Patents by Inventor KueiSung Chang

KueiSung Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • High-frequency signal transmission circuit device
    Patent number: 7777307
    Abstract: A method for manufacturing a high-frequency signal transmission circuit includes the steps of forming a groove to surround a first region on a semiconductor substrate, filling the groove with a stopper material, forming a high-frequency transmission line on the semiconductor substrate so that the transmission line extends over the first region, and etching the first region of the semiconductor substrate using the stopper material as an etching stopper to form a recess in the first region.
    Type: Grant
    Filed: April 24, 2006
    Date of Patent: August 17, 2010
    Assignee: Sony Corporation
    Inventor: KueiSung Chang
  • METHOD FOR MANUFACTURING HIGH-FREQUENCY SIGNAL TRANSMISSION CIRCUIT AND HIGH-FREQUENCY SIGNAL TRANSMISSION CIRCUIT DEVICE
    Publication number: 20100190273
    Abstract: A method for manufacturing a high-frequency signal transmission circuit includes the steps of forming a groove to surround a first region on a semiconductor substrate, filling the groove with a stopper material, forming a high-frequency transmission line on the semiconductor substrate so that the transmission line extends over the first region, and etching the first region of the semiconductor substrate using the stopper material as an etching stopper to form a recess in the first region.
    Type: Application
    Filed: March 31, 2010
    Publication date: July 29, 2010
    Applicant: Sony Corporation
    Inventor: KueiSung Chang
  • Method for manufacturing high-frequency signal transmission circuit and high-frequency signal transmission circuit device
    Publication number: 20060270178
    Abstract: A method for manufacturing a high-frequency signal transmission circuit includes the steps of forming a groove to surround a first region on a semiconductor substrate, filling the groove with a stopper material, forming a high-frequency transmission line on the semiconductor substrate so that the transmission line extends over the first region, and etching the first region of the semiconductor substrate using the stopper material as an etching stopper to form a recess in the first region.
    Type: Application
    Filed: April 24, 2006
    Publication date: November 30, 2006
    Applicant: Sony Corporation
    Inventor: KueiSung Chang