Patents by Inventor Kristen J. Law
Kristen J. Law has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 10262543Abstract: A collaborative aviation information collection and distribution system includes a plurality of aircraft data transmitters and an aircraft data processing system. Each aircraft data transmitter is configured to selectively transmit aircraft data associated with a subscribing aircraft. The aircraft data processing system is in operable communication with each of the aircraft data transmitters and includes a data receiver, a data transmitter, and a data processor. The data receiver receives aircraft data transmitted from each of the aircraft transmitters. The data transmitter selectively transmits actionable aircraft data to one or more of the subscribing aircraft or subscribing ground-based users.Type: GrantFiled: July 17, 2017Date of Patent: April 16, 2019Assignee: HONEYWELL INTERNATIONAL INC.Inventors: Carl Esposito, Kristen J. Law, David B. Goldstein, Kenneth R. Jongsma
-
Publication number: 20170316700Abstract: A collaborative aviation information collection and distribution system includes a plurality of aircraft data transmitters and an aircraft data processing system. Each aircraft data transmitter is configured to selectively transmit aircraft data associated with a subscribing aircraft. The aircraft data processing system is in operable communication with each of the aircraft data transmitters and includes a data receiver, a data transmitter, and a data processor. The data receiver receives aircraft data transmitted from each of the aircraft transmitters. The data transmitter selectively transmits actionable aircraft data to one or more of the subscribing aircraft or subscribing ground-based users.Type: ApplicationFiled: July 17, 2017Publication date: November 2, 2017Applicant: HONEYWELL INTERNATIONAL INC.Inventors: Carl Esposito, Kristen J. Law, David B. Goldstein, Kenneth R. Jongsma
-
Patent number: 9786185Abstract: A collaborative aviation information collection and distribution system includes a plurality of aircraft data transmitters and an aircraft data processing system. Each aircraft data transmitter is configured to selectively transmit aircraft data associated with a subscribing aircraft. The aircraft data processing system is in operable communication with each of the aircraft data transmitters and includes a data receiver, a data transmitter, and a data processor. The data receiver receives aircraft data transmitted from each of the aircraft transmitters. The data transmitter selectively transmits actionable aircraft data to one or more of the subscribing aircraft or subscribing ground-based users.Type: GrantFiled: July 2, 2014Date of Patent: October 10, 2017Assignee: HONEYWELL INTERNATIONAL INC.Inventors: Carl Esposito, Kristen J. Law, David B. Goldstein, Kenneth R. Jongsma
-
Publication number: 20150243173Abstract: A collaborative aviation information collection and distribution system includes a plurality of aircraft data transmitters and an aircraft data processing system. Each aircraft data transmitter is configured to selectively transmit aircraft data associated with a subscribing aircraft. The aircraft data processing system is in operable communication with each of the aircraft data transmitters and includes a data receiver, a data transmitter, and a data processor. The data receiver receives aircraft data transmitted from each of the aircraft transmitters. The data transmitter selectively transmits actionable aircraft data to one or more of the subscribing aircraft or subscribing ground-based users.Type: ApplicationFiled: July 2, 2014Publication date: August 27, 2015Applicant: HONEYWELL INTERNATIONAL INC.Inventors: Carl Esposito, Kristen J. Law, David B. Goldstein, Kenneth R. Jongsma
-
Publication number: 20040109298Abstract: A dielectric substrate useful in the manufacture of printed wiring boards is disclosed wherein the dielectric substrate comprises at least one organic polymer having a Tg greater than 140° C. and at least one filler material. The dielectric substrate of this invention has a dielectric constant that varies less than 15% over a temperature range of from −55 to 125° C. Additionally, a method for producing integral capacitance components for inclusion within printed circuit boards. Hydrothermally prepared nanopowders permit the fabrication of very thin dielectric layers that offer increased dielectric constants and are readily penetrated by microvias. Disclosed is a method of preparing a slurry or suspension of a hydrothermally prepared nanopowder and solvent. A suitable bonding material, such as a polymer is mixed with the nanopowder slurry, to generate a composite mixture that is formed into a dielectric layer.Type: ApplicationFiled: August 19, 2003Publication date: June 10, 2004Inventors: William F. Hartman, Kirk M. Slenes, Kristen J. Law
