST) of a plurality of MSTs each representing a corresponding quadmesh that has three or fewer singularities, and replacing, within the polygon mesh, the patch with the first MST.Type: ApplicationFiled: June 28, 2019Publication date: October 24, 2019Applicant: Wisconsin Alumni Research FoundationInventors: Krishnan Suresh, Chaman S. Verma
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Patent number: 10360726Abstract: Systems and methods for modifying and generating quadrilateral meshes for computer graphic structures include obtaining a polygon mesh representing a computer graphic structure, the polygon mesh comprising a plurality of polygonal faces and a plurality of singularities, determining, based on a first singularity of the plurality of vertices, selecting, based on one or more characteristics of the patch, a first minimum singularity template (MST) of a plurality of MSTs each representing a corresponding quadmesh that has three or fewer singularities, and replacing, within the polygon mesh, the patch with the first MST.Type: GrantFiled: October 7, 2016Date of Patent: July 23, 2019Assignee: Wisconsin Alumni Research FoundationInventors: Krishnan Suresh, Chaman S. Verma
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Publication number: 20190178767Abstract: A method is provided for carrying out finite element analysis. The method includes the step of meshing a domain under a field with a plurality of finite elements. Each overlapping finite element is detected and a stiffness contribution due to the plurality of finite elements is calculated. A stiffness contribution due to the overlapping finite elements is also calculated and combined with the stiffness contribution due to the plurality of finite element.Type: ApplicationFiled: February 4, 2019Publication date: June 13, 2019Inventors: Krishnan Suresh, Joshua Danczyk
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Patent number: 10102671Abstract: Systems and methods for generating approximations and other representations of data in a data set include a generalized non-uniform rational B-splines (NURBS) framework that facilitates optimized computer-generated representations having high accuracy and requiring less computing resources than previous frameworks capable of achieving similar accuracy. The framework includes a set of rational basis functions that define a mesh parametrization of the data set; these rational basis functions are based on the typical NURBS rational basis functions, but decoupled to provide discrete weights in each direction of a parametrized space. The value of each decoupled weight can be individually altered to improve the accuracy of the representation in the corresponding direction without altering the underlying mesh parametrization. The accuracy and efficiency of the proposed methods, particularly for data sets including discontinuities or localized gradients, is demonstrated through numerical experiments.Type: GrantFiled: February 9, 2017Date of Patent: October 16, 2018Assignee: Wisconsin Alumni Research FoundationInventors: Krishnan Suresh, Alireza H. Taheri
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Publication number: 20180225871Abstract: Systems and methods for generating approximations and other representations of data in a data set include a generalized non-uniform rational B-splines (NURBS) framework that facilitates optimized computer-generated representations having high accuracy and requiring less computing resources than previous frameworks capable of achieving similar accuracy. The framework includes a set of rational basis functions that define a mesh parametrization of the data set; these rational basis functions are based on the typical NURBS rational basis functions, but decoupled to provide discrete weights in each direction of a parametrized space. The value of each decoupled weight can be individually altered to improve the accuracy of the representation in the corresponding direction without altering the underlying mesh parametrization. The accuracy and efficiency of the proposed methods, particularly for data sets including discontinuities or localized gradients, is demonstrated through numerical experiments.Type: ApplicationFiled: February 9, 2017Publication date: August 9, 2018Inventors: Krishnan Suresh, Alireza H. Taheri
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Publication number: 20180101983Abstract: Systems and methods for modifying and generating quadrilateral meshes for computer graphic structures include obtaining a polygon mesh representing a computer graphic structure, the polygon mesh comprising a plurality of polygonal faces and a plurality of singularities, determining, based on a first singularity of the plurality of vertices, selecting, based on one or more characteristics of the patch, a first minimum singularity template (MST) of a plurality of MSTs each representing a corresponding quadmesh that has three or fewer singularities, and replacing, within the polygon mesh, the patch with the first MST.Type: ApplicationFiled: October 7, 2016Publication date: April 12, 2018Inventors: KRISHNAN SURESH, CHAMAN S. VERMA
