Abstract: A rotary machine seal assembly (200) includes seal segments (102) configured to circumferentially extend around a rotor (108) between a stator (106) and the rotor (108) of a rotary machine. One or more seal segments include a shoe plate (110, 410, 710, 910), a seal base (112, 412, 712, 912), and at least one intermediate member (114, 414, 714). The shoe plate is disposed along the rotor. The seal base is disposed radially outward of the shoe plate. At least one intermediate member is coupled to and disposed between the seal base and the shoe plate. The at least one intermediate member includes an actuator portion (302, 402, 702, 902) having first coefficient of thermal expansion and a constrictor portion (304, 404, 704, 904) having a different, second coefficient of thermal expansion.

Abstract: A system for an electronic device includes a housing having one or more walls that define an internal region. An outlet port is fluidically coupled to the internal region of the housing, which allows emission of a fluid from the internal region of the housing as a first flow at a first temperature. A merging element, fluidically coupled to the outlet port, merges the first flow with a second flow, which has a second temperature that is less than the first temperature.

Abstract: A system for an electronic device includes a housing having one or more walls that define an internal region. An outlet port is fluidically coupled to the internal region of the housing, which allows emission of a fluid from the internal region of the housing as a first flow at a first temperature. A merging element, fluidically coupled to the outlet port, merges the first flow with a second flow, which has a second temperature that is less than the first temperature.

Abstract: An enclosure for an energy storage device is presently disclosed. The enclosure includes a cell housing having a base portion and at least one side portion seamlessly extending from the base portion to define a volume and having a peripheral edge defining an aperture distal from the base portion through which an electrochemical cell may be disposed within the volume, and a cover securable to the peripheral edge of the housing, where the housing and cover are configured to house at least one electrochemical cell at an operating temperature greater than about 100 degrees Celsius. The enclosure may also include an environmental housing configured to nestingly receive the cell housing, and an insulating element disposed between the environmental housing and the cell housing. Also disclosed is a method of packaging the energy storage device utilizing the enclosure.

Abstract: An electrochemical device is disclosed that includes a plurality of cells that each include a face, wherein a terminal is disposed on the faces of each respective cell. A bus bar has a bus bar height and electrically couples the terminals from cell-to-cell within the electrochemical device. A plurality of sheets are disposed between the plurality of cells, the plurality of sheets are substantially the same height as the combined, height of each cell and bus bar.

Abstract: Method of forming a microelectronic package using control of die and substrate differential expansions. The method includes: providing a die-substrate combination including a substrate, a die disposed on the substrate, and plurality of solder paste disposed between the die and the substrate; reflowing the solder paste by exposing the die-substrate combination to temperatures changes including heating the die-substrate combination to liquefy the solder paste, and cooling down the die-substrate combination until the solder paste has solidified to form solder joints to yield the package; and controlling an expansion of the die and the substrate at least during cooling down to mitigate a relative difference in volumetric strain between the die and the substrate. Controlling may comprise exposing the die-substrate combination to pressure changes at least during cooling down.

Abstract: Arrangements are used to supply power to a semiconductor package.

Abstract: Methods and systems for attaching a chip to a next level package by directing radiant energy at the chip back side while substantially preventing irradiation of the next level package are described.

Abstract: Arrangements are used to supply power to a semiconductor package.

Abstract: An integrated circuit package includes a first chip and a folded flexible substrate. The flexible substrate has a first surface and an opposing second surface and is disposed to partially surround the first chip. A first routing layer is formed on the first surface of the flexible substrate and a second routing layer is formed on the second surface of the flexible substrate. A metal ground plane is formed on a selected one of the first and the second surfaces.

Abstract: A heat spreader and stiffener device has a stiffener portion extending towards a center of the heat spreader and stiffener device and mountable to a die-side surface of a substrate.

Abstract: Methods and systems for attaching a chip to a next level package by directing radiant energy at the chip back side while substantially preventing irradiation of the next level package are described.