-
Patent number: 6616794Abstract: A method for producing integral capacitance components for inclusion within printed circuit boards. Hydrothermally prepared nanopowders permit the fabrication of a very thin dielectric layers that offer increased dielectric constants and are readily penetrated by microvias. Disclosed is a method of preparing a slurry or suspension of a hydrothermally prepared nanopowder and solvent. A suitable bonding material, such as a polymer is mixed with the nanopowder slurry, to generate a composite mixture which is formed into a dielectric layer. The dielectric layer may be placed upon a conductive layer prior to curing, or conductive layers may be applied upon a cured dielectric layer, either by lamination or by metallization processes, such as vapor deposition or sputtering.Type: GrantFiled: May 4, 1999Date of Patent: September 9, 2003Assignee: TPL, Inc.Inventors: William F. Hartman, Kirk M. Slenes, Kristen J. Law
-
Patent number: 6608760Abstract: A dielectric substrate useful in the manufacture of printed wiring boards is disclosed wherein the dielectric substrate comprises at least one organic polymer having a Tg greater than 140° C. and at least one filler material. The dielectric substrate of this invention has a dielectric constant that varies less than 15% over a temperature range of from −55 to 125° C.Type: GrantFiled: December 9, 1999Date of Patent: August 19, 2003Assignee: TPL, Inc.Inventors: William F. Hartman, Kirk M. Slenes, Kristen J. Law
-
Publication number: 20020062924Abstract: A method of fabricating a passive integrated circuit. The integrated circuitry is fabricated in a single plane, the circuitry including passive components such as capacitors, resistors, and inductors. The method features the steps of forming on a substrate a first pattern of conductive material and a first set of passive component elements, and depositing a patterned dielectric layer onto the substrate. The first pattern of conductive material provides electrical connectivity to the first set of passive component elements.Type: ApplicationFiled: November 9, 2001Publication date: May 30, 2002Inventors: William F. Hartman, Kirk M. Slenes, Kristen J. Law
-
Publication number: 20010040007Abstract: A method for producing integral capacitance components for inclusion within printed circuit boards. Hydrothermally prepared nanopowders permit the fabrication of a very thin dielectric layers that offer increased dielectric constants and are readily penetrated by microvias. Disclosed is a method of preparing a slurry or suspension of a hydrothermally prepared nanopowder and solvent. A suitable bonding material, such as a polymer is mixed with the nanopowder slurry, to generate a composite mixture which is formed into a dielectric layer. The dielectric layer may be placed upon a conductive layer prior to curing, or conductive layers may be applied upon a cured dielectric layer, either by lamination or by metallization processes, such as vapor deposition or sputtering.Type: ApplicationFiled: May 4, 1999Publication date: November 15, 2001Inventors: WILLIAM F. HARTMAN, KIRK M. SLENES, KRISTEN J. LAW
-
Publication number: 20010036052Abstract: A dielectric substrate useful in the manufacture of printed wiring boards is disclosed wherein the dielectric substrate comprises at least one organic polymer having a Tg greater than 140° C. and at least one filler material. The dielectric substrate of this invention has a dielectric constant that varies less than 15% over a temperature range of from −55 to 125° C.Type: ApplicationFiled: December 9, 1999Publication date: November 1, 2001Inventors: WILLIAM F. HARTMAN, KIRK M. SLENES, KRISTEN J. LAW
-
Patent number: 6265058Abstract: The present invention is a dielectric film, and method for making the film, suitable for use in the construction of capacitor devices, including wound capacitors. In order to overcome strength limitations associated with polymers having desirable dielectric properties, the invention includes a dielectric film featuring a polymer impregnated upon a strengthening substrate. The polymer is deposited directly upon the substrate, which substrate provides required physical strength for film processing and capacitor fabrication, without compromising dielectric performance. The inventive film is based on siloxane polymers modified with polar pendant groups to provide a significant increase in dielectric constant and dielectric strength. During film production, the polymer infiltrates the porous paper to provide an interfacial composite layer between the two materials, the interfacial layer consisting of polymer and paper.Type: GrantFiled: March 5, 1999Date of Patent: July 24, 2001Assignee: TPL, Inc.Inventors: Kirk M. Slenes, Kristen J. Law, William F. Hartman