Abstract: A thin film transistor (TFT) formed on a substrate includes a polycrystalline film, a gate insulator, a hydrogen-supplying film and a gate electrode. The polycrystalline film is formed on the substrate. Two sides of the polycrystalline film serve as the source and the drain of the semiconductor device, and the central region of the polycrystalline layer serves as the channel. The gate insulator is formed on the polycrystalline film, then the polycrystalline film is ions implanted, and the hydrogen-supplying film is formed on the gate insulator. The gate electrode is formed on the hydrogen-supplying film above the channel. The hydrogen-supplying film supplies hydrogen to the polycrystalline film, especially to the channel, so as to transform the unsaturated bonds into hydrogen bonds in the channel for avoiding the unsaturated bonds to degrade the charge carrier efficiency of the channel.

Abstract: A flexible thin-type light-emitting-diode circuit substrate includes a bottom copper layer, a top copper layer, and an insulation layer which is interlined between the bottom copper layer and the top copper layer such that the bottom copper layer cannot be electrically connected with the top copper layer. The top copper layer is defined with a wiring zone, and the wiring zone is formed with a circuit pattern for electrically connecting at least one light emitting diode.

Abstract: A lamp housing device for an outdoor light-emitting diode light fixture having high heat dissipation capability, which includes an upper casing, a cover body and a sunshade, wherein the cover body has light transmittance, and forms a holding chamber able to retain a light-emitting diode lamp set by pairing with the upper casing. The sunshade is located atop the outer surface of upper casing, and includes a plate and a plurality of fixing members. The fixing members are connected between the plate and the upper casing, thereby providing a spacing distance between the plate and the upper casing. Accordingly, the sunshade is able to reduce the ambient temperature of the light-emitting diodes during the daytime, and increase the rate of heat dissipation of light-emitting diodes when used at night.

Abstract: A thin film transistor (TFT) formed on a substrate includes a polycrystalline film, a gate insulator, a hydrogen-supplying film and a gate electrode. The polycrystalline film is formed on the substrate. Two sides of the polycrystalline film serve as the source and the drain of the semiconductor device, and the central region of the polycrystalline layer serves as the channel. The gate insulator is formed on the polycrystalline film, then the polycrystalline film is ions implanted, and the hydrogen-supplying film is formed on the gate insulator. The gate electrode is formed on the hydrogen-supplying film above the channel. The hydrogen-supplying film supplies hydrogen to the polycrystalline film, especially to the channel, so as to transform the unsaturated bonds into hydrogen bonds in the channel for avoiding the unsaturated bonds to degrade the charge carrier efficiency of the channel.

Abstract: A capacitor structure includes a first conductive layer, a first insulating layer disposed on a substrate in sequence, a second conductive layer disposed on portions of the first insulating layer, a second insulating layer disposed on the second conductive layer and the first insulating layer, a third conductive layer disposed on portions of the second insulating layer, a third insulating layer disposed on the third conductive layer and the second insulating layer, and a fourth conductive layer disposed on the third insulating layer. The third conductive layer and the fourth conductive layer are electrically connected to the first conductive layer and the second conductive layer through at least one first contact hole adjacent to the second conductive layer and at least one second contact hole, respectively.

Abstract: A thin-film transistor liquid crystal display (TFT-LCD) substrate mainly includes a substrate and a planarization layer thereon. The substrate is defined to form a thin-film transistor (TFT) and a contact plug thereon and the source/drain of the TFT is electrically coupled with the contact plug. The planarization layer is disposed on the substrate and the planarization layer has a via hole for penetrating the planarization layer to expose to the contact plug. The configuration of the cross-section of the via hole includes a straight edge so that the via hole is able to be formed with a less steep taper at a lateral view by reflow.

Abstract: A thin film transistor (TFT) formed on a substrate includes a polycrystalline film, a gate insulator, a hydrogen-supplying film and a gate electrode. The polycrystalline film is formed on the substrate. Two sides of the polycrystalline film serve as the source and the drain of the semiconductor device, and the central region of the polycrystalline layer serves as the channel. The gate insulator is formed on the polycrystalline film, and the hydrogen-supplying film is formed on the gate insulator. The gate electrode is formed on the hydrogen-supplying film above the channel. The hydrogen-supplying film supplies hydrogen to the polycrystalline film, especially to the channel, so as to transform the unsaturated bonds into hydrogen bonds in the channel for avoiding the unsaturated bonds to degrade the charge carrier efficiency of the channel.

Abstract: A thin-film transistor liquid crystal display (TFT-LCD) substrate mainly includes a substrate and a planarization layer thereon. The substrate is defined to form a thin-film transistor (TFT) and a contact plug thereon and the source/drain of the TFT is electrically coupled with the contact plug. The planarization layer is disposed on the substrate and the planarization layer has a via hole for penetrating the planarization layer to expose to the contact plug. The configuration of the cross-section of the via hole includes a straight edge so that the via hole is able to be formed with a less steep taper at a lateral view by reflow.

Abstract: A capacitor structure includes a first conductive layer, a first insulating layer disposed on a substrate in sequence, a second conductive layer disposed on portions of the first insulating layer, a second insulating layer disposed on the second conductive layer and the first insulating layer, a third conductive layer disposed on portions of the second insulating layer, a third insulating layer disposed on the third conductive layer and the second insulating layer, and a fourth conductive layer disposed on the third insulating layer. The third conductive layer and the fourth conductive layer are electrically connected to the first conductive layer and the second conductive layer through at least one first contact hole adjacent to the second conductive layer and at least one second contact hole, respectively.

Abstract: A liquid crystal display (LCD) comprises an ILD layer formed on a glass substrate to cover a device made thereon. A first contact hole is formed in the ILD layer to expose partial surface of the device. An interconnecting layer is formed in the first contact hole to directly contact the device. A passivation layer is formed on the ILD layer and covers the interconnecting layer. A second contact hole is formed in the passivation layer to expose a portion of upper surface of the interconnecting layer. A planarizing film is formed on the passivation layer and covers side walls of the second contact hole completely, wherein a portion of bottom surface of the second contact hole is exposed. A pixel electrode is attached on the exposed bottom surface of the second contact hole to electrically connect to the interconnecting layer.