Patents by Inventor Kuan-Chun Lee

Kuan-Chun Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240128420
    Abstract: A display panel including a circuit board, a plurality of bonding pads, a plurality of light emitting devices, and a plurality of solder patterns is provided. The bonding pads are disposed on the circuit board, and each includes a first metal layer and a second metal layer. The second metal layer is located between the first metal layer and the circuit board. The first metal layer includes an opening overlapping the second metal layer. A material of the first metal layer is different from a material of the second metal layer. The light emitting devices are electrically bonded to the bonding pads. Each of the solder patterns electrically connects one of the light emitting devices and one of the bonding pads. The solder patterns each contact the second metal layer through the opening of the first metal layer of one of the bonding pads to form a eutectic bonding.
    Type: Application
    Filed: December 6, 2022
    Publication date: April 18, 2024
    Applicant: AUO Corporation
    Inventors: Chia-Hui Pai, Tai-Tso Lin, Wen-Hsien Tseng, Wei-Chieh Chen, Kuan-Yi Lee, Chih-Chun Yang
  • Patent number: 11955484
    Abstract: A semiconductor device includes a semiconductor substrate having a first region and a second region, insulators, gate stacks, and first and second S/Ds. The first and second regions respectively includes at least one first semiconductor fin and at least one second semiconductor fin. A width of a middle portion of the first semiconductor fin is equal to widths of end portions of the first semiconductor fin. A width of a middle portion of the second semiconductor fin is smaller than widths of end portions of the second semiconductor fin. The insulators are disposed on the semiconductor substrate. The first and second semiconductor fins are sandwiched by the insulators. The gate stacks are over a portion of the first semiconductor fin and a portion of the second semiconductor fin. The first and second S/Ds respectively covers another portion of the first semiconductor fin and another portion of the second semiconductor fin.
    Type: Grant
    Filed: June 10, 2022
    Date of Patent: April 9, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Kuan-Jung Chen, I-Chih Chen, Chih-Mu Huang, Kai-Di Wu, Ming-Feng Lee, Ting-Chun Kuan
  • Publication number: 20240105121
    Abstract: An electronic device includes a substrate, a first silicon transistor, a second silicon transistor and a first oxide semiconductor transistor. The first silicon transistor, the second silicon transistor and the first oxide semiconductor transistor are disposed on the substrate. The first silicon transistor has a first terminal electrically connected to a first voltage level, a second terminal and a control terminal. The second silicon transistor has a first terminal electrically connected to the second terminal of the first silicon transistor, a second terminal electrically connected to a second voltage level, and a control terminal electrically connected to the control terminal of the first silicon transistor. The first oxide semiconductor transistor has a first terminal electrically connected to the first terminal of the second silicon transistor. Wherein, a voltage value of the first voltage level is greater than a voltage value of the second voltage level.
    Type: Application
    Filed: December 6, 2023
    Publication date: March 28, 2024
    Inventors: Lien-Hsiang CHEN, Kung-Chen KUO, Ming-Chun TSENG, Cheng-Hsu CHOU, Kuan-Feng LEE
  • Publication number: 20090325600
    Abstract: A method and system for collecting communication signals include detecting one or more signals emitted by one or more base stations surrounding a communication device and acquiring one or more signal intensities of the detected one ore more signals. The method and system further include locating a position of the communication device, acquiring the position of the communication device, and transmitting the acquired one or more signal intensities and the position of the communication device to a signal collection server.
    Type: Application
    Filed: December 22, 2008
    Publication date: December 31, 2009
    Applicant: CHI MEI COMMUNICATION SYSTEMS, INC.
    Inventor: KUAN-CHUN LEE
  • Patent number: 6387262
    Abstract: The reactor includes a hollow fiber membrane bundle. Pressurized hydrogen and water are introduced into a volume containing the fiber bundle. The fibers are free to separate and more independently over most of their length. The fibers have microporous inner and outer layers and a nonporous layer sandwiched between the inner and outer layers and are sealed on one end. Hydrogen is introduced inside the fibers, which are sealed on one end to prevent direct escape of the hydrogen gas. The H2 gas dissolves then diffuses through the nonporous layer. Water is introduced around the fibers, and the biofilm reaction occurs on the outer surface of the fibers. Oxidized contaminants are removed from the water by the biofilm reaction, which consumes H2 gas that diffuses through the membrane. The individual fibers are free, over most of their length, to separate in response to the water flow. This prevents excessive biofilm-to-biofilm contact.
    Type: Grant
    Filed: June 5, 2000
    Date of Patent: May 14, 2002
    Assignee: Northwestern University
    Inventors: Bruce E. Rittmann, Kuan-Chun Lee