Abstract: A method for making iridium oxide nanoparticles includes dissolving an iridium salt to obtain a salt-containing solution, mixing a complexing agent with the salt-containing solution to obtain a blend solution, and adding an oxidating agent to the blend solution to obtain a product mixture. A molar ratio of a complexing compound of the complexing agent to the iridium salt is controlled in a predetermined range so as to permit the product mixture to include iridium oxide nanoparticles.

Abstract: A package of a semiconductor device with a flexible wiring substrate and a method thereof are provided. The package of the semiconductor device includes a semiconductor substrate with at least one pad on a surface thereof, a bump bonded to the pad, an adhesive layer on the bump, and a flexible wiring substrate having at least one contact section being electrically connected with the bump by the adhesive layer. The present invention makes the flexible wiring substrate directly conductively attached onto the semiconductor substrate. The package size is shrunk and the cost down can be obtained.

Abstract: A camera module is provided. The camera module comprises: a lens; a holder having a lower portion, the holder holding the lens; a circuit board; and an image sensing and processing unit including an image sensing device and an optional signal processing device stacked on and electrically connected to the image sensing device, the image sensing and processing unit being packaged on one side of the circuit board; wherein the holder is fixed on the circuit board, the image sensing and processing unit inside the lower portion of the holder. Further, if the circuit board is a flexible circuit board, then a hard plate can be disposed on the other side of the flexible PCB corresponding to the image sensing and processing unit in order to enhance the mechanical strength.

Abstract: A camera module is provided. The camera module comprises: a holder having an upper portion, a lower portion, and a bottom; a lens member held on the upper portion of the holder; a hinge disposed on the bottom of the holder; a cover coupled to the hinge and to the bottom of the holder, the cover being allowed to open and close to cover the bottom of the holder, the cover and the lower portion of the holder forming a space; and an image sensing and processing device disposed on the cover, wherein when the cover is close, the space can accommodate the image sensing and processing device.

Abstract: A package of a semiconductor device with a flexible wiring substrate and a method thereof are provided. The package of the semiconductor device includes a semiconductor substrate with at least one pad on a surface thereof, a bump bonded to the pad, an adhesive layer on the bump, and a flexible wiring substrate having at least one contact section being electrically connected with the bump by the adhesive layer. The present invention makes the flexible wiring substrate directly conductively attached onto the semiconductor substrate. The package size is shrunk and the cost down can be obtained.

Abstract: A package of a semiconductor device with a flexible wiring substrate and a method thereof are provided. The package of the semiconductor device includes a semiconductor substrate with at least one pad on a surface thereof, a bump bonded to the pad, an adhesive layer on the bump, and a flexible wiring substrate having at least one contact section being electrically connected with the bump by the adhesive layer. The present invention makes the flexible wiring substrate directly conductively attached onto the semiconductor substrate. The package size is shrunk and the cost down can be obtained.

Abstract: An image sensor including an image sensing device layer, a silicon-on-insulator (SOI) layer, an optical device array and a substrate is provided. The SOI layer has a first surface and a second surface. The image sensing device layer is formed on the first surface of the SOI layer. The optical device array is formed on the second surface of the SOI layer. The substrate is disposed above the second surface of the SOI layer; the optical device array is disposed between the substrate and the SOI layer. An incident light coming from the outside environment, passes through the optical device array and the SOI layer, and is received by sensing devices formed in the image sensing device layer. In this manner, the probability of absorption or reflection of the incident light is reduced. Therefore, the sensing performance and the yield of the image sensor of the present invention is improved.

Abstract: An image sensor comprising an image sensing device layer, a silicon-on-insulator (SOI) layer, an optical device array and a substrate is provided. The SOI layer has a first surface and a second surface. The image sensing device layer is formed on the first surface of the SOI layer. The optical device array is formed on the second surface of the SOI layer. The substrate is disposed above the second surface of the SOI layer and the optical device array is disposed between the substrate and the SOI layer. An incident light coming from the outside environment, passes through the optical device array and the SOI layer, and is received by sensing devices formed in the image sensing device layer. In this manner, the probability of absorption or reflection of the incident light is reduced. Therefore, the sensing performance and the yield of the image sensor of the present invention is improved.

Abstract: A package of a semiconductor device with a flexible wiring substrate and a method thereof are provided. The package of the semiconductor device includes a semiconductor substrate with at least one pad on a surface thereof, a bump bonded to the pad, an adhesive layer on the bump, and a flexible wiring substrate having at least one contact section being electrically connected with the bump by the adhesive layer. The present invention makes the flexible wiring substrate directly conductively attached onto the semiconductor substrate. The package size is shrunk and the cost down can be obtained.

Abstract: An image sensor comprising an image sensing device layer, a silicon-on-insulator (SOI) layer, an optical device array and a substrate is provided. The SOI layer has a first surface and a second surface. The image sensing device layer is formed on the first surface of the SOI layer. The optical device array is formed on the second surface of the SOI layer. The substrate is disposed above the second surface of the SOI layer and the optical device array is disposed between the substrate and the SOI layer. An incident light coming from the outside environment, passes through the optical device array and the SOI layer, and is received by sensing devices formed in the image sensing device layer. In this manner, the probability of absorption or reflection of the incident light is reduced. Therefore, the sensing performance and the yield of the image sensor of the present invention is improved.

Abstract: A chip on photosensitive device package structure is provided. The package mainly comprises a photosensitive device, a transparent plate and a chip. The photosensitive device has an illumination area and a non-illumination area. The transparent plate has a first surface and a corresponding second surface. The transparent plate is set over the photosensitive device with the first surface covering both the illumination area and the non-illumination area. The chip is set on the second surface of the transparent plate above the non-illumination area of the photosensitive device.

Abstract: A chip on photosensitive device package structure is provided. The package mainly comprises a photosensitive device, a transparent plate and a chip. The photosensitive device has an illumination area and a non-illumination area. The transparent plate has a first surface and a corresponding second surface. The transparent plate is set over the photosensitive device with the first surface covering both the illumination area and the non-illumination area. The chip is set on the second surface of the transparent plate above the non-illumination area of the photosensitive device.

Abstract: A camera module is provided. The camera module comprises: a lens; a holder having a lower portion, the holder holding the lens; a circuit board; and an image sensing and processing unit including an image sensing device and an optional signal processing device stacked on and electrically connected to the image sensing device, the image sensing and processing unit being packaged on one side of the circuit board; wherein the holder is fixed on the circuit board, the image sensing and processing unit inside the lower portion of the holder. Further, if the circuit board is a flexible circuit board, then a hard plate can be disposed on the other side of the flexible PCB corresponding to the image sensing and processing unit in order to enhance the mechanical strength.

Abstract: A package structure for optical image sensing devices is disclosed. The package structure includes an image sensing integrated circuit chip having a light receiving side and a backside. The image sensing integrated circuit chip has a light sensing area on the light receiving side. A plurality of light sensing devices are arranged in the light sensing area for converting incident light into electrical signals. A plurality of bonding pads are arranged along one or two sides of the light sensing area. Black sealing glue is asymmetrically coated on the outskirts of the light sensing area. The black sealing glue has at least two coating widths. A glass lid is glued over the light sensing area with the sealing glue.

Abstract: A package of a semiconductor device with a flexible wiring substrate and a method thereof are provided. The package of the semiconductor device includes a semiconductor substrate with at least one pad on a surface thereof, a bump bonded to the pad, an adhesive layer on the bump, and a flexible wiring substrate having at least one contact section being electrically connected with the bump by the adhesive layer. The present invention makes the flexible wiring substrate directly conductively attached onto the semiconductor substrate. The package size is shrunk and the cost down can be obtained.

Abstract: A package of a semiconductor device with a flexible wiring substrate and a method thereof are provided. The package of the semiconductor device includes a semiconductor substrate with at least one pad on a surface thereof, a bump bonded to the pad, an adhesive layer on the bump, and a flexible wiring substrate having at least one contact section being electrically connected with the bump by the adhesive layer. The present invention makes the flexible wiring substrate directly conductively attached onto the semiconductor substrate. The package size is shrunk and the cost down can be obtained.

Abstract: A camera module is provided. The camera module comprises: a holder having an upper portion, a lower portion, and a bottom; a lens member held on the upper portion of the holder; a hinge disposed on the bottom of the holder; a cover coupled to the hinge and to the bottom of the holder, the cover being allowed to open and close to cover the bottom of the holder, the cover and the lower portion of the holder forming a space; and an image sensing and processing device disposed on the cover, wherein when the cover is close, the space can accommodate the image sensing and processing device.