Patents by Inventor Kuan-Wei Chen

Kuan-Wei Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210373069
    Abstract: A signal testing device and a signal testing method are provided. The method includes: obtaining, through a probe, a first frequency response corresponding to a test fixture and a device under test (DUT); obtaining, through the probe, a second frequency response corresponding to the test fixture; and generating a frequency response corresponding to the DUT according to the first frequency response, the second frequency response, a de-embedding algorithm, and an empirical mode decomposition algorithm.
    Type: Application
    Filed: July 20, 2020
    Publication date: December 2, 2021
    Applicant: Wiwynn Corporation
    Inventors: Kuan-Wei Chen, Tzu-Yu Wei, Yi-Shian Chen, Yi-Tang Chen, Chi-Hsiang Hung, Ting-Kai Wang
  • Patent number: 11140593
    Abstract: A communications apparatus communicating with at least one cellular network includes a radio transceiver and a processor. The radio transceiver is capable of transmitting or receiving wireless radio frequency signals to or from an air interface in the cellular network. The processor is configured to determine whether an inter-RAT change will be triggered in a subsequent procedure when the communications apparatus is in a connected mode. When the processor determines that an inter-RAT change procedure will be triggered, the processor is configured to selectively perform a predetermined procedure instead of the subsequent procedure to avoid the inter-RAT change.
    Type: Grant
    Filed: July 17, 2019
    Date of Patent: October 5, 2021
    Assignee: MEDIATEK INC.
    Inventors: Guan-Jie Huang, Tzu-Wen Chang, Kuan-Wei Chen, Yu-Hua Huang, Teng Ma, Sheng-Kai Chang
  • Publication number: 20210286744
    Abstract: A system manages communication between a host device and an end device. The system includes a programmable input/output (I/O) port associated with the host device. The host device is connectable through the programmable I/O port and a cable to a plurality of different types of end devices that are respectively associated with different types of protocols. The system further includes a port manager to detect a signal from an end device interface associated with the end device and determine a type of the end device based on the detected signal. The port manager directs the programmable I/O port to present signals that correspond to a protocol associated with the determined type of the end device to allow the host device to communicate with the end device.
    Type: Application
    Filed: March 16, 2020
    Publication date: September 16, 2021
    Inventors: John Norton, Ku-Hsu Nien, Vincent Nguyen, Kuan-WeI Chen
  • Publication number: 20210267059
    Abstract: An electronic device includes a motherboard, a bridging device, and an add-in card. The motherboard includes a processor, a first circuit board, and a first connector. The processor is coupled to the first connector through the first circuit board. The bridging device includes a second circuit board and a second connector and is disposed on the motherboard and coupled to the first connector. The second connector is coupled to the first connector through the second circuit board. The add-in card includes a third circuit board and a peripheral circuit and is disposed on the bridging device and coupled to the second connector. The peripheral circuit is coupled to the second connector through the third circuit board. The processor is coupled to the peripheral circuit through a signal path including the first circuit board, the first connector, the second circuit board, the second connector, and the third circuit board.
    Type: Application
    Filed: April 26, 2020
    Publication date: August 26, 2021
    Applicant: Wiwynn Corporation
    Inventors: Tzu-Yu Wei, Yi-Tang Chen, Yi-Shian Chen, Chi-Hsiang Hung, Kuan-Wei Chen
  • Publication number: 20210128718
    Abstract: The present invention relates to a fusion protein having formula (I) X1?Y?X2 ??(I), wherein X1 and X2 comprise each four to six allergen fragments or variants thereof fused to each other, wherein said allergen fragments are derived from at least two allergens of the genus Dermatophagoides, and wherein Y is a carrier protein.
    Type: Application
    Filed: May 17, 2019
    Publication date: May 6, 2021
    Inventors: Rudolf Valenta, Mirela Curin, Kuan-Wei Chen, Susanne Vrtala
  • Patent number: 10914618
    Abstract: A readout circuit for a sensor and a readout method thereof are provided. The readout circuit includes a reference circuit, a compensated circuit, and a signal processing circuit. The reference circuit provides a direct current (DC) signal. The compensated circuit is coupled to the reference circuit. The compensated circuit obtains an analog sensing signal of the sensor, obtains the DC signal from the reference circuit, and provides a compensated signal according to the analog sensing signal and the DC signal. The signal processing circuit is coupled to the compensated circuit. The signal processing circuit processes the compensated signal to convert the compensated signal into a digital sensing signal. The compensated circuit subtracts the DC signal from the analog sensing signal to provide the compensated signal.
    Type: Grant
    Filed: December 21, 2017
    Date of Patent: February 9, 2021
    Assignee: Industrial Technology Research Institute
    Inventors: Sih-Han Li, Chih-Sheng Lin, Ya-Wen Yang, Kuan-Wei Chen, Shyh-Shyuan Sheu
  • Patent number: 10883152
    Abstract: A dynamically impacting method comprising simultaneously peening a substrate surface and forming a thin film of metallic glass on the substrate surface for increasing the surface hardness, fatigue resistance, anti-fracture toughness and corrosion resistance of the substrate simultaneously.
