Patents by Inventor Kuen-Yuan Hwang

Kuen-Yuan Hwang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11065724
    Abstract: Laser weldable compositions are provided which in various examples include a tricyclodecane dimethanol-modified copolymer, a terephthalate-type polyester and an inorganic filler. Compared with compositions without the tricyclodecane dimethanol-modified copolymer, the compositions of the invention have improved, uniform laser transmittance, thereby welded products including the compositions have improved bonding strength and require stronger tensile strength to be torn apart.
    Type: Grant
    Filed: April 20, 2020
    Date of Patent: July 20, 2021
    Assignee: CHANG CHUN PLASTICS CO., LTD.
    Inventors: Te-Shun Lin, Cheng-Hsiang Hung, Hsin-Hsien Tsai, Po-Yuan Cheng, Yung-Sheng Lin, Kuen-Yuan Hwang, June-Yen Chou
  • Publication number: 20210130645
    Abstract: The present invention provides a compound comprising EO (ethylene oxide)/PO (propylene oxide) block copolymer which can be used as an emulsifier. The present invention also provides a water-borne epoxy resin composition comprising the compound and a coating composition comprising the water-borne epoxy resin composition. The advantages of the present invention is that the epoxy resin composition or the coating composition, which the compound of the present invention is added to, enhances the compatibility between water and epoxy resin, and enhances the anticorrosive properties of the epoxy resin composition and the coating composition.
    Type: Application
    Filed: January 22, 2020
    Publication date: May 6, 2021
    Inventors: YING-JUI LIN, LIANG-HSING LIU, YUNG-SHENG LIN, KUO-PIN WU, I-CHIANG LAI, YI-SERN WONG, KUEN-YUAN HWANG
  • Patent number: 10899871
    Abstract: The present invention provides epoxy resin compounds comprising a high phosphorus and oxazolidone content, methods to prepare these epoxy resin compounds, curable compositions comprising these epoxy resins, and cured epoxy resin compounds by curing the curable epoxy resin compounds comprising a high phosphorus and oxazolidone content.
    Type: Grant
    Filed: April 23, 2019
    Date of Patent: January 26, 2021
    Assignee: CHANG CHUN PLASTICS CO., LTD.
    Inventors: Szu-Fang Chen, Sung-Kuang Chung, An-Pang Tu, Gai-Chi Chen, Zhao-Ming Chen, Kuen-Yuan Hwang
  • Publication number: 20200339736
    Abstract: The present invention provides epoxy resin compounds comprising a high phosphorus and oxazolidone content, methods to prepare these epoxy resin compounds, curable compositions comprising these epoxy resins, and cured epoxy resin compounds by curing the curable epoxy resin compounds comprising a high phosphorus and oxazolidone content.
    Type: Application
    Filed: April 23, 2019
    Publication date: October 29, 2020
    Inventors: Szu-Fang CHEN, Sung-Kuang CHUNG, An-Pang TU, Gai-Chi CHEN, Zhao-Ming CHEN, Kuen-Yuan HWANG
  • Patent number: 10745556
    Abstract: Provided are an amino resin composition, a varnish, a coating layer, and a product. The amino resin composition comprises a repeating unit represented by the following Formula (I): A 13C-NMR spectrum of the amino resin composition has a first characteristic peak at 159 ppm to 161 ppm and a second characteristic peak at 70 ppm to 80 ppm. Based on the integral value of the first characteristic peak as 1, the integral value of the second characteristic peak is in the range from 0.01 to 0.25. Adopting the amino resin composition can accelerate the drying of the varnish and ensure the coating layer and the product have high hardness, high gloss and excellent color stability.
    Type: Grant
    Filed: March 19, 2020
    Date of Patent: August 18, 2020
    Assignee: CHANG CHUN PLASTICS CO., LTD.
    Inventors: Ren-Wei Tsai, You-Ting Chen, Kuo-Pin Wu, Yung-Sheng Lin, I-Chiang Lai, Yi-Sern Wong, Kuen-Yuan Hwang
  • Patent number: 10545403
    Abstract: The present invention provides a photosensitive resin composition, comprising: (a) photo-polymerizable unsaturated compound, (b) hydroxyurethane compound, and (c) photoinitiator. The photosensitive resin composition can be used as photoresist coating for dry film photoresist to manufacture the electronic components, such as print circuit board and so on. Further, the (b) hydroxyurethane compound having [CC]/[NH2] between 0.5 and 0.9, which increases the resolution, adhesion, and stripping ability of photosensitive resin composition for dry film photoresist, and improves the effectiveness and the quality of dry film photoresist for manufacturing printed circuit board and other electric component.
    Type: Grant
    Filed: October 23, 2017
    Date of Patent: January 28, 2020
    Assignee: CHANG CHUN PLASTICS CO., LTD.
    Inventors: Gai-Chi Chen, Yun-Chung Wu, An-Pang Tu, Kuen-Yuan Hwang
  • Patent number: 10544261
    Abstract: The present invention relates to a phosphinated poly(2,6-dimethy phenylene oxide)oligomer, specifically an unsaturated group-containing phosphinated poly(2,6-dimethy phenylene oxide)oligomer, and processes for producing the same. A thermoset produced from the unsaturated group-containing phosphinated poly(2,6-dimethy phenylene oxide)oligomers according to the present invention exhibits flame retardancy and has a low dielectric constant and dissipation factor and a high glass transition temperature.
    Type: Grant
    Filed: October 7, 2016
    Date of Patent: January 28, 2020
    Assignee: Chang Chun Plastics Co., Ltd.
    Inventors: Ching Hsuan Lin, Ping-Chieh Wang, An-Pang Tu, Kuen-Yuan Hwang, Chun Yu Tseng
  • Patent number: 10450478
    Abstract: The present invention provides an epoxy resin comprising: a polymer having a structure of a reaction product of a monomer of epoxy having at least two epoxide groups per molecule, a polyether monoamine, and an epoxidized oil. The present invention also provides an aqueous dispersion and a water-borne epoxy coating composition which comprise the epoxy resin. The present inventions are low in volatile organic compounds and have enhanced properties such as high hardness, high adhesion strength, high impact resistance and high corrosion resistance.
    Type: Grant
    Filed: April 1, 2019
    Date of Patent: October 22, 2019
    Assignee: CHANG CHUN PLASTICS CO., LTD.
    Inventors: Ying-Jui Lin, Liang-Hsing Liu, Yung-Sheng Lin, I-Chiang Lai, Yi-Sern Wong, Kuen-Yuan Hwang
  • Patent number: 10392504
    Abstract: This disclosure relates to reactive epoxy compounds that have high water solubility. The reactive epoxy compounds are obtained by mixing an epoxy resin having at least two epoxy groups per molecule with a carboxyl group-containing compound obtained by reacting a polyetheramine comprising a primary amine and an acid anhydride derived from a polyvalent carboxylic acid. This disclosure also relates to waterborne epoxy resin composition comprising core-shell type epoxy resin particles dispersed in a solvent, wherein the particles are formed by an epoxy resin encapsulated in the reactive epoxy compounds of the present invention. The waterborne epoxy resin composition is low in volatile organic compounds (“VOC”).
    Type: Grant
    Filed: August 10, 2018
    Date of Patent: August 27, 2019
    Assignee: Chang Chun Plastics Co., LTD.
    Inventors: Liang-Hsing Liu, Ying-Jui Lin, Yung-Sheng Lin, I-Chiang Lai, Kuen-Yuan Hwang, Yi-Sern Wong
  • Patent number: 10259970
    Abstract: The present invention is to provide polyether compounds having epoxy hydroxyl urethane group, as the following formula (I), (II) or (III) shows: and waterborne epoxy resin composition. Using the hydroxyl urethane as emulsifier, the obtained waterborne epoxy resin composition of the present invention has better stability and freeze-thaw resistance.
    Type: Grant
    Filed: April 13, 2017
    Date of Patent: April 16, 2019
    Assignee: CHANG CHUN PLASTICS CO., LTD.
    Inventors: Gai-Chi Chen, Chia-En Wu, An-Pang Tu, Kuen-Yuan Hwang
  • Patent number: 10246607
    Abstract: An epoxy resin composition comprising a blend of at least (i) at least one epoxy group containing a polycyclic group, and (ii) at least one epoxy group that is different from the epoxy resin in component (i). As exemplary of component (i) is an epoxidized tricyclo decanedimethanol. A renewable epoxy of component (ii) is cardanol epoxy, derived from cashew nut shell oil (CNSL). Optionally, a component (iii) which is any other epoxy from that of (i) and (ii) can be included, such as Bisphenol-A/F diglycidal ether. The blend is characterized by low viscosity, making it amenable to airless spray application, high solids content and excellent solvent resistance and abrasion resistance.
    Type: Grant
    Filed: July 13, 2018
    Date of Patent: April 2, 2019
    Assignee: CHANG CHUN PLASTICS CO., LTD.
    Inventors: Ying-Jui Lin, Yung-Sheng Lin, I-Chiang Lai, Kuen-Yuan Hwang, Yi-Sern Wong
  • Publication number: 20190055397
    Abstract: This disclosure relates to reactive epoxy compounds that have high water solubility. The reactive epoxy compounds are obtained by mixing an epoxy resin having at least two epoxy groups per molecule with a carboxyl group-containing compound obtained by reacting a polyetheramine comprising a primary amine and an acid anhydride derived from a polyvalent carboxylic acid. This disclosure also relates to waterborne epoxy resin composition comprising core-shell type epoxy resin particles dispersed in a solvent, wherein the particles are formed by an epoxy resin encapsulated in the reactive epoxy compounds of the present invention. The waterborne epoxy resin composition is low in volatile organic compounds (“VOC”).
    Type: Application
    Filed: August 10, 2018
    Publication date: February 21, 2019
    Inventors: Liang-Hsing LIU, Ying-Jui LIN, Yung-Sheng LIN, I-Chiang LAI, Kuen-Yuan HWANG, Yi-Sern WONG
  • Publication number: 20190023936
    Abstract: An epoxy resin composition comprising a blend of at least (i) at least one epoxy group containing a polycyclic group, and (ii) at least one epoxy group that is different from the epoxy resin in component (i). As exemplary of component (i) is an epoxidized tricyclo decanedimethanol. A renewable epoxy of component (ii) is cardanol epoxy, derived from cashew nut shell oil (CNSL). Optionally, a component (iii) which is any other epoxy from that of (i) and (ii) can be included, such as Bisphenol-A/F diglycidal ether. The blend is characterized by low viscosity, making it amenable to airless spray application, high solids content and excellent solvent resistance and abrasion resistance.
    Type: Application
    Filed: July 13, 2018
    Publication date: January 24, 2019
    Inventors: Ying-Jui LIN, Yung-Sheng LIN, I-Chiang LAI, Kuen-Yuan HWANG, Yi-Sern WONG
  • Patent number: 10138325
    Abstract: Polyphenolic condensates and epoxidized products prepared from said condensates are prepared by a reaction utilizing multi catalysts to control the weight average molecular weight (Mw) and the number average molecular weight (Mn). Improved color and ultraviolet absorbance are possessed by the condensates described herein.
    Type: Grant
    Filed: April 28, 2017
    Date of Patent: November 27, 2018
    Assignee: CHANG CHUN PLASTICS CO., LTD.
    Inventors: Yu-Jen Chen, Sung-Kuang Chung, Chang-Lin Hung, An-Pang Tu, Kuen-Yuan Hwang
  • Publication number: 20180120700
    Abstract: The present invention provides a photosensitive resin composition, comprising: (a) photo-polymerizable unsaturated compound, (b) hydroxyurethane compound, and (c) photoinitiator. The photosensitive resin composition can be used as photoresist coating for dry film photoresist to manufacture the electronic components, such as print circuit board and so on. Further, the (b) hydroxyurethane compound having [CC]/[NH2] between 0.5 and 0.9, which increases the resolution, adhesion, and stripping ability of photosensitive resin composition for dry film photoresist, and improves the effectiveness and the quality of dry film photoresist for manufacturing printed circuit board and other electric component.
    Type: Application
    Filed: October 23, 2017
    Publication date: May 3, 2018
    Inventors: Gai-Chi CHEN, Yun-Chung WU, An-Pang TU, Kuen-Yuan HWANG
  • Publication number: 20170327629
    Abstract: Polyphenolic condensates and epoxidized products prepared from said condensates are prepared by a reaction utilizing multi catalysts to control the weight average molecular weight (Mw) and the number average molecular weight (Mn). Improved color and ultraviolet absorbance are possessed by the condensates described herein.
    Type: Application
    Filed: April 28, 2017
    Publication date: November 16, 2017
    Inventors: Yu-Jen CHEN, Sung-Kuang CHUNG, Chang-Lin HUNG, An-Pang TU, Kuen-Yuan HWANG
  • Publication number: 20170321080
    Abstract: The present invention is to provide polyether compounds having epoxy hydroxyl urethane group, as the following formula (I), (II) or (III) shows: and waterborne epoxy resin composition. Using the hydroxyl urethane as emulsifier, the obtained waterborne epoxy resin composition of the present invention has better stability and freeze-thaw resistance.
    Type: Application
    Filed: April 13, 2017
    Publication date: November 9, 2017
    Inventors: Gai-Chi CHEN, Chia-En WU, An-Pang TU, Kuen-Yuan HWANG
  • Publication number: 20170101507
    Abstract: The present invention relates to a phosphinated poly(2,6-dimethy phenylene oxide)oligomer, specifically an unsaturated group-containing phosphinated poly(2,6-dimethy phenylene oxide)oligomer, and processes for producing the same. A thermoset produced from the unsaturated group-containing phosphinated poly(2,6-dimethy phenylene oxide)oligomers according to the present invention exhibits flame retardancy and has a low dielectric constant and dissipation factor and a high glass transition temperature.
    Type: Application
    Filed: October 7, 2016
    Publication date: April 13, 2017
    Applicant: Chang Chun Plastics Co., Ltd.
    Inventors: Ching Hsuan Lin, Ping-Chieh Wang, An-Pang Tu, Kuen-Yuan Hwang, Chun Yu Tseng
  • Patent number: 9605109
    Abstract: The instant disclosure relates to phosphorus-containing compounds that can be used to form flame retardant phosphorus-containing resins, and also can serve as a hardener for a flame retardant epoxy resin compositions. In particular, the phosphorus-containing compounds are modified with acyloxy groups (—O—(C?O)—R), as shown below. Incorporation of the acyloxy groups results in resins that are water resistant and exhibit improved dielectric properties.
    Type: Grant
    Filed: March 10, 2016
    Date of Patent: March 28, 2017
    Assignee: Chang Chun Plastics Co. Ltd.
    Inventors: An-Pang Tu, Szu-Fang Chen, Ping-Chieh Wang, Kuen-Yuan Hwang
  • Patent number: 9546262
    Abstract: The instant disclosure relates to phosphorus-containing compounds that can be used to form flame retardant phosphorus-containing resins, and also can serve as a hardener for a flame retardant epoxy resin compositions. In particular, the phosphorus-containing compounds are modified with acyloxy groups (—O—(C?O)—R), as shown below. Incorporation of the acyloxy groups results in resins that are water resistant and exhibit improved dielectric properties.
    Type: Grant
    Filed: November 4, 2015
    Date of Patent: January 17, 2017
    Assignee: Chang Chun Plastics Co. Ltd.
    Inventors: An-Pang Tu, Szu-Fang Chen, Ping-Chieh Wang, Kuen-Yuan Hwang