Patents by Inventor Kuan J. Wang

Kuan J. Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20040116594
    Abstract: A polyurethane dispersion containing the reaction product of a polyurethane prepolymer and water are shear, shelf, temperature, pH and electrolyte stable. The amount of the reaction product in the dispersion may be as high as 60 weight percent. The prepolymer may be the reaction product of a polyisocyanate and a hydrophilic alkylene oxide polyol or polyamine having a molecular weight of between 800 and 1,500 and an active-hydrogen containing material, such as a polyol, and optionally, a surfactant. The hydrophilic alkylene oxide polyol or polyamine is present in an amount sufficient to reduce the interfacial tension of the prepolymer to less than or equal to 10 dynes/cm. The amount of ethylene oxide in the prepolymer is between from about 0.5 to about 5.5 weight percent. The water solubility of the high molecular weight active-hydrogen containing material is typically less than about 10.0 g per 100 g of water.
    Type: Application
    Filed: December 11, 2002
    Publication date: June 17, 2004
    Inventors: Debkumar Bhattacharjee, Bedri Erdem, Franklin E. Parks, Kenneth W. Skaggs, Kuan J. Wang
  • Patent number: 5648412
    Abstract: A rigid thermoplastic polyurethane with improved melt strength can be prepared by deactivating the catalyst for the polymer subsequent to the onset of urethane bond formation. Catalyst deactivation is accomplished either with a latent deactivator for the catalyst, or an active deactivator. The further addition of a crosslinker to the reaction mixture can provide an even greater improvement of melt strength.
    Type: Grant
    Filed: January 30, 1995
    Date of Patent: July 15, 1997
    Assignee: The Dow Chemical Company
    Inventors: Gary S. Mistry, Kuan J. Wang, Benjamin S. Ehrlich