Abstract: A deflecting plate includes a silicon-on-insulator (SOI) substrate. The SOI substrate includes: an insulator layer having a top surface and a bottom surface; a device layer coupled to the insulator layer at the top surface, wherein multiple deflecting apertures are disposed in the device layer, each of which extending from a top open end to a bottom open end through the device layer, and wherein the bottom open end is coplanar with the top surface of the insulator layer; and a handle substrate coupled to the insulator layer at the bottom surface, wherein a cavity is disposed in the handle substrate and extends from a cavity open end to a cavity bottom wall, and wherein the bottom wall is coplanar with the top surface of the insulator layer, such that the bottom open end of each deflecting aperture is exposed to the cavity.

Abstract: A protecting method for preventing solder crack failure in an electronic product is provided. Firstly, a step (a) is performed to confirm that a crack incidence rate of a metallic solder material in a printed circuit board is high. In a step (b), a protecting mechanism of controlling the electronic product to enter an idle mode and leave the idle mode is activated. Consequently, an operating temperature of the electronic product decreases at a first average drop rate.

Abstract: A semiconductor-on-insulator (SOI) structure and a method for forming the SOI structure. The method includes forming a first dielectric layer on a first semiconductor layer. A second semiconductor layer is formed over an etch stop layer. A cleaning solution is provided to a first surface of the first dielectric layer. The first dielectric layer is bonded under the second semiconductor layer in an environment having a substantially low pressure. An index guiding layer may be formed over the second semiconductor layer. A third semiconductor layer is formed over the second semiconductor layer. A distance between a top of the third semiconductor layer and a bottom of the second semiconductor layer varies between a maximum distance and a minimum distance. A planarization process is performed on the third semiconductor layer to reduce the maximum distance.

Abstract: An embedded fire-resistant device includes a mounting plate, a container and a fire-resistant member. The mounting plate has a contact surface and a first connection member provided on the mounting plate. The container has an open side and a second connection member provided on the open side. The fire-resistant member is received in the container. The first connection member and the second connection member are configured to slidably couple to or separate from each other so that the mounting plate and the container can engage with or separate from each other. This is a design that benefits in installation and future inspection.

Abstract: An embedded fire-resistant device includes a mounting plate, a container and a fire-resistant member. The mounting plate has a contact surface and a first connection member provided on the mounting plate. The container has an open side and a second connection member provided on the open side. The fire-resistant member is received in the container. The first connection member and the second connection member are configured to slidably couple to or separate from each other so that the mounting plate and the container can engage with or separate from each other. This is a design that benefits in installation and future inspection.

Abstract: The present invention provides a method for producing a through hole in a floor system for pipe penetration. The method includes providing a deck system with ridge portions and valley portions; creating a hollow on the deck system; providing a ring with at least one securing ear formed on a perimeter thereof; mounting the ring onto the deck system by jointing the at least one securing ear of the ring and the at least one of the ridge portions such that the ring is fixedly received in the hollow of the deck system; and fixedly receiving a pipe casing in the ring mounted on the deck system, wherein the pipe casing defines a path for the pipe penetration. The method further includes forming a concrete layer on the deck system to obtain a composite slab.

Abstract: The present invention provides a method for producing a through hole in a floor system for pipe penetration. The method includes providing a deck system with ridge portions and valley portions; creating a hollow on the deck system; providing a ring with at least one securing ear formed on a perimeter thereof; mounting the ring onto the deck system by jointing the at least one securing ear of the ring and the at least one of the ridge portions such that the ring is fixedly received in the hollow of the deck system; and fixedly receiving a pipe casing in the ring mounted on the deck system, wherein the pipe casing defines a path for the pipe penetration. The method further includes forming a concrete layer on the deck system to obtain a composite slab.

Abstract: The present invention provides a pre-embedded/pre-built-in hole creating apparatus for buildings, including: a pipe casing for a pipe or a pipeline system of the building to pass there through; at least one thermal-expandable foam detachably accommodated within the pipe casing; an inspection annulus detachably joined with the pipe casing; and a slide cover installed onto the pipe casing and secured to the building structure. The at least one thermal-expandable foam in the hole creating apparatus embedded in the building structure can be removed via the detachable structure for inspection and replacement so as to maintain the flame-retardant function of the hole creating apparatus. Said apparatus further includes an annular shielding plate providing functions of airtight and smoke blocking for the through pipes as well as includes an identifying device providing information, tracking and service associated with the apparatus in order to guarantee long term safety.

Abstract: The present invention provides a pre-embedded/pre-built-in hole creating apparatus for buildings, including: a pipe casing for a pipe or a pipeline system of the building to pass there through; at least one thermal-expandable foam detachably accommodated within the pipe casing; an inspection annulus detachably joined with the pipe casing; and a slide cover installed onto the pipe casing and secured to the building structure. The at least one thermal-expandable foam in the hole creating apparatus embedded in the building structure can be removed via the detachable structure for inspection and replacement so as to maintain the flame-retardant function of the hole creating apparatus. Said apparatus further includes an annular shielding plate providing functions of airtight and smoke blocking for the through pipes as well as includes an identifying device providing information, tracking and service associated with the apparatus in order to guarantee long term safety.