Abstract: Embodiments of radio frequency (RF) power connection rods are provided herein. In some embodiments, an RF power connection rod includes a first connection rod having a first connection end, a first socket end opposite the first connection end, and a first hollow portion extending from the first connection end to the first socket end; a second connection rod having a second connection end, a second socket end opposite the second connection end, and a second hollow portion extending from the second connection end to the second socket end, wherein the second connection end is adjustably coupled to the first connection end along an axial direction of the second connection rod, and wherein a gas flow path extends from one or more gas inlets of the first connection rod, through the first hollow portion to the second hollow portion, to one or more gas outlets disposed through the second connection rod; a first plug coupled to the first socket end; and a second plug coupled to the second socket end.

Abstract: Disclosed herein is a temperature actuated valve, including a stationary member and a movable member, wherein the stationary member is configured to receive the movable member. A first flow path is defined between an outer surface of the stationary member and an inner surface of a housing and a second flow path defined by and within the movable member. The temperature actuated valve further includes at least one temperature actuated member having a first end seated against a base of the stationary member and a second end seated against a base of the movable member. The temperature actuated valve further includes a bias member having a first end connected to the base of the stationary member and a second end connected to the base of the movable member, the at least one temperature actuated member configured to compress at a first temperature and expand at a second temperature.

Abstract: A cooling system includes a coolant source to cool down components of a processing chamber and a return line for the coolant coupled between the processing chamber and the coolant source. The return line has a valve, which includes a flow compartment having a first inlet and an outlet that support a default flow rate of the coolant, the flow compartment also having a second inlet. The valve has a plunger with a tip to variably open and close the second inlet to vary a flow rate of the coolant from the default flow rate. The valve has a shape memory alloy (SMA) spring positioned on the plunger between a side of the valve and the tip, the SMA spring attached to the tip to variably withdraw the tip from the second inlet in response to a rise in temperature of the coolant above a threshold temperature value.

Abstract: In embodiments, systems and apparatus comprise a bracket having a through hole configured to receive a first connector connected to a panel spaced from the bracket, the bracket movable between first and second positions; a switch mountable on the panel, the switch having first and second switch positions; and at least one compression spring extending from the bracket to bias the bracket into the first position spaced away from the switch. When the bracket is in the first position, the switch is in the first switch position, and when the bracket is in the second position, the bracket engages and actuates the switch into the second switch position. The bracket is movable into the second position to engage and actuate the switch by coupling a second connector to the first connector. The switch is configured to trigger a signal indicating that the first connector is connected to the second connector.

Abstract: A cooling system includes a coolant source to cool down components of a processing chamber and a return line for the coolant coupled between the processing chamber and the coolant source. The return line has a valve, which includes a flow compartment having a first inlet and an outlet that support a default flow rate of the coolant, the flow compartment also having a second inlet. The valve has a plunger with a tip to variably open and close the second inlet to vary a flow rate of the coolant from the default flow rate. The valve has a shape memory alloy (SMA) spring positioned on the plunger between a side of the valve and the tip, the SMA spring attached to the tip to variably withdraw the tip from the second inlet in response to a rise in temperature of the coolant above a threshold temperature value.

Abstract: Disclosed herein is a temperature actuated valve, including a stationary member and a movable member, wherein the stationary member is configured to receive the movable member. A first flow path is defined between an outer surface of the stationary member and an inner surface of a housing and a second flow path defined by and within the movable member. The temperature actuated valve further includes at least one temperature actuated member having a first end seated against a base of the stationary member and a second end seated against a base of the movable member. The temperature actuated valve further includes a bias member having a first end connected to the base of the stationary member and a second end connected to the base of the movable member, the at least one temperature actuated member configured to compress at a first temperature and expand at a second temperature.

Abstract: A valve includes a first inline compartment to attach to a first return line exiting a processing chamber and a second inline compartment to attach to a second return line entering a coolant source. A flow compartment is attached between the first inline compartment and the second inline compartment and through which a coolant is to return to the coolant source. A first inlet orifice and a second inlet orifice positioned between the first inline compartment and the flow compartment. A plunger has a tip to variably open and close the second inlet orifice. A shape memory alloy (SMA) spring is positioned on the plunger and attached to the tip, the SMA spring to variably increase or decrease a flow rate of the coolant through the second inlet orifice according to a temperature of the coolant.

Abstract: Embodiments of the present disclosure relate to a substrate transfer device having a contactless latch and contactless coupling providing the ability to lock and unlock the substrate transfer device at atmospheric and vacuum pressure with without particle generation at a base of the substrate transfer device, the contactless latch, and the contactless coupling. The substrate transfer device includes a lid having one or more lid grooves, a base having one or more base grooves, and a rotation member rotatably coupled to the lid. Each flange of one or more flanges of the substrate transfer device is rotatable in aligned lid grooves and base grooves, and each flange of the one or more flanges has an arm with a ferromagnetic material coupled thereto. The base is coupled to the lid when the ferromagnetic material of the arm is aligned and spaced from a magnetic material of a slot of the one or more base grooves.

Abstract: A valve includes a first inline compartment to attach to a first return line exiting a processing chamber and a second inline compartment to attach to a second return line entering a coolant source. A flow compartment is attached between the first inline compartment and the second inline compartment and through which a coolant is to return to the coolant source. A first inlet orifice and a second inlet orifice positioned between the first inline compartment and the flow compartment. A plunger has a tip to variably open and close the second inlet orifice. A shape memory alloy (SMA) spring is positioned on the plunger and attached to the tip, the SMA spring to variably increase or decrease a flow rate of the coolant through the second inlet orifice according to a temperature of the coolant.

Abstract: Embodiments of the present disclosure relate to a substrate transfer device having a contactless latch and contactless coupling providing the ability to lock and unlock the substrate transfer device at atmospheric and vacuum pressure with without particle generation at a base of the substrate transfer device, the contactless latch, and the contactless coupling. The substrate transfer device includes a lid having one or more lid grooves, a base having one or more base grooves, and a rotation member rotatably coupled to the lid. Each flange of one or more flanges of the substrate transfer device is rotatable in aligned lid grooves and base grooves, and each flange of the one or more flanges has an arm with a ferromagnetic material coupled thereto. The base is coupled to the lid when the ferromagnetic material of the arm is aligned and spaced from a magnetic material of a slot of the one or more base grooves.