Abstract: Provided are methods and devices in which an inductor is embedded in a package adapted to carry an integrated circuit and a magnetically permeable material is also embedded in the package so that the inductor and the magnetically permeable material are magnetically coupled to each other. In one embodiment, the magnetic permeable material is shaped as a pin which is press-fit into the core of a helix-shaped inductor embedded in the package substrate.

Abstract: An integrated circuit package includes a first chip and a folded flexible substrate. The flexible substrate has a first surface and an opposing second surface and is disposed to partially surround the first chip. A first routing layer is formed on the first surface of the flexible substrate and a second routing layer is formed on the second surface of the flexible substrate. A metal ground plane is formed on a selected one of the first and the second surfaces.

Abstract: An electronic assembly includes one or more conductive clamps (302, 304, FIG. 3), which are used to supply current to an integrated circuit (IC) package (308). The conductive clamps are attached to a printed circuit (PC) board (312), which supplies the current to the IC package over one clamp, and receives returned current from the IC package over another clamp. Each clamp contacts a contact pad (330) on the surface of the PC board, and contacts another contact pad (334) on the top surface of the IC package. Vias (338, 339) and conductive planes (340, 342) within the package then carry current to and from an IC (e.g., IC 306) connected to the package. In another embodiment, the clamp (904, FIG. 9) holds a conductive structure (902) in place between the PC board contact pad (908) and the IC package contact pad (914), and current is carried primarily over the conductive structure, rather than over the clamp.

Abstract: A method for bonding a semiconductor die to a substrate is described. The method comprises arranging a semiconductor die, an interconnect, and a substrate in a suitable configuration and using induction heating to form the bond.

Abstract: A method for fabricating a socket (300, FIG. 3) includes fabricating a conductive structure (310, FIG. 3) and embedding the conductive structure in a housing (302). The housing includes multiple openings (304) formed in the top surface. Each opening (304) provides access to conductive contacts (502, FIG. 5), which provide an electrical interface between a device that is inserted into the socket and the next level of interconnect (e.g., a PC board). In one embodiment, the embedded conductive structure (310) is electrically connected to one or more ground conducting contacts (708, FIG. 7B). The conductive structure includes column walls (312), which run in parallel with columns of contacts, and row walls (314), which run in parallel with rows of contacts and which intersect the column walls. In this manner, the conductive structure forms multiple chambers (402, FIG. 4).

Abstract: A socket for a microelectronic component is provided. The socket has a base with metal power and ground layers, and further includes a plurality of electrically conductive socket members, some of which are connected in parallel to the metal power layer, others being connected in parallel to the metal ground layer, while others are insulated from both the metal power and ground layers for purposes of providing signals. Each electrically conductive socket member has a protrusion that breaks through an inner insulating layer that defines an opening into which the electrically conductive socket member is inserted. The protrusions are at different heights, so that some of the protrusions make contact with the metal power layer, while others are connected to the metal ground layer or to a dielectric core layer.

Abstract: A surface mount-type microelectronic component assembly which does not physically attach the microelectronic component to its carrier substrate. Electrical contact is achieved between the microelectronic component and the carrier with solder balls attached to either the microelectronic component or the carrier substrate. A force is exerted on the assembly to achieve sufficient electrical contact between the microelectronic component and the carrier substrate.

Abstract: Two types of thermal management devices for efficiently dissipating heat generated by high performance electronic devices, such as microprocessors for desktop and server computers producing a power of near 200 Watts and high power electronic devices that are small and thin, such as those used in telephones, radios, laptop computers, and handheld devices. An integrated heat sink and spreader for cooling an item has a vapor chamber heat sink with a thinner first wall and a thicker second wall. The thicker second wall is engageable with the item in efficient heat transferring relationship. A plurality of heat-radiating fins are attached to the thinner first wall. An embedded direct heat pipe attachment includes a heat pipe embedded in a spreader plate that is in direct heat transferring contact with an item through a thin, uniform layer of thermal interface material.