Abstract: A filling pipe for use in high-temperature heat pipe filling operation includes an alkali metal filling unit, metallic pipe fixing unit, hermetic seal cover and stopping net. The alkali metal filling unit has a filling body, a receiving space disposed in the filling body. A feed inlet and a feeding pipe are disposed at the top and bottom of the filling body, respectively. A vacuum-generating component is disposed at the filling body laterally. The metallic pipe fixing unit has a fixing body and a taper opening disposed thereon and adapted to limit the metallic pipe. When the fixing body gets connected to the filling body, the feeding pipe is inserted into metallic pipe. The hermetic seal cover covers separably the feed inlet. The stopping net is movably disposed in the receiving space. Therefore, solid alkali metals are filled into a metallic pipe easily and safely.

Abstract: A filling pipe for use in high-temperature heat pipe filling operation includes an alkali metal filling unit, metallic pipe fixing unit, hermetic seal cover and stopping net. The alkali metal filling unit has a filling body, a receiving space disposed in the filling body. A feed inlet and a feeding pipe are disposed at the top and bottom of the filling body, respectively. A vacuum-generating component is disposed at the filling body laterally. The metallic pipe fixing unit has a fixing body and a taper opening disposed thereon and adapted to limit the metallic pipe. When the fixing body gets connected to the filling body, the feeding pipe is inserted into metallic pipe. The hermetic seal cover covers separably the feed inlet. The stopping net is movably disposed in the receiving space. Therefore, solid alkali metals are filled into a metallic pipe easily and safely.

Abstract: A LED lamp includes: a plurality of substrates juxtapositionally formed as multiple layers, each substrate having a plurality of light emitting diodes (LEDs) mounted thereon, whereby upon generation of heat by the LEDs when lit up, each substrate will form as a heat-dissipating plate in-situ in order that the multiple-layer substrates will instantly effectively dissipate the heat produced from the LEDs of the lamp outwardly for preventing deterioration of the illumination quality of the LED lamp.

Abstract: A high power light emitting diode (LED) lighting assembly incorporated with heat dissipation module is provided. The LED lighting assembly includes a heat exchange base, at least one LED array, at least one heat pipe and a heat dissipation module. The heat exchange base includes at least one LED configuration plan for mounting of the LED array and at least a hollow part for insertion of the heat pipe. The LED array is arranged at a predetermined projecting angle at the LED configuration plane. The heat pipe includes a heated section, a cooling section and a conducting section, and contains a working fluid therein. The heat exchange base is mounted to the heated section and the heat dissipation module is mounted to the cooling section.

Abstract: A LED lamp includes: a plurality of substrates juxtapositionally formed as multiple layers, each substrate having a plurality of light emitting diodes (LEDs) mounted thereon, whereby upon generation of heat by the LEDs when lit up, each substrate will form as a heat-dissipating plate in-situ in order that the multiple-layer substrates will instantly effectively dissipate the heat produced from the LEDs of the lamp outwardly for preventing deterioration of the illumination quality of the LED lamp.

Abstract: A high power light emitting diode (LED) lighting assembly incorporated with heat dissipation module is provided. The LED lighting assembly includes a heat exchange base, at least one LED array, at least one heat pipe and a heat dissipation module. The heat exchange base includes at least one LED configuration plan for mounting of the LED array and at least a hollow part for insertion of the heat pipe. The LED array is arranged at a predetermined projecting angle at the LED configuration plane. The heat pipe includes a heated section, a cooling section and a conducting section, and contains a working fluid therein. The heat exchange base is mounted to the heated section and the heat dissipation module is mounted to the cooling section.