Abstract: A device for removing a heatspreader from an integrated circuit package (ICP) according to the present invention. The device includes a base piece that is preferably made of a suitably rigid and thermally conductive base material such as tool steel. The base piece defines a base cavity that is adapted to receive and engage the heatspreader. The depth of the base cavity is approximately equal to a thickness of the heatspreader. The device further includes a top piece comprised of a suitable top material such as tool steel. The top piece includes a body portion from which an elongated member or handle extends. The body portion of the top piece defines a top cavity adapted to receive and engage the integrated circuit package. The elongated member is suitable for manipulating the body portion of the top piece to apply a torquing force to the ICP package when it is engaged in the top cavity.