Abstract: An electrostatic discharge device including a gate structure, a plurality of first doped regions, and a plurality of second doped regions. The gate structure is disposed on a substrate. The gate structure includes a body part and a plurality of extension parts. The extension parts are connected with the body part, and an extension direction of the body part is different from an extension direction of the extension parts. The first doped regions are located in the substrate between the extension parts. The second doped regions are located in the substrate at two outer sides of the extension parts. The first doped regions and the second doped regions have different conductivity types.

Abstract: A memory is described. The memory includes a storage cell. The memory also includes a read bit line coupled to the storage cell. The memory also includes at least one N type pre charge transistor coupled between the read bit line and a power supply node. The at least one N type pre-charge transistor is to pre-charge the read bit line. The memory also includes at least one P type pre charge transistor that is also coupled between the read bit line and the power supply node. The at least one P type pre-charge transistor is to pre-charge the read bit line with the at least one N type transistor.

Abstract: Integrated circuits with volatile random-access memory cells are provided. A memory cell may be coupled to write bit lines and a read bit line. The write bit line may not be coupled to any precharge circuitry. The read bit line may only be precharged during memory access operations. In one suitable arrangement, the read bit line may be precharge immediately after an address decoding operation and before an evaluation phase. In another suitable arrangement, the read bit line may be precharged after an addressing decoding operation and in parallel with the evaluation phase. In either arrangement, a substantial amount of leakage and active power can be reduced.

Abstract: A method for operating an SRAM of an FPGA in a high or low-power mode includes a CRAM of the FPGA storing control bits for controlling whether pages of the SRAM operate in the high or low-power mode. A control circuit of the FPGA uses the control bits, a system clock signal, and address for the pages to determine whether to operate the pages in the high or low-power mode and to control the timing for precharging and tristating read bitlines of the pages for the high and low-power modes. In the high-power mode the read bitlines are precharged longer than in the low-power mode, and in the high-power mode the read bitlines are tristated less than in the low-power mode. Precharging the read bitlines for a lesser time in the low-power mode reduces DC leakage current in the lower power mode compared to the high-power mode.

Abstract: A memory is described. The memory includes a storage cell. The memory also includes a read bit line coupled to the storage cell. The memory also includes at least one N type pre charge transistor coupled between the read bit line and a power supply node. The at least one N type pre-charge transistor is to pre-charge the read bit line. The memory also includes at least one P type pre charge transistor that is also coupled between the read bit line and the power supply node. The at least one P type pre-charge transistor is to pre-charge the read bit line with the at least one N type transistor.

Abstract: Integrated circuits with memory elements are provided. In particular, a group of random-access memory cells may be coupled to first and second data lines via corresponding access transistors. One of the first and second data lines can be driven to a ground voltage level to write a zero or one into a selected memory cell in the group. A first dummy data line can be formed adjacent to the first data line, whereas a second dummy data line can be formed adjacent to the second data line. During data loading operations, at least one of the dummy data lines can be pulsed to temporarily drive the voltage on the associated data line to below the ground voltage level. Operated in this way, the write operation of the memory cells can be improved.

Abstract: Integrated circuits with volatile random-access memory cells are provided. A memory cell may be coupled to write bit lines and a read bit line. The write bit line may not be coupled to any precharge circuitry. The read bit line may only be precharged during memory access operations. In one suitable arrangement, the read bit line may be precharge immediately after an address decoding operation and before an evaluation phase. In another suitable arrangement, the read bit line may be precharged after an addressing decoding operation and in parallel with the evaluation phase. In either arrangement, a substantial amount of leakage and active power can be reduced.

Abstract: Systems and methods for improving efficiency of a voltage booster for read mode operations of memory cells and discharging a boosted supply voltage safely are disclosed. The system contains a plurality of boosting stages coupled in series including a plurality of boosting capacitors, a plurality of isolators. The isolator can be used to prevent boosting of one capacitor from negatively affecting a charge of the other adjacent capacitor to improve the efficiency of the voltage booster. A voltage booster circuit can accurately boost a supply voltage with a suitable number of boosting stages depending on a level of the supply voltage being provided. Since boosters contain a suitable number of boosting stages, the boosters can discharge a boosted voltage sequentially. With this sequential discharge method, memory cells can not have a hot switching problem.

Abstract: Systems and methods for improving efficiency of a voltage booster for read mode operations of memory cells and discharging a boosted supply voltage safely are disclosed. The system contains a plurality of boosting stages coupled in series including a plurality of boosting capacitors, a plurality of isolators. The isolator can be used to prevent boosting of one capacitor from negatively affecting a charge of the other adjacent capacitor to improve the efficiency of the voltage booster. A voltage booster circuit can accurately boost a supply voltage with a suitable number of boosting stages depending on a level of the supply voltage being provided. Since boosters contain a suitable number of boosting stages, the boosters can discharge a boosted voltage sequentially. With this sequential discharge method, memory cells can not have a hot switching problem.