Abstract: A routing method for a wireless mesh network and a wireless node performing the method are provided. The method includes performing a route algorithm and finding available paths to reach a destination node, recording the available paths, a parent-child node relationship, and a link-state in a route table, and transmitting or transferring data by using an optimal path among the available paths. The method also includes selecting another available path as the optimal path when the optimal path is not operable, updating the route table, and notifying a parent wireless node. The method further includes performing a block route algorithm when receiving a node-added message for creating a block route table in a block where the newly-added node belongs, updating the route table according to the block route table for acquiring updated available paths, selecting one of the updated available paths as the optimal path, and notifying the parent wireless node.

Abstract: A routing method for a wireless mesh network and a wireless node performing the method are provided. The method includes performing a route algorithm and finding available paths to reach a destination node, recording the available paths, a parent-child node relationship, and a link-state in a route table, and transmitting or transferring data by using an optimal path among the available paths. The method also includes selecting another available path as the optimal path when the optimal path is not operable, updating the route table, and notifying a parent wireless node. The method further includes performing a block route algorithm when receiving a node-added message for creating a block route table in a block where the newly-added node belongs, updating the route table according to the block route table for acquiring updated available paths, selecting one of the updated available paths as the optimal path, and notifying the parent wireless node.

Abstract: A sensor for acquiring EMG and MMG signals is provided, including a substrate, an inertial sensing element received in a hole of the substrate, a circuit element disposed on the substrate, a plurality of electrical connecting members connecting the inertial sensing element with the substrate, and a sensing ring disposed on the substrate and surrounding the hole. The electrical connecting members are flexible, and the circuit element and the sensing ring are disposed on opposite sides of the substrate.

Abstract: A bulk acoustic wave filter device and its package. The filter devices greatly decreases the manufacturing process complexity by the coplanar electrode layout, and it omits the process steps of forming via hole of connectors, such that it is convenient to the coplanar high frequency on-wafer measurement and trimming. Furthermore, by using the wafer level chip scale package (WLCSP) technique, which to integrate the series resonator and the shunt resonator can be integrated, the spaces of filter can be saved and the cost of package can be down.