Abstract: A method for manufacturing a printed circuit board includes applying a layer of an ink material onto the substrate, the ink material includes a number of conductive particles contained in a solution, and the substrate is then heated to remove the solution and to sinter or retain the conductive particles on the substrate and to form a conductive metal line on the substrate of the printed circuit board. One or more additional layers of the ink material are applied onto the conductive metal line of the substrate with an electroplating process, or by repeating applying the ink material onto the conductive metal line and heating and retaining the conductive particles on the conductive metal line of the substrate.