    Type: Grant
    Filed: August 23, 2018
    Date of Patent: January 5, 2021
    Assignee: Taichi Metal Material Technology Co., Ltd.
    Inventors: Kuan-Wei Chen, Jason Shian-Ching Jang, Po-Jen Wei
  • Patent number: 10711344
    Abstract: A process for making a composite product comprises the steps of: A. Circumferentially plating a carbon fiber core with an alloy film including a film of high entropy alloy and liquid metal alloy or a film of metallic glass to form a film-clad carbon fiber thread; B. Weaving a plurality of said film-clad carbon fiber threads to form an interlaced film-clad carbon fiber sheet; and C. Vibrationally thermally pressing a plurality of said interlaced film-clad carbon fiber sheets as superimposed with one another to form a composite product.
    Type: Grant
    Filed: August 29, 2017
    Date of Patent: July 14, 2020
    Assignee: Taichi Metal Material Technology Co., Ltd.
    Inventors: Kuan-Wei Chen, Po-Jen Wei
  • Publication number: 20200100153
    Abstract: A communications apparatus communicating with at least one cellular network includes a radio transceiver and a processor. The radio transceiver is capable of transmitting or receiving wireless radio frequency signals to or from an air interface in the cellular network. The processor is configured to determine whether an inter-RAT change will be triggered in a subsequent procedure when the communications apparatus is in a connected mode. When the processor determines that an inter-RAT change procedure will be triggered, the processor is configured to selectively perform a predetermined procedure instead of the subsequent procedure to avoid the inter-RAT change.
    Type: Application
    Filed: July 17, 2019
    Publication date: March 26, 2020
    Inventors: Guan-Jie HUANG, Tzu-Wen CHANG, Kuan-Wei CHEN, Yu-Hua HUANG, Teng MA, Sheng-Kai CHANG
  • Publication number: 20200063226
    Abstract: A dynamically impacting method comprising simultaneously peening a substrate surface and forming a thin film of metallic glass on the substrate surface for increasing the surface hardness, fatigue resistance, anti-fracture toughness and corrosion resistance of the substrate simultaneously.
    Type: Application
    Filed: August 23, 2018
    Publication date: February 27, 2020
    Inventors: Kuan-Wei Chen, Jason Shian Ching Jang, Po-Jen Wei
  • Patent number: 10562259
    Abstract: A structural object includes a substrate integrally clad with a metallic glass sheet by adhering, welding or joining the metallic glass sheet on the substrate for a low-cost, flexible and convenient fabrication, assembly, processing or construction of the object.
    Type: Grant
    Filed: April 17, 2017
    Date of Patent: February 18, 2020
    Assignee: Taichi Metal Material Technology Co., Ltd.
    Inventor: Kuan-Wei Chen
  • Patent number: 10505202
    Abstract: A process for making a catalyst and gas diffusion hybrid electrode member (or members) adapted for use in a fuel cell by integrally bonding a plurality of catalyst and gas diffusion layers to be a catalyst and gas diffusion hybrid electrode member to be inserted between two bipolar plates of the fuel cell for simplifying the production and decreasing the cost.
    Type: Grant
    Filed: June 4, 2018
    Date of Patent: December 10, 2019
    Assignee: Taichi Metal Material Technology Co., Ltd.
    Inventors: Kuan-Wei Chen, Jason Shian-Ching Jang, Kuan-Yu Chen
  • Publication number: 20190372130
    Abstract: A process for making a catalyst and gas diffusion hybrid electrode member (or members) adapted for use in a fuel cell by integrally bonding a plurality of catalyst and gas diffusion layers to be a catalyst and gas diffusion hybrid electrode member to be inserted between two bipolar plates of the fuel cell for simplifying the production and decreasing the cost.
    Type: Application
    Filed: June 4, 2018
    Publication date: December 5, 2019
    Inventors: Kuan-Wei Chen, Jason Shian-Ching Jang, Kuan-Yu Chen
  • Publication number: 20190186969
    Abstract: The disclosure provides a sensing device including a supporting member, a thermal resistance portion, a sensing unit and a heating unit. The supporting member has a supporting surface. The thermal resistance portion is located within the supporting member, wherein a thermal conductivity of the thermal resistance portion is less than a thermal conductivity of the supporting member. The sensing unit is disposed on the supporting surface. The heating unit is disposed on the supporting surface, wherein the heating unit is configured to heat the sensing unit, and an orthogonal projection of the heating unit on the supporting surface overlaps an orthogonal projection of the thermal resistance portion on the supporting surface. In addition, the disclosure also provides a method for manufacturing the sensing device.