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Publication number: 20180079149Abstract: Systems and methods for generating designs of objects for additive manufacturing (AM) include a topological optimization framework that facilitates optimized computer generated designs requiring significantly reduced support structures. Towards this end, the concept of ‘support structure topological sensitivity’ is introduced. This is combined with performance sensitivity to result in a TO framework that maximizes performance, subject to support structure constraints. The robustness and efficiency of the proposed method is demonstrated through numerical experiments, and validated through fused deposition modeling, a popular AM process.Type: ApplicationFiled: September 19, 2016Publication date: March 22, 2018Inventors: Krishnan Suresh, Amirmassoud Mirzendehdel
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Publication number: 20140260654Abstract: A method is provided for carrying out finite element analysis. The method includes the step of meshing a domain under a field with a plurality of finite elements. Each overlapping finite element is detected and a stiffness contribution due to the plurality of finite elements is calculated. A stiffness contribution due to the overlapping finite elements is also calculated and combined with the stiffness contribution due to the plurality of finite element.Type: ApplicationFiled: March 14, 2013Publication date: September 18, 2014Applicant: Wisconsin Alumni Research FoundationInventors: Krishnan Suresh, Joshua Danczyk
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Patent number: 8355893Abstract: A method and system for simulating and analyzing the behavior of a structural component of a computerized model in response to a simulated event to determine an optimized shape for the component is disclosed. The shape is optimized using an implicit dimensional reduction rather than an explicit geometric replacement by discarding data of a 3D discretization that has little or no bearing on the performance of the component to a simulated event. The reduced dataset is then collapsed onto a lower dimension projection that is applied over a force vector that is representative of the simulated event to determine the behavior of the component to the simulated event. Optimization tools may then be used to modify the physical attributes of the component and performance of the component once again simulated until an optimized component is determined.Type: GrantFiled: December 12, 2008Date of Patent: January 15, 2013Assignee: Wisconsin Alumni Research FoundationInventors: Krishnan Suresh, Kavous Jorabchi, Josh Danczyk
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Method and apparatus for determining design modification effects on a computerized engineering model
Patent number: 8346584Abstract: An engineering simulation tool uses boundary regions of proposed design modifications to a finite design element to assess the impact of those proposed design modifications. This tool allows a designer to incorporate a new design feature into a proposed model and generate simulated performance results for the proposed design without re-execution of finite element method.Type: GrantFiled: January 30, 2008Date of Patent: January 1, 2013Assignee: Wisconsin Alumni Research FoundationInventors: Krishnan Suresh, Sankara Hari Gopalakrishnan -
Publication number: 20100153077Abstract: A method and system for simulating and analyzing the behavior of a structural component of a computerized model in response to a simulated event to determine an optimized shape for the component is disclosed. The shape is optimized using an implicit dimensional reduction rather than an explicit geometric replacement by discarding data of a 3D discretization that has little or no bearing on the performance of the component to a simulated event. The reduced dataset is then collapsed onto a lower dimension projection that is applied over a force vector that is representative of the simulated event to determine the behavior of the component to the simulated event. Optimization tools may then be used to modify the physical attributes of the component and performance of the component once again simulated until an optimized component is determined.Type: ApplicationFiled: December 12, 2008Publication date: June 17, 2010Inventors: Krishnan Suresh, Kavous Jorabchi, Josh Danczyk
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METHOD AND APPARATUS FOR DETERMINING DESIGN MODIFICATION EFFECTS ON A COMPUTERIZED ENGINEERING MODEL
Publication number: 20080183524Abstract: An engineering simulation tool uses boundary regions of proposed design modifications to a finite design element to assess the impact of those proposed design modifications. This tool allows a designer to incorporate a new design feature into a proposed model and generate simulated performance results for the proposed design without re-execution of finite element method.Type: ApplicationFiled: January 30, 2008Publication date: July 31, 2008Inventors: Krishnan Suresh, Sankara Hari Gopalakrishnan -
Patent number: 7320423Abstract: A wire bonding machine is disclosed for bonding a wire to a semiconductor device. The wire bonding machine includes a wire bonding head having a bonding tool mounted to it. The bonding tool is adapted to attach a wire end to a semiconductor device. At least a portion of the bonding head is pivotable about a first horizontal axis so as to provide vertical displacement of the bonding tool. The bonding head is also rotatably mounted to the bonding machine so as to permit rotation of the bonding tool about a vertically oriented rotational axis. The machine also includes a work table for supporting at least one semiconductor device to be wire bonded. A conveyance system is used to translate the work table in a direction relative to the bonding head and in a substantially orthogonal direction to the horizontal pivot axis of the bonding head.Type: GrantFiled: November 17, 2003Date of Patent: January 22, 2008Assignee: Kulicke and Soffa Industries, Inc.Inventors: Krishnan Suresh, David T. Beatson
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Publication number: 20060277008Abstract: A method for simplifying engineering analysis of CAD geometric models, one which retains much of the accuracy of detailed finite element (FE) analysis while avoiding its computational burdens, is described. A skeleton, such as an exact or approximate medial mesh, is defined within the model, and the skeleton is then meshed. Known field values (physical values of interest, and/or their derivatives) are then “projected” onto the skeleton, as by interpolation or coordinate transformation, and these field values and the governing equations for the model and its engineering problem are then used to solve for unknown field values across all or desired portions of the skeletal mesh. The newly-determined field values may then be projected outwardly from the skeletal mesh to the remainder of the geometric model, again via interpolation or other methods. The method is found to be particularly efficient and accurate (again in comparison to standard FE methods) when applied to thin geometric objects, e.g.Type: ApplicationFiled: June 2, 2005Publication date: December 7, 2006Inventor: Krishnan Suresh
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Publication number: 20040129754Abstract: A wire bonding machine is disclosed for bonding a wire to a semiconductor device. The wire bonding machine includes a wire bonding head having a bonding tool mounted to it. The bonding tool is adapted to attach a wire end to a semiconductor device. At least a portion of the bonding head is pivotable about a first horizontal axis so as to provide vertical displacement of the bonding tool. The bonding head is also rotatably mounted to the bonding machine so as to permit rotation of the bonding tool about a vertically oriented rotational axis. The machine also includes a work table for supporting at least one semiconductor device to be wire bonded. A conveyance system is used to translate the work table in a direction relative to the bonding head and in a substantially orthogonal direction to the horizontal pivot axis of the bonding head.Type: ApplicationFiled: November 17, 2003Publication date: July 8, 2004Inventors: Krishnan Suresh, David T. Beatson
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Patent number: 6634545Abstract: An apparatus and method for high speed, reliable and repeatable delivery and reflow of solder material onto a substrate are disclosed. The apparatus has a repositionable capillary to direct individual solder material to a specific location on the substrate. An energy source is directed through the capillary onto the solder to reflow the solder to the substrate. The apparatus provides for individual introduction of the solder material into the capillary and urging of the solder material from a reservoir to the capillary while preventing unintended jams and blockage of the solder material.Type: GrantFiled: November 7, 2001Date of Patent: October 21, 2003Assignee: Kulicke & Soffa Investments, Inc.Inventors: Eli Razon, Vaughn Svendsen, Robert Kowtko, Kyle Dury, Krishnan Suresh
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Patent number: 6386433Abstract: An apparatus and method for high speed, reliable and repeatable delivery and reflow of solder material onto a substrate are disclosed. The apparatus has a repositionable capillary to direct individual solder material to a specific location on the substrate. An energy source is directed through the capillary onto the solder to reflow the solder to the substrate. The apparatus provides for individual introduction of the solder material into the capillary and urging of the solder material from a reservoir to the capillary while preventing unintended jams and blockage of the solder material.Type: GrantFiled: August 11, 2000Date of Patent: May 14, 2002Assignee: Kulicke & Soffa Investments, Inc.Inventors: Eli Razon, Vaughn Svendsen, Robert Kowtko, Kyle Dury, Krishnan Suresh
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Publication number: 20020053591Abstract: An apparatus and method for high speed, reliable and repeatable delivery and reflow of solder material onto a substrate are disclosed. The apparatus has a repositionable capillary to direct individual solder material to a specific location on the substrate. An energy source is directed through the capillary onto the solder to reflow the solder to the substrate. The apparatus provides for individual introduction of the solder material into the capillary and urging of the solder material from a reservoir to the capillary while preventing unintended jams and blockage of the solder material.Type: ApplicationFiled: November 7, 2001Publication date: May 9, 2002Inventors: Eli Razon, Vaughn Svendsen, Robert Kowtko, Kyle Dury, Krishnan Suresh