Abstract: The disclosure discloses an online resourceful treatment method of electroless copper plating waste solution. According to the disclosure, a copper catalyst is adopted to perform autocatalytic reaction on electroless copper plating waste solution in an autocatalytic reactor, copper simple substances are reduced from copper ions in the waste solution and recycled, the treated waste solution enters into a three-dimensional electrolyzer and a membrane filtration plant for further purification, the finally treated electroless copper plating waste solution meets water quality discharge standard, and the recovery rate of the copper simple substances can reach up to above 95%.

Abstract: The disclosure discloses an online resourceful treatment method of electroless copper plating waste solution. According to the disclosure, a copper catalyst is adopted to perform autocatalytic reaction on electroless copper plating waste solution in an autocatalytic reactor, copper simple substances are reduced from copper ions in the waste solution and recycled, the treated waste solution enters into a three-dimensional electrolyzer and a membrane filtration plant for further purification, the finally treated electroless copper plating waste solution meets water quality discharge standard, and the recovery rate of the copper simple substances can reach up to above 95%.

Abstract: The disclosure provides an intelligent water control equipment for intermittently countercurrent rinsing plating articles, comprising: a multi-stage countercurrent rinse tank, a PLC automatic control system, a liquid level sensor, a water supply pump, a water discharge pump, a water inlet pipe and a water output pipe; the multi-stage countercurrent rinse tank is composed of n rinse tanks connected in series, the water inlet pipe of a preceding-stage rinse tank is connected with the water outlet pipe of a next-stage rinse tank, rinse water is conveyed to the final-stage rinse tank through the water supply pump, the water flow direction is opposite to the movement direction of plating articles; signals of the liquid level sensor and a conductivity electrode are input to the PLC automatic control system.

Abstract: The present disclosure describes methods for detecting, monitoring, and modulating (e.g., promoting, enhancing, sustaining, maintaining, reducing, mitigating or eliminating of) biofilm formation, as well as mitigating or eliminating Microbial Influenced Corrosion (MIC) of a metal surface. The method of monitoring includes: providing a test sample; detecting at least one of a prophage gene, a prophage gene expression, a prophage gene transcript, a prophage protein, a prophage metabolite, a prophage intermediate, or a combination thereof, wherein the existence, amount or level of prophage gene expression, a prophage gene transcript, a prophage protein, a prophage metabolite, a prophage intermediate, or a combination thereof relative to a control is indicative of biofilm presence, formation or the state of the biofilm in a sample. The present disclosure also describes a composition for modulating biofilm formation, maintenance, mitigation, reduction, and elimination.

Abstract: Provided are methods for mitigating or eliminating Microbial Influenced Corrosion of a metal surface including contacting the metal surface with an effective amount of a liquid composition comprising indole or a functionally equivalent analog or derivative thereof. Also provided are methods for reducing the formation or activity of a corrosion-associated biofilm on a metal surface including contacting the metal surface with an effective amount of a liquid composition including indole or a functionally equivalent analog or derivative thereof.