    Type: Application
    Filed: January 30, 2018
    Publication date: June 20, 2019
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Shih-Yao Chen, Kuan-Wei Chen, Pei-Jer Tzeng, Wen Wang
  • Patent number: 10324054
    Abstract: A method of manufacturing a sensor device is provided. In the method, sensing electrodes are formed on a substrate, a sensing material layer is formed on the sensing electrodes. The sensing material layer is etched to form a first nanowire sensing region, a second nanowire sensing region and a third nanowire sensing region respectively between every two sensing electrodes of the sensing electrodes. A dielectric layer is formed to cover the first nanowire sensing region, the second nanowire sensing region and the third nanowire sensing region, and the first nanowire sensing region and the third nanowire sensing region are exposed.
    Type: Grant
    Filed: November 2, 2018
    Date of Patent: June 18, 2019
    Assignee: Industrial Technology Research Institute
    Inventors: Sih-Han Li, Chih-Sheng Lin, Kuan-Wei Chen, Erh-Hao Chen, Shyh-Shyuan Sheu
  • Publication number: 20190154473
    Abstract: A readout circuit for a sensor and a readout method thereof are provided. The readout circuit includes a reference circuit, a compensated circuit, and a signal processing circuit. The reference circuit provides a direct current (DC) signal. The compensated circuit is coupled to the reference circuit. The compensated circuit obtains an analog sensing signal of the sensor, obtains the DC signal from the reference circuit, and provides a compensated signal according to the analog sensing signal and the DC signal. The signal processing circuit is coupled to the compensated circuit. The signal processing circuit processes the compensated signal to convert the compensated signal into a digital sensing signal. The compensated circuit subtracts the DC signal from the analog sensing signal to provide the compensated signal.
    Type: Application
    Filed: December 21, 2017
    Publication date: May 23, 2019
    Applicant: Industrial Technology Research Institute
    Inventors: Sih-Han Li, Chih-Sheng Lin, Ya-Wen Yang, Kuan-Wei Chen, Shyh-Shyuan Sheu
  • Publication number: 20190079039
    Abstract: A method of manufacturing a sensor device is provided. In the method, sensing electrodes are formed on a substrate, a sensing material layer is formed on the sensing electrodes. The sensing material layer is etched to form a first nanowire sensing region, a second nanowire sensing region and a third nanowire sensing region respectively between every two sensing electrodes of the sensing electrodes. A dielectric layer is formed to cover the first nanowire sensing region, the second nanowire sensing region and the third nanowire sensing region, and the first nanowire sensing region and the third nanowire sensing region are exposed.
    Type: Application
    Filed: November 2, 2018
    Publication date: March 14, 2019
    Applicant: Industrial Technology Research Institute
    Inventors: Sih-Han Li, Chih-Sheng Lin, Kuan-Wei Chen, Erh-Hao Chen, Shyh-Shyuan Sheu
  • Publication number: 20190062990
    Abstract: A process for making a composite product comprises the steps of: A. Circumferentially plating a carbon fiber core with an alloy film including a film of high entropy alloy and liquid metal alloy or a film of metallic glass to form a film-clad carbon fiber thread; B. Weaving a plurality of said film-clad carbon fiber threads to form an interlaced film-clad carbon fiber sheet; and C. Vibrationally thermally pressing a plurality of said interlaced film-clad carbon fiber sheets as superimposed with one another to form a composite product.
    Type: Application
    Filed: August 29, 2017
    Publication date: February 28, 2019
    Inventors: Kuan-Wei Chen, Po-Jen Wei
  • Patent number: 10156535
    Abstract: A sensor device and a method of manufacturing the same are provided. The sensor device includes a substrate, a plurality of sensing electrodes, a humidity nanowire sensor, a temperature nanowire sensor, and a gas nanowire sensor. The sensing electrodes are formed on the substrate, and the humidity, the temperature and the gas nanowire sensors are also on the substrate. The humidity nanowire sensor includes an exposed first nanowire sensing region, the temperature nanowire sensor includes a second nanowire sensing region, and the gas nanowire sensor includes a third nanowire sensing region.
    Type: Grant
    Filed: December 8, 2015
    Date of Patent: December 18, 2018
    Assignee: Industrial Technology Research Institute
    Inventors: Sih-Han Li, Chih-Sheng Lin, Kuan-Wei Chen, Erh-Hao Chen, Shyh-Shyuan Sheu
  • Publication number: 20180297675
    Abstract: A structural object includes a substrate integrally clad with a metallic glass sheet by adhering, welding or joining the metallic glass sheet on the substrate for a low-cost, flexible and convenient fabrication, assembly, processing or construction of the object.
    Type: Application
    Filed: April 17, 2017
    Publication date: October 18, 2018
    Inventor: Kuan-Wei Chen