Patents by Inventor Kuan Yong Ho

Kuan Yong Ho has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thin wafer chuck
    Patent number: 8336188
    Abstract: Methods and systems, in one embodiment, are described related to a chuck with a plurality of vacuum grooves on a surface. Each single vacuum groove of the plurality of vacuum grooves has a single port connected with a single vacuum line coupled to a vacuum source. The single vacuum line is not shared with another groove and a restriction is applied to the single vacuum line in order to isolate each single vacuum groove.
    Type: Grant
    Filed: July 17, 2008
    Date of Patent: December 25, 2012
    Assignee: FormFactor, Inc.
    Inventors: Bjorn Monteen, Kuan Yong Ho
  • THIN WAFER CHUCK
    Publication number: 20100013169
    Abstract: Methods and systems, in one embodiment, are described related to a chuck with a plurality of vacuum grooves on a surface. Each single vacuum groove of the plurality of vacuum grooves has a single port connected with a single vacuum line coupled to a vacuum source. The single vacuum line is not shared with another groove and a restriction is applied to the single vacuum line in order to isolate each single vacuum groove.
    Type: Application
    Filed: July 17, 2008
    Publication date: January 21, 2010
    Inventors: Bjorn Monteen, Kuan Yong Ho