Patents by Inventor Kum-Weng Loo
Kum-Weng Loo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8338943Abstract: A semiconductor package includes a substrate, a stiffener ring coupled to the substrate and configured to form a well with the substrate, and a die positioned in the well. A thermal interface is positioned on the die. A heat spreader is coupled to the stiffener ring so that a portion of the heat spreader is positioned in the well and the thermal interface thermally couples the heat spreader to the die. The portion of the heat spreader positioned in the well adds rigidity to the semiconductor package and facilitates the use of thin dies.Type: GrantFiled: August 31, 2010Date of Patent: December 25, 2012Assignee: STMicroelectronics Asia Pacific Pte Ltd.Inventor: Kum Weng Loo
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Publication number: 20120050996Abstract: A semiconductor package includes a substrate, a stiffener ring coupled to the substrate and configured to form a well with the substrate, and a die positioned in the well. A thermal interface is positioned on the die. A heat spreader is coupled to the stiffener ring so that a portion of the heat spreader is positioned in the well and the thermal interface thermally couples the heat spreader to the die. The portion of the heat spreader positioned in the well adds rigidity to the semiconductor package and facilitates the use of thin dies.Type: ApplicationFiled: August 31, 2010Publication date: March 1, 2012Applicant: STMICROELECTRONICS ASIA PACIFIC PTE LTD.Inventor: Kum Weng Loo
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Patent number: 8013438Abstract: A semiconductor package includes a substrate board and a semiconductor die attached to a top surface of that substrate board. A heat spreader is provided over the semiconductor die. A stiffening ring is positioned surrounding the semiconductor die, the stiffening ring being attached to the top surface of the substrate board and attached to a bottom surface of the plate portion of the heat spreader. Space is left on the board outside of the stiffening ring to support the installation of passive components to the substrate board. An external ring may be included, with that external ring being interconnected to the stiffening ring by a set of tie bars. Alternatively, the heat spreader includes an integrally formed peripheral sidewall portion.Type: GrantFiled: July 21, 2009Date of Patent: September 6, 2011Assignee: STMicroelectronics Asia Pacific Pte. Ltd.Inventors: Jing-En Luan, Kum-Weng Loo
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Patent number: 7919361Abstract: The present disclosure provides a very thin semiconductor package including a leadframe with a die-attach pad and a plurality of lead terminals, a die attached to the die-attach pad and electrically connected to the lead terminals via bonding wires, a position member disposed upon the die and/or die-attach pad, and a molding material encapsulating the leadframe, the die, and the position member together to form the semiconductor package. The method for manufacturing a very thin semiconductor package includes disposing a first position member on one side of the die-attach pad of a leadframe, attaching a die onto the opposite side of the die-attach pad, optionally disposing a second position member on top of the die, electrically connecting the die to the lead terminals of the leadframe, and encapsulating the leadframe, the die, and the position member(s) together to form the very thin semiconductor package.Type: GrantFiled: May 19, 2010Date of Patent: April 5, 2011Assignee: STMicroelectronics Asia Pacific Pte. Ltd.Inventors: Kum-weng Loo, Chek-lim Kho, Jing-en Luan
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Patent number: 7880132Abstract: A camera module lens cap is provided to protect a camera module in a mobile device where the camera module is exposed. The camera module lens cap includes an optically transparent member for positioning adjacent a camera lens, and a housing for carrying the optically transparent member. The housing includes an overhanging lip for engaging a base of the camera module.Type: GrantFiled: October 15, 2007Date of Patent: February 1, 2011Assignees: STMicroelectronics (Research & Development) Limited, STMicroelectronics Pte Ltd, STMicroelectronics SAInventors: Stuart Brodie, Hazel McInnes, Kum Weng Loo, Mickael Miglietti, Eric Saugier
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Publication number: 20110018125Abstract: A semiconductor package includes a substrate board and a semiconductor die attached to a top surface of that substrate board. A heat spreader is provided over the semiconductor die. A stiffening ring is positioned surrounding the semiconductor die, the stiffening ring being attached to the top surface of the substrate board and attached to a bottom surface of the plate portion of the heat spreader. Space is left on the board outside of the stiffening ring to support the installation of passive components to the substrate board. An external ring may be included, with that external ring being interconnected to the stiffening ring by a set of tie bars. Alternatively, the heat spreader includes an integrally formed peripheral sidewall portion.Type: ApplicationFiled: July 21, 2009Publication date: January 27, 2011Applicant: STMicroelectronics Asia Pacific PTE LTD (Singapore)Inventors: Kum-Weng Loo, Jing-En Luan
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Publication number: 20110006411Abstract: A multichip integrated circuit apparatus includes first and second integrated circuit die mounted on opposite sides of a leadframe die paddle, with at least one of the integrated circuit die extending further toward the leads than does the die paddle. With this arrangement, the active circuit areas of both integrated circuit die can face in the same direction, and can be wire bonded to the same surfaces of the leads. This avoids wire bonding complications that are often encountered in multichip integrated circuit package designs.Type: ApplicationFiled: September 14, 2010Publication date: January 13, 2011Applicant: STMicroelectronics Asia Pacific Pte. Ltd.Inventors: Kum-Weng Loo, Chek-Lim Kho
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Publication number: 20100297813Abstract: The present disclosure provides a very thin semiconductor package including a leadframe with a die-attach pad and a plurality of lead terminals, a die attached to the die-attach pad and electrically connected to the lead terminals via bonding wires, a position member disposed upon the die and/or die-attach pad, and a molding material encapsulating the leadframe, the die, and the position member together to form the semiconductor package. The method for manufacturing a very thin semiconductor package includes disposing a first position member on one side of the die-attach pad of a leadframe, attaching a die onto the opposite side of the die-attach pad, optionally disposing a second position member on top of the die, electrically connecting the die to the lead terminals of the leadframe, and encapsulating the leadframe, the die, and the position member(s) together to form the very thin semiconductor package.Type: ApplicationFiled: May 19, 2010Publication date: November 25, 2010Applicant: STMICROELECTRONICS ASIA PACIFIC PTE LTDInventors: Kum-weng Loo, Chek-lim Kho, Jing-en Luan
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Patent number: 7816182Abstract: A multichip integrated circuit apparatus includes first and second integrated circuit die mounted on opposite sides of a leadframe die paddle, with at least one of the integrated circuit die extending further toward the leads than does the die paddle. With this arrangement, the active circuit areas of both integrated circuit die can face in the same direction, and can be wire bonded to the same surfaces of the leads. This avoids wire bonding complications that are often encountered in multichip integrated circuit package designs.Type: GrantFiled: November 30, 2004Date of Patent: October 19, 2010Assignee: STMicroelectronics Asia Pacific Pte. Ltd.Inventors: Kum-Weng Loo, Chek-Lim Kho
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Patent number: 7745945Abstract: The present disclosure provides a very thin semiconductor package including a leadframe with a die-attach pad and a plurality of lead terminals, a die attached to the die-attach pad and electrically connected to the lead terminals via bonding wires, a position member disposed upon the die and/or die-attach pad, and a molding material encapsulating the leadframe, the die, and the position member together to form the semiconductor package. The method for manufacturing a very thin semiconductor package includes disposing a first position member on one side of the die-attach pad of a leadframe, attaching a die onto the opposite side of the die-attach pad, optionally disposing a second position member on top of the die, electrically connecting the die to the lead terminals of the leadframe, and encapsulating the leadframe, the die, and the position member(s) together to form the very thin semiconductor package.Type: GrantFiled: October 10, 2006Date of Patent: June 29, 2010Assignee: STMicroelectronics Asia Pacific Pte. Ltd.Inventors: Kum-weng Loo, Chek-lim Kho, Jing-en Luan
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Publication number: 20090057544Abstract: A camera module lens cap is provided to protect a camera module in a mobile device where the camera module is exposed. The camera module lens cap includes an optically transparent member for positioning adjacent a camera lens, and a housing for carrying the optically transparent member. The housing includes an overhanging lip for engaging a base of the camera module.Type: ApplicationFiled: October 15, 2007Publication date: March 5, 2009Applicants: STMicroelectronics (Research & Development) Limited, STMicroelectronics Pte Ltd, STMicroelectronics SAInventors: Stuart Brodie, Hazel McInnes, Kum Weng Loo, Mickael Miglietti, Eric Saugier
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Publication number: 20070085177Abstract: The present disclosure provides a very thin semiconductor package including a leadframe with a die-attach pad and a plurality of lead terminals, a die attached to the die-attach pad and electrically connected to the lead terminals via bonding wires, a position member disposed upon the die and/or die-attach pad, and a molding material encapsulating the leadframe, the die, and the position member together to form the semiconductor package. The method for manufacturing a very thin semiconductor package includes disposing a first position member on one side of the die-attach pad of a leadframe, attaching a die onto the opposite side of the die-attach pad, optionally disposing a second position member on top of the die, electrically connecting the die to the lead terminals of the leadframe, and encapsulating the leadframe, the die, and the position member(s) together to form the very thin semiconductor package.Type: ApplicationFiled: October 10, 2006Publication date: April 19, 2007Applicant: STMICROELECTRONICS ASIA PACIFIC PTE LTDInventors: Kum-weng Loo, Chek-lim Kho, Jing-en Luan
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Patent number: 7061697Abstract: A method is described for fixing a lens of an optical group with respect to an optical sensor in an image acquisition device comprising the steps of housing the optical sensor in a housing, fixing a lower holder of the optical group to the housing, aligning an upper holder of the optical group, wherein the lens is placed, with the sensor so as to align a focusing point of the lens with respect to the sensor, welding the upper holder to the lower holder. The welding step may be performed by means of ultrasounds.Type: GrantFiled: July 19, 2004Date of Patent: June 13, 2006Assignees: STMicroelectronics SA, STMicroelectronics S.R.L.Inventors: Pierangelo Magni, Remi Brechignac, Chek Lim Kho, Kum Weng Loo
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Patent number: 7056765Abstract: A semiconductor package having a substrate; a semiconductor die attached to the substrate; a housing attached to the substrate and arranged to surround the semiconductor die; and solidified molding material arranged around the housing and adhering to the substrate to secure the housing in position on the substrate. A method of manufacturing the package is also disclosed.Type: GrantFiled: November 13, 2003Date of Patent: June 6, 2006Assignee: STMicroelectronics Asia Pacific Pte Ltd.Inventors: Kum-Weng Loo, Chek-Lim Kho
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Publication number: 20060113643Abstract: A multichip integrated circuit apparatus includes first and second integrated circuit die mounted on opposite sides of a leadframe die paddle, with at least one of the integrated circuit die extending further toward the leads than does the die paddle. With this arrangement, the active circuit areas of both integrated circuit die can face in the same direction, and can be wire bonded to the same surfaces of the leads. This avoids wire bonding complications that are often encountered in multichip integrated circuit package designs.Type: ApplicationFiled: November 30, 2004Publication date: June 1, 2006Applicant: STMicroelectronics Asia Pacific Pte. Ltd.Inventors: Kum-Weng Loo, Chek-Lim Kho
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Publication number: 20050046973Abstract: A method is described for fixing a lens of an optical group with respect to an optical sensor in an image acquisition device comprising the steps of housing the optical sensor in a housing, fixing a lower holder of the optical group to the housing, aligning an upper holder of the optical group, wherein the lens is placed, with the sensor so as to align a focusing point of the lens with respect to the sensor, welding the upper holder to the lower holder. The welding step may be performed by means of ultrasounds.Type: ApplicationFiled: July 19, 2004Publication date: March 3, 2005Inventors: Pierangelo Magni, Remi Brechignac, Chek Kho, Kum Weng Loo
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Publication number: 20040159927Abstract: A semiconductor package having a substrate; a semiconductor die attached to the substrate; a housing attached to the substrate and arranged to surround the semiconductor die; and solidified molding material arranged around the housing and adhering to the substrate to secure the housing in position on the substrate. A method of manufacturing the package is also disclosed.Type: ApplicationFiled: November 13, 2003Publication date: August 19, 2004Applicant: STMicroelectronics Asia Pacific Pte LtdInventors: Kum-Weng Loo, Chek-Lim